JPH02298572A - Epoxy resin adhesive composition - Google Patents
Epoxy resin adhesive compositionInfo
- Publication number
- JPH02298572A JPH02298572A JP11852889A JP11852889A JPH02298572A JP H02298572 A JPH02298572 A JP H02298572A JP 11852889 A JP11852889 A JP 11852889A JP 11852889 A JP11852889 A JP 11852889A JP H02298572 A JPH02298572 A JP H02298572A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- adhesive composition
- adhesive
- resin adhesive
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 29
- 239000000203 mixture Substances 0.000 title claims abstract description 21
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 7
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims abstract description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 3
- 229920001971 elastomer Polymers 0.000 claims abstract description 3
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- 150000004985 diamines Chemical class 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 230000032683 aging Effects 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000007774 longterm Effects 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、剥離接着力（被接着物からの接着剤の剥れに
くさ）に優れたエポキシ樹脂接着剤組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an epoxy resin adhesive composition with excellent peel adhesion strength (difficulty in peeling off the adhesive from an adhered object).
従来、剥離接着力を高めるために、エポキシ系接着剤に
おいては、ニトリルゴム等のポリマーを配合するか又は
カルボキシル基を分子末端に有するブタジェンアクリロ
ニトリル共重合ゴム（以下、ＣＴＢＮという）で変性し
たエポキシ樹脂やＣＴＢＮとブレンドしたエポキシ樹脂
などを配合していた。しかし、このような接着剤は、耐
熱老化性（長期の熱老化後の剥離接着力）に劣っていた
。Conventionally, in order to increase peel adhesion, epoxy adhesives have been mixed with polymers such as nitrile rubber, or epoxy modified with butadiene acrylonitrile copolymer rubber (hereinafter referred to as CTBN) having a carboxyl group at the molecular end. It contained epoxy resin blended with resin and CTBN. However, such adhesives have poor heat aging resistance (peel adhesion strength after long-term heat aging).
本発明は、初期剥離接着力ばかりでなく長期の熱老化後
の剥離接着力に優れたエポキシ樹脂接着剤組成物を提供
することを目的とする。An object of the present invention is to provide an epoxy resin adhesive composition that is excellent not only in initial peel adhesive strength but also in peel adhesive strength after long-term heat aging.
本発明は、ＣＴＢＮ変性エポキシ樹脂に対し、下記式（
１）を有する化合物を配合してなるエポキシ樹脂接着剤
組成物を要旨とする。この式（１）において、Ｒ１％
Ｒ２、Ｒ３、Ｒ４のうち少くとも１個が炭素数１〜３の
アルキル基で残りはＩＩである。The present invention provides CTBN-modified epoxy resin with the following formula (
The gist of the present invention is an epoxy resin adhesive composition containing a compound having 1). In this formula (1), R1%
At least one of R2, R3, and R4 is an alkyl group having 1 to 3 carbon atoms, and the rest are II.
以下、この手段につき詳しく説明する。This means will be explained in detail below.
本発明で用いるＣＴＢＮ変性エポキシ樹脂は、ＣＴＢＮ
で変性したエポキシ樹脂であって、その変性度が５重量
％〜５０重量％程度のものである。この場合の変性は常
法によって行えばよい。ここでＣＴＢＮは、公知の化合
物であって分子量数千の液状界である。The CTBN-modified epoxy resin used in the present invention is CTBN
This is an epoxy resin modified with a degree of modification of about 5% to 50% by weight. Modification in this case may be carried out by a conventional method. Here, CTBN is a known compound and is a liquid substance with a molecular weight of several thousand.
前記式（１）を有する化合物もまた、公知のものである
。この化合物において、Ｒ８、Ｒ２、Ｒ３、Ｒ４のうち
少くとも１個が炭素数１〜３のアルキル基でなければな
らない。炭素数４個以上のアルキル基の場合には、得ら
れる組成物では硬化反応が遅くなり好ましくない。また
、＋７．、 Ｒ２、Ｒ３、Ｒ４の全てがＨの場合には、
熱老化につれて剥離接着力が急激に低下してしまう。し
たがって、Ｒ１、Ｒ２、Ｒ３、Ｒ４のうち、すくなくと
も１個がアｒ ）Ｉｙキ″基でなけれ
ばならないが・好ましくは・２個以上であり、４個共に
アルキル基の方が更に好ましい。Compounds having the above formula (1) are also known. In this compound, at least one of R8, R2, R3, and R4 must be an alkyl group having 1 to 3 carbon atoms. In the case of an alkyl group having 4 or more carbon atoms, the curing reaction in the resulting composition is undesirably slow. Also, +7. , when all of R2, R3, and R4 are H,
Peel adhesion strength decreases rapidly with heat aging. Therefore, at least one of R1, R2, R3, and R4 must be an Ar2)Iy group, preferably two or more, and it is more preferable that all four are alkyl groups.
