JPS63122773A - Adhesive composition for flexible printed circuit board - Google Patents
Adhesive composition for flexible printed circuit boardInfo
- Publication number
- JPS63122773A JPS63122773A JP26805286A JP26805286A JPS63122773A JP S63122773 A JPS63122773 A JP S63122773A JP 26805286 A JP26805286 A JP 26805286A JP 26805286 A JP26805286 A JP 26805286A JP S63122773 A JPS63122773 A JP S63122773A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- acrylic ester
- epoxy resin
- ester copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 24
- 239000000853 adhesive Substances 0.000 title claims description 34
- 230000001070 adhesive effect Effects 0.000 title claims description 34
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 229920001665 Poly-4-vinylphenol Polymers 0.000 claims abstract description 10
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000005011 phenolic resin Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- -1 acrylic ester Chemical class 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 239000002904 solvent Substances 0.000 abstract description 12
- 238000005476 soldering Methods 0.000 abstract description 7
- 125000005396 acrylic acid ester group Chemical group 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、接着性、耐溶剤性に優れ、かつ耐熱劣化性お
よび半田耐熱性に優れたフレキシブル印刷配線板用接着
剤組成物に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an adhesive composition for flexible printed wiring boards that has excellent adhesiveness and solvent resistance, as well as heat deterioration resistance and soldering heat resistance. be.
［従来の技術］
フレキシブル印刷配線板（以下ＦＰＣと省略する）は、
銅箔などの金属箔を可撓性のある絶縁基剤の片面あるい
は両面に、接着剤を介して、貼り合わせた構造を有して
いる。[Prior Art] A flexible printed circuit board (hereinafter abbreviated as FPC) is
It has a structure in which metal foil such as copper foil is bonded to one or both sides of a flexible insulating base via an adhesive.
近年、ＦＰＣの需要が一段と増加するにつれ、該ＦＰＣ
用接着剤に要求される特性（機械的特性、耐熱性、電気
特性、耐薬品性）も厳しいものとなってきている。In recent years, as the demand for FPC has increased further,
The properties required for adhesives (mechanical properties, heat resistance, electrical properties, chemical resistance) are also becoming stricter.
特に、ＦＰＣ用接着剤に要求される耐熱性は、従来から
要求されている半田耐熱性のみならず、長時間高温雰囲
気下で使用される場合の耐熱劣化性も重要な特性となっ
てきている。In particular, the heat resistance required for FPC adhesives is not only the conventionally required soldering heat resistance, but also heat deterioration resistance when used in high-temperature atmospheres for long periods of time. .
従来、ＦＰＣ用接着剤としては、各種ゴム系、ウレタン
系、アクリル系、エポキシ系組成物が用いられている。Conventionally, various rubber-based, urethane-based, acrylic-based, and epoxy-based compositions have been used as adhesives for FPC.
［発明が解決しようとする問題点］
しかし、従来から知られている各種ゴム系、ウレタン系
、アクリル系、エポキシ系組成物を用いた接着剤は、金
属箔（あるいは、適当な表面処理を施した金属箔）との
接着力は高いが、絶縁基剤、中でも、ボイリミドフイル
ムとの接着性が低かった。[Problems to be solved by the invention] However, conventionally known adhesives using various rubber-based, urethane-based, acrylic-based, and epoxy-based compositions cannot be used with metal foil (or with appropriate surface treatment). The adhesion was high with insulating base materials, especially boilimide film.
また、現在ＦＰＣ用接着剤として広く用いられているエ
ポキシ系接着剤の場合、高極性ゴムあるいは反応性希釈
剤等の可撓性付与剤の添加が、ポリイミドとの接着性を
付与するために、ある程度効果的である。しかし、これ
ら添加剤によって、接着剤の耐熱性（半田耐熱、耐熱劣
化性）および耐薬品性が低下するという問題があった。In addition, in the case of epoxy adhesives that are currently widely used as adhesives for FPCs, the addition of flexibility imparting agents such as highly polar rubber or reactive diluents provides adhesiveness with polyimide. It is effective to some extent. However, there is a problem in that these additives reduce the heat resistance (soldering heat resistance, heat deterioration resistance) and chemical resistance of the adhesive.