本発明のエポキシ樹脂接着剤組成物は、上述したＣＴＢ
Ｎ変性エポキシ樹脂に対し前記式（１）を有する化合物
を配合してなるものであるが、必要に応じて充填剤、着
色剤、カップリング剤等の他の添加剤を含有してもよい
。配合割合としては、ＣＴＢＮ変性エポキシ樹脂１００
重量部に対し、前記式（１）を有する化合物５重量部〜
３５重量部であるとよい。このようにしてなる本発明の
組成物は、銅箔に対する接着剤として好適に使用され、
特に、金属ベース銅張板の接着剤として好適に使用され
る。The epoxy resin adhesive composition of the present invention has the above-mentioned CTB
Although the compound having formula (1) is blended with the N-modified epoxy resin, other additives such as a filler, a coloring agent, a coupling agent, etc. may be included as necessary. The blending ratio is 100% CTBN modified epoxy resin.
5 parts by weight of the compound having the formula (1) based on parts by weight
The amount is preferably 35 parts by weight. The composition of the present invention thus formed is suitably used as an adhesive for copper foil,
In particular, it is suitably used as an adhesive for metal-based copper-clad boards.
以下に実施例を示す。Examples are shown below.
第１表に記載の配合内容（重量部）の接着剤組成物を用
いて下記の２種類の金属ベース銅張板（Ａ、Ｂ）を作製
し、これらの銅張板について下記の方法により剥離接着
力（初期接着力、および１５０°Ｃ１１８０℃における
耐熱老化後の接着力保持率）を評価した。これらの結果
を第１表に示す。The following two types of metal-based copper clad boards (A, B) were prepared using the adhesive composition with the formulation content (parts by weight) listed in Table 1, and these copper clad boards were peeled by the following method. Adhesive strength (initial adhesive strength and adhesive strength retention after heat aging at 150°C and 1180°C) was evaluated. These results are shown in Table 1.
■ 金属ベース銅張板Ａ０
第１図に示すように厚さ２龍のアルミ板１の上に接着剤
組成物２を７０μの厚さで塗布し、この上に厚さ３５μ
の電解銅箔３を配置し、１７５°Ｃの温度で２時間プレ
スして接着剤組成物２を硬化させ、アルミ板１と電解銅
箔３とを接着剤組成物２を介して接着させることにより
作製した。■ Metal-based copper clad board A0 As shown in Figure 1, adhesive composition 2 is applied to a thickness of 70 μm on an aluminum plate 1 with a thickness of 2×, and a layer of 35 μm thick is applied on top of this.
The electrolytic copper foil 3 is placed and pressed at a temperature of 175° C. for 2 hours to cure the adhesive composition 2, and the aluminum plate 1 and the electrolytic copper foil 3 are bonded via the adhesive composition 2. It was made by
■ 金属ベース銅張板Ｂ０
第２図に示すように厚さ２龍のアルミ板１の上に接着剤
組成物２を２０μの厚さで塗布し、この上に厚さ２５μ
のポリイミドフィルム４をのせ、この上に接着剤組成物
２を２０μの厚さで塗布し、さらにこの上に厚さ３５μ
の電解銅箔３を配置し、１７５℃の温度で２時間プレス
して接着剤組成物２を硬化させることにより作製した。■ Metal-based copper clad board B0 As shown in Figure 2, adhesive composition 2 is applied to a thickness of 20μ on an aluminum plate 1 with a thickness of 2.
A polyimide film 4 is placed on the polyimide film 4, and the adhesive composition 2 is applied thereon to a thickness of 20 μm, and then a 35 μm thick polyimide film 4 is applied thereon.
The electrodeposited copper foil 3 was placed thereon, and the adhesive composition 2 was cured by pressing at a temperature of 175° C. for 2 hours.
１．１ の１・・ 法：
剥離接着力は、銅張板を水平に置き、ｌ ｃｍ幅の銅箔
を垂直に引張る９０度剥離試験法で評価した。また、耐
熱老化後の接着力保持率は、銅張板を１５０℃及び１８
０°Ｃのオーブンに入れ、経過時間毎にとり出し、常温
で剥離接着力の評価を行い、熱老化時間に対する接着剤
保持率（被接着物への接着剤組成物の残存割合）で評価
した。1.1-1 Method: Peel adhesion strength was evaluated by a 90 degree peel test method in which a copper clad plate was placed horizontally and a 1 cm wide copper foil was pulled vertically. In addition, the adhesive strength retention rate after heat aging is 150°C and 18°C.