また、ＣＮ基を含有する熱硬化型アクリル樹脂はポリイ
ミドフィルムとの接着性に優れる、反面、単独では耐熱
性、耐薬品性に劣る。そのため、樹脂内に含まれるＯＨ
基、Ｃ０ＯＨ基を架橋点とする架橋剤（メラミン樹脂、
イソシアネート、フェノール樹脂等）をブレンドしてい
る。しかし、該ブレンド系においても、ＦＰＣ用接着剤
に要求される諸特性をすべてバランス良く付与させるこ
とは困難であり、また耐熱劣化性についても充分なもの
は得られていない。Further, a thermosetting acrylic resin containing a CN group has excellent adhesiveness with a polyimide film, but on the other hand, when used alone, it has poor heat resistance and chemical resistance. Therefore, the OH contained in the resin
group, a crosslinking agent with C0OH group as a crosslinking point (melamine resin,
isocyanate, phenolic resin, etc.). However, even in this blend system, it is difficult to provide all the various properties required of an FPC adhesive in a well-balanced manner, and sufficient heat deterioration resistance has not been obtained.
また、熱硬化型アクリル樹脂系接着剤は、ポリイミドフ
ィルム等のプラスチックフィルムに対する接着性は良好
であるが、半田耐熱性、耐溶剤性に劣るという欠点があ
る。Furthermore, although thermosetting acrylic resin adhesives have good adhesion to plastic films such as polyimide films, they have the disadvantage of poor solder heat resistance and solvent resistance.
［問題点を解決するための手段］
本発明者は、上記のような問題点を改良すべき鋭意研究
を行なった結果、アクリル酸エステル共重合体、エポキ
シ樹脂およびポリビニルフェノール樹脂とを混和して得
られたフレキシブル印刷配線板用接着剤組成物が耐熱劣
化性の点で良好であること、およびアクリル酸エステル
共重合体、エポキシ樹脂を選定し、さらに配合比を選定
することにより、耐熱劣化性を損なうことな（ＦＰＣ用
接着剤の要求特性をすべて満足する従来に見られない極
めて特徴のあるフレキシブル印刷配線板用接着剤組成物
の得られることを見い出し本発明に到達したものである
。[Means for Solving the Problems] As a result of intensive research to improve the above-mentioned problems, the inventor of the present invention has developed a solution by mixing an acrylic ester copolymer, an epoxy resin, and a polyvinylphenol resin. The obtained adhesive composition for flexible printed wiring boards has good heat deterioration resistance, and by selecting the acrylic acid ester copolymer and epoxy resin, and further selecting the blending ratio, the heat deterioration resistance is improved. The present invention was achieved by discovering that it is possible to obtain an adhesive composition for flexible printed wiring boards that has extremely unique characteristics that have not been seen in the past and satisfies all of the required characteristics of adhesives for FPC without impairing the properties of FPC adhesives.
すなわち、本発明はアクリル酸エステル共重合体、エポ
キシ樹脂およびポリビニルフェノール樹脂よりなるフレ
キシブル印刷配線板用接着剤組成物である。That is, the present invention is an adhesive composition for a flexible printed wiring board comprising an acrylic ester copolymer, an epoxy resin, and a polyvinylphenol resin.
そして、前記アクリル酸エステル共重合体は、アクリル
酸エステル、アクリロニトリルおよびメタクリル酸を共
重合したものであり、アクリル酸エステルおよびアクリ
ロニトリルおよびメタクリル酸の割合がそれらの総重量
に対して、それぞれ６０〜９０重量％、１０〜５０重量
％および２〜１０重量％の範囲にあり、
前記エポキシ樹脂は１分子内に２個以上のエポキシ基を
有する溶剤可溶性のものであり、前記アクリル酸エステ
ル共重合体１００重量部に対し、前記エポキシ樹脂を２
５〜２５０重二部、前重量リビニルフェノール樹脂を１
０〜１００重量部の割合で混合したことを特徴とする。The acrylic ester copolymer is a copolymer of acrylic ester, acrylonitrile, and methacrylic acid, and the proportions of the acrylic ester, acrylonitrile, and methacrylic acid are 60 to 90, respectively, relative to their total weight. The epoxy resin is a solvent-soluble one having two or more epoxy groups in one molecule, and the acrylic acid ester copolymer 100 2 parts by weight of the epoxy resin
5 to 250 parts by weight, 1 part by weight of ribinyl phenol resin
It is characterized by being mixed in a proportion of 0 to 100 parts by weight.
本発明に用いられるアリクル酸エステル共重合体のアク
リロニトリル量は１０〜５０重量％とすることが必要で
ある。１（ｌｆ１％以下ではプラスチックフィルムに対
する接着強度および耐熱性に低下を来たす。５０重量％
を超えると溶剤に対する溶解性が低下し、接着剤化が困
難となる。The amount of acrylonitrile in the allicrylic acid ester copolymer used in the present invention needs to be 10 to 50% by weight. 1 (if less than 1%, the adhesive strength and heat resistance to plastic film will decrease. 50% by weight)
If it exceeds this amount, the solubility in solvents will decrease, making it difficult to form into an adhesive.
アクリル酸エステルには、アクリル酸メチル、アクリル
酸エチル、アクリル酸ブチル、アクリル酸２−エチルヘ
キシル、メタクリル酸メチル、メタクリル酸エチル、メ
タクリル酸ブチル、メタクリル酸２−エチルヘキシル等
が好ましく用いられる。As the acrylic ester, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, etc. are preferably used.
アクリル酸エステル共重合体のメタクリル酸量は２〜１
０重量％とすることが必要である。２重量％以下では耐
熱性に低下を来たし、１０重量％を超えると保存安定性
の低下を来たす。The amount of methacrylic acid in the acrylic acid ester copolymer is 2 to 1
It is necessary to set it to 0% by weight. If it is less than 2% by weight, heat resistance will decrease, and if it exceeds 10% by weight, storage stability will decrease.
１分子内に２個以上のエポキシ基を有する溶剤可溶性の
エポキシ樹脂としては、ビスフェノールＡ型エポキシ樹
脂およびビスフェノールＦ型エポキシ樹脂、フェノール
ノボラック型エポキシ樹脂、オルトクレゾールノボラッ
ク型エポキシ樹脂等の汎用エポキシ樹脂、あるいはウレ
タン変性エポキシ樹脂、ダイマー酸型エポキシ樹脂等の
変性エポキシ樹脂を単独あるいは前記汎用エポキシ樹脂
とのブレンドにより使用できる。Examples of solvent-soluble epoxy resins having two or more epoxy groups in one molecule include general-purpose epoxy resins such as bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolak epoxy resins, ortho-cresol novolak epoxy resins, Alternatively, modified epoxy resins such as urethane modified epoxy resins and dimer acid type epoxy resins can be used alone or in a blend with the general-purpose epoxy resins.
１分子内にエポキシ基が１個しか有しないエポキシ樹脂
を用いると、接着力が低下する。また溶剤可溶性のエポ
キシ樹脂を選定したのは、アクリル酸エステル樹脂との
混和性を改良させるためである。If an epoxy resin having only one epoxy group in one molecule is used, the adhesive strength will be reduced. Moreover, the reason why a solvent-soluble epoxy resin was selected is to improve the miscibility with the acrylic acid ester resin.
ポリビニルフェノール樹脂は硬化剤として用いられ、次
に示す構造式を存するものである。Polyvinylphenol resin is used as a curing agent and has the structural formula shown below.