The sample was placed in an oven at 0°C, taken out every elapsed time, and evaluated for peel adhesion at room temperature.The adhesive retention rate (remaining percentage of the adhesive composition on the adhered object) with respect to heat aging time was evaluated.
（来貢以下余白）
第１表から、本発明の組成物（実施例１〜４）が初期接
着力ばかりでなく長期の熱老化後の接着力において優れ
ていることが判る。(Leaving space below) Table 1 shows that the compositions of the present invention (Examples 1 to 4) are excellent not only in initial adhesive strength but also in adhesive strength after long-term heat aging.
以上説明したように本発明によれば、ＣＴＢＮ変性エポ
キシ樹脂に対し、前記式（１）を有する化合物を配合し
たために下記の効果を奏することができる。As explained above, according to the present invention, since the compound having the formula (1) is blended into the CTBN-modified epoxy resin, the following effects can be achieved.
■ 初期剥離接着力に優れる。■ Excellent initial peel adhesion.
■ 熱老化後の剥離接着力に優れる。■Excellent peel adhesion after heat aging.
■ 特に、銅箔／ポリイミドフィルムのようにポリイミ
ドフィルムの存在する系では、前記式（１）においてＲ
１、Ｒ２、Ｒ３、Ｒ４が全てアルキル基の場合には、い
っそう熱老化後の剥離力に優れる。■ In particular, in systems where polyimide film exists, such as copper foil/polyimide film, R
When 1, R2, R3, and R4 are all alkyl groups, the peeling force after heat aging is even more excellent.
■ このため、耐熱老化性が必要な銅張板（例えば、金
属ベース銅張板）などのような電気材料等のために有用
である。(2) Therefore, it is useful for electrical materials such as copper clad boards (for example, metal-based copper clad boards) that require heat aging resistance.
第１図および第２図はそれぞれ金属ベース銅張板の一例
の断面説明図である。
■・・・アルミ板、２・・・接着剤組成物、３・・・電
解銅箔、４・・・ポリイミドフィルム。FIGS. 1 and 2 are explanatory cross-sectional views of an example of a metal-based copper-clad board, respectively. ■... Aluminum plate, 2... Adhesive composition, 3... Electrolytic copper foil, 4... Polyimide film.
Claims (1)
ニトリル共重合ゴムで変性したエポキシ樹脂に対し、下
記式を有する化合物を配合してなるエポキシ樹脂接着剤
組成物。 ▲数式、化学式、表等があります▼ 式中、Ｒ＿１、Ｒ＿２、Ｒ＿３、Ｒ＿４のうち少くとも
１個が炭素数１〜３のアルキル基で残りはＨである。[Scope of Claims] An epoxy resin adhesive composition prepared by blending a compound having the following formula with an epoxy resin modified with a butadiene acrylonitrile copolymer rubber having a carboxyl group at the end of the molecule. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ In the formula, at least one of R_1, R_2, R_3, and R_4 is an alkyl group having 1 to 3 carbon atoms, and the rest are H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1118528A JP2799873B2 (en) | 1989-05-15 | 1989-05-15 | Epoxy resin adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1118528A JP2799873B2 (en) | 1989-05-15 | 1989-05-15 | Epoxy resin adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02298572A true JPH02298572A (en) | 1990-12-10 |
| JP2799873B2 JP2799873B2 (en) | 1998-09-21 |
Family
ID=14738833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1118528A Expired - Lifetime JP2799873B2 (en) | 1989-05-15 | 1989-05-15 | Epoxy resin adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2799873B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08102134A (en) * | 1994-09-27 | 1996-04-16 | Internatl Business Mach Corp <Ibm> | Equipment and method of controlling speed of motor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163926A (en) * | 1985-01-17 | 1986-07-24 | Yokohama Rubber Co Ltd:The | Epoxy resin composition |
| JPH01284578A (en) * | 1988-05-11 | 1989-11-15 | Nippon Kayaku Co Ltd | Adhesive composition for superconducting coil |
-
1989
- 1989-05-15 JP JP1118528A patent/JP2799873B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163926A (en) * | 1985-01-17 | 1986-07-24 | Yokohama Rubber Co Ltd:The | Epoxy resin composition |
| JPH01284578A (en) * | 1988-05-11 | 1989-11-15 | Nippon Kayaku Co Ltd | Adhesive composition for superconducting coil |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08102134A (en) * | 1994-09-27 | 1996-04-16 | Internatl Business Mach Corp <Ibm> | Equipment and method of controlling speed of motor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2799873B2 (en) | 1998-09-21 |
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