０’Ａ
ポリビニルフェノール樹脂は溶剤（ＭＥＫ、トルエン等
）に可溶であれば、分子量は問わない。0'A The molecular weight of the polyvinylphenol resin does not matter as long as it is soluble in a solvent (MEK, toluene, etc.).
また、本発明に係る接着剤組成物に、三級アミン類（ベ
ンジルジメチルアミン、トリス（ジメチルアミノメチル
）フェノール等）、イミダゾール類（２−エチル４−メ
チルイミダゾール、２−メチルイミダゾール、１−シア
ノエチル−２−ウンデシルイミダゾール）、ルイス酸類
（ＢＦ、・モノエチルアミン等）等の硬化促進剤を添加
することは好ましい。Further, the adhesive composition according to the present invention may include tertiary amines (benzyldimethylamine, tris(dimethylaminomethyl)phenol, etc.), imidazoles (2-ethyl 4-methylimidazole, 2-methylimidazole, 1-cyanoethyl It is preferable to add a curing accelerator such as -2-undecylimidazole) and Lewis acids (BF, monoethylamine, etc.).
本発明のフレキシブル印刷配線板用接着剤組成物は、こ
れらアクリル酸エステル共重合体（Ａ）、エポキシ樹脂
（Ｂ）およびポリビニルフェノール樹脂（Ｃ）とよりな
る混合物である。しかし、（Ａ）１００重量部に対し、
（Ｂ）を２５〜２５０重量部、（Ｃ）を１０〜１００重
量部の割合で混合することが必要である。（Ｂ）が２５
ｆｆｌ量部以下では耐熱性が低下し、２５０重量部を超
えると可撓性および接着力が低下し、ＦＰＣ用接着接着
剤ては使用できない。（Ｃ）が１０重量部以下では、耐
熱性が低下し、１００重量部を超えると接着力の低下を
来たす。The adhesive composition for flexible printed wiring boards of the present invention is a mixture consisting of these acrylic ester copolymers (A), epoxy resins (B), and polyvinylphenol resins (C). However, for 100 parts by weight of (A),
It is necessary to mix 25 to 250 parts by weight of (B) and 10 to 100 parts by weight of (C). (B) is 25
If the amount is less than 250 parts by weight, the heat resistance will decrease, and if it exceeds 250 parts by weight, the flexibility and adhesive strength will decrease, and it cannot be used as an adhesive for FPC. If (C) is less than 10 parts by weight, heat resistance will decrease, and if it exceeds 100 parts by weight, adhesive strength will decrease.
［作用］
アクリル酸エステル共重合体とエポキシ樹脂は、極端に
異なった性質を持ち相溶性に乏しいので、通常２層に分
離する。しかし、本発明におけるアクリル酸エステル樹
脂中にはカルボキシル基が存在するので、該カルボキシ
ル基とエポキシ基が反応し、反応性ブレンド物となる。[Function] Since the acrylic ester copolymer and the epoxy resin have extremely different properties and poor compatibility, they are usually separated into two layers. However, since carboxyl groups are present in the acrylic ester resin of the present invention, the carboxyl groups and epoxy groups react to form a reactive blend.
また、本発明に用いるエポキシ樹脂は溶剤可溶性である
ので、相溶性が改善される。その結果、アクリル酸エス
テル共重合体の持つ可撓性、高接着性に、エポキシ樹脂
の持つ耐熱性、耐溶剤性が加わったブレンド物ができる
。Furthermore, since the epoxy resin used in the present invention is solvent soluble, compatibility is improved. As a result, a blend is produced that combines the flexibility and high adhesiveness of the acrylic ester copolymer with the heat resistance and solvent resistance of the epoxy resin.
また、本発明における組成物では、エポキシ基がカルボ
キシル基に対し大過剰に導入されているが、この過剰の
エポキシ基はポリビニルフェノール樹脂のＯＨ基により
架橋される。Furthermore, in the composition of the present invention, epoxy groups are introduced in large excess relative to carboxyl groups, and this excess epoxy group is crosslinked by the OH groups of the polyvinylphenol resin.
［実施例］ 以下、実施例により説明する。[Example] Examples will be explained below.
実施例１〜３および比較例１〜２
アクリル酸エステル樹脂、エポキシ樹脂、および硬化剤
を表１に示す組成に混合した。Examples 1 to 3 and Comparative Examples 1 to 2 Acrylic acid ester resin, epoxy resin, and curing agent were mixed into the composition shown in Table 1.
該接着剤組成物を、厚さ５０μｍポリイミドフィルムに
、厚さ３０μｍとなるように塗布した。The adhesive composition was applied to a 50 μm thick polyimide film to a thickness of 30 μm.
そして、１２０℃で１０分間乾燥後、厚さ３５μｍの電
解銅箔を接着剤塗布面に８０℃、２層ｍ／Ｃｍ２の熱ロ
ールにより、加熱圧着した。After drying at 120° C. for 10 minutes, an electrolytic copper foil with a thickness of 35 μm was hot-pressed onto the adhesive-coated surface at 80° C. with a two-layer m/cm 2 hot roll.
その後、１２０℃で６時間加熱キュアーし、フレキシブ
ル銅張り板を作製した。Thereafter, it was heated and cured at 120° C. for 6 hours to produce a flexible copper-clad board.
この銅張り板の特性を、以下に述べる試験方法で、調査
した。結果を表２に示す。The characteristics of this copper-clad board were investigated using the test method described below. The results are shown in Table 2.
試験方法
（１） 銅箔引き剥がし強度
表１に記載した組成で作製したフレキシブル銅張り板を
、１ｃｍ幅の短冊状にスリットし、試験片とした。Test Method (1) Copper Foil Peeling Strength A flexible copper clad plate prepared with the composition shown in Table 1 was slit into a 1 cm wide strip to obtain a test piece.
銅箔を、１８０℃ビールしたときの引き剥がし強度を測
定した。The peel strength of the copper foil was measured when it was heated to 180°C.
この引き剥がし強度の測定を図を用いて説明する。The measurement of this peel strength will be explained using figures.
第１図は引き剥がし強度の測定方法を図で表わしたもの
である。別表１に記載した組成物からなる接着剤１がポ
リイミドフィルム２の上に被覆されている。接着剤１の
上にＣｕ箔３が張りつけられている。このＣｕ箔３を２
５℃で５０ｍｍ／ｍ１ｎの速さで引き剥がす。そのとき
の強度（ｋｇ／ｃｍ）を尺度として、引き剥がし強度を
定量する。FIG. 1 is a graphical representation of the method for measuring peel strength. An adhesive 1 made of the composition shown in Attached Table 1 is coated on a polyimide film 2. A Cu foil 3 is pasted on the adhesive 1. This Cu foil 3 is
Peel off at a speed of 50 mm/m1n at 5°C. The peel strength is determined using the strength (kg/cm) at that time as a scale.
（２） ポリイミド引き剥がし速度
上記（１）に記載した方法で、ポリイミドフィルムを１
８０℃ビールしたときの引き剥がし強度を測定した。(2) Polyimide peeling speed Polyimide film was peeled off by the method described in (1) above.
The peel strength was measured when beer was heated to 80°C.
（３） 耐溶剤性
試験片の一部を塩化メチレン中に浸漬し、接着剤層の膨
潤、白化、溶解等の異常の有無から耐溶剤性を評価した
。(3) Solvent resistance A part of the test piece was immersed in methylene chloride, and the solvent resistance was evaluated based on the presence or absence of abnormalities such as swelling, whitening, and dissolution of the adhesive layer.
（４） 半田耐熱性
試験片を２８０℃および３２０℃の溶融半田層に１０秒
浸漬後、表面のフクレの有無により半田耐熱性を評価し
た。(4) Soldering heat resistance test pieces were immersed in molten solder layers at 280°C and 320°C for 10 seconds, and the soldering heat resistance was evaluated based on the presence or absence of blisters on the surface.
［発明の効果］
以上説明したように、この発明の接着剤組成物は、銅箔
に対する接着性のみならず、ポリイミドフィルムに対す
る接着性においても優れており、さらに耐熱性および耐
溶剤性の面でも優れている。[Effects of the Invention] As explained above, the adhesive composition of the present invention has excellent adhesion not only to copper foil but also to polyimide film, and is also excellent in terms of heat resistance and solvent resistance. Are better.
したがって、この発明の接着剤組成物は、半田耐熱性や
耐溶剤性の要求されるフレキシブル印刷配線板の銅箔と
絶縁基剤とを接着する接着剤として有効に利用され得る
ものである。Therefore, the adhesive composition of the present invention can be effectively used as an adhesive for bonding copper foil and an insulating base material of a flexible printed wiring board, which requires soldering heat resistance and solvent resistance.
（以下余白）(Margin below)
第１図は本発明に係る接着剤の引き剥がし強度を測定す
る方法を示した図である。
図において、１は接着剤である。
第１泪
／： １１１ｔゲFIG. 1 is a diagram showing a method for measuring the peel strength of an adhesive according to the present invention. In the figure, 1 is an adhesive. 1st tears/: 111t game
Claims (1)
ビニルフェノール樹脂よりなるフレキシブル印刷配線板
用接着剤組成物であって、 前記アクリル酸エステル共重合体は、アクリル酸エステ
ル、アクリロニトリルおよびメタクリル酸を共重合した
ものであり、アクリル酸エステル、アクリロニトリルお
よびメタクリル酸の割合がそれらの総重量に対して、そ
れぞれ６０〜９０重量％、１０〜５０重量％および２〜
１０重量％の範囲にあり、 前記エポキシ樹脂は１分子内に２個以上のエポキシ基を
有する溶剤可溶性のエポキシ樹脂であり、前記アクリル
酸エステル共重合体１００重量部に対し、前記エポキシ
樹脂を２５〜２５０重量部、前記ポリビニルフェノール
樹脂を１０〜１００重量部の割合で混合したことを特徴
とするフレキシブル印刷配線板用接着剤組成物。[Scope of Claims] An adhesive composition for a flexible printed wiring board comprising an acrylic ester copolymer, an epoxy resin, and a polyvinylphenol resin, wherein the acrylic ester copolymer contains an acrylic ester, an acrylonitrile, and an acrylic ester copolymer. and methacrylic acid, and the proportions of acrylic ester, acrylonitrile, and methacrylic acid are 60 to 90% by weight, 10 to 50% by weight, and 2 to 50% by weight, respectively, based on their total weight.
The epoxy resin is a solvent-soluble epoxy resin having two or more epoxy groups in one molecule, and the epoxy resin is in the range of 25% by weight per 100 parts by weight of the acrylic ester copolymer. 250 parts by weight of the above-mentioned polyvinyl phenol resin in a proportion of 10 to 100 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26805286A JPS63122773A (en) | 1986-11-11 | 1986-11-11 | Adhesive composition for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26805286A JPS63122773A (en) | 1986-11-11 | 1986-11-11 | Adhesive composition for flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122773A true JPS63122773A (en) | 1988-05-26 |
Family
ID=17453214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26805286A Pending JPS63122773A (en) | 1986-11-11 | 1986-11-11 | Adhesive composition for flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122773A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470107A (en) * | 1990-07-10 | 1992-03-05 | Murata Mfg Co Ltd | Piezoelectric resonator |
-
1986
- 1986-11-11 JP JP26805286A patent/JPS63122773A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470107A (en) * | 1990-07-10 | 1992-03-05 | Murata Mfg Co Ltd | Piezoelectric resonator |
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