JPS61123619A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS61123619A JPS61123619A JP24520984A JP24520984A JPS61123619A JP S61123619 A JPS61123619 A JP S61123619A JP 24520984 A JP24520984 A JP 24520984A JP 24520984 A JP24520984 A JP 24520984A JP S61123619 A JPS61123619 A JP S61123619A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- weight
- parts
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ラジオ受信機やテレビジョン受像機に使用す
る回路基板の保護皮膜用樹脂組成物に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin composition for a protective film on a circuit board used in radio receivers and television receivers.
従来の技術
従来、ラジオ受信機やテレビジョン受像機を構成する回
路基板の保護皮膜用樹脂組成物は、基板との密着性及び
防湿絶縁性の優れたものが要求され、エポキシ系樹脂組
成、アクリル系樹脂組成物。Conventional technology Conventionally, resin compositions for protective coatings on circuit boards constituting radio receivers and television receivers have been required to have excellent adhesion to the substrate and moisture-proof insulation properties, and epoxy resin compositions, acrylic resin compositions, etc. based resin composition.
ウレタン系樹脂組成物等が使用されている。これら保護
皮膜用樹脂組成物は、鋼張り積層板、薄膜・厚膜混成集
積回路基板に所定の回路導体パターンを形成後、保護皮
膜用パターンをスクリーン印刷し所定の硬化条件にて硬
化を行なってい之。通常、硬化は１２０Ｃ〜２００Ｃの
硬化温度で１５分〜２時間を必要としてい友。Urethane resin compositions and the like are used. These protective coating resin compositions are prepared by forming a predetermined circuit conductor pattern on a steel-clad laminate or a thin film/thick film hybrid integrated circuit board, then screen printing the protective coating pattern, and curing under predetermined curing conditions. this. Usually, curing requires 15 minutes to 2 hours at a curing temperature of 120C to 200C.
発明が解決しようとする問題点
従来の樹脂組成物を使用する場合は、少なくとも１６分
以上の硬化時間を必要とする為、生産時間が長くなると
いう問題があっ之。又、従来の樹脂組成物の硬化時間を
短くした場合、例えば２００Ｃ・６分では防湿絶縁性が
劣化し実用に適さないものであった。Problems to be Solved by the Invention When conventional resin compositions are used, a curing time of at least 16 minutes is required, resulting in a long production time. Further, when the curing time of the conventional resin composition is shortened, for example, at 200C for 6 minutes, the moisture-proof insulation properties deteriorate, making it unsuitable for practical use.
本発明は、このような問題点を解消するものであシ、硬
化時間を短縮でき、防湿絶縁性にも浸れた樹脂組成物を
提供するものである。The present invention solves these problems and provides a resin composition that can shorten the curing time and has moisture-proof insulation properties.
問題点を解決するための手段
本発明の樹脂組成物は、熱硬化型エポキシ樹脂からなる
ベース樹脂１００重量部に対して、エポキシシラ７カツ
プリング剤ヲ０．２〜３重量部、硬化促進剤である２−
エチル−４−メチルイミダゾールを０゜６〜３重量部の
割合で配合し之ものである。Means for Solving the Problems In the resin composition of the present invention, 0.2 to 3 parts by weight of an epoxy silica 7 coupling agent and a curing accelerator are added to 100 parts by weight of a base resin made of a thermosetting epoxy resin. 2-
Ethyl-4-methylimidazole is blended in a proportion of 0.6 to 3 parts by weight.
作 用
本発明の樹脂組成物は、熱硬化型エポキシ樹脂からなる
ベース樹脂に回路基板との密着性を良化させるエポキシ
シラ／カンプリング剤と硬化反応を促進させる２−エチ
ル−４−メチルイミダゾールを所定の割合で添加配合す
ることにより、各々単独で添加した場合よりも優れｔ防
湿絶縁性を示すものである。Function The resin composition of the present invention contains an epoxy sila/camping agent that improves adhesion to a circuit board and 2-ethyl-4-methylimidazole that accelerates the curing reaction in a base resin made of a thermosetting epoxy resin. By adding and blending them in a predetermined ratio, moisture-proof and insulating properties are better than when each is added alone.
実姉例
以下、本発明の一実捲例を図面と表を参照して説明する
。本実捲例では、熱硬化型エポキシ樹脂からなるベース
樹脂２例えば四国化成ＭＣ−４６７Ｇ、アサヒ化研製Ｃ
Ｒ−２０等１００重量部に対してエポキシシラ／カンプ
リング剤２例えばγ−グリシドキシプロピルトリメトキ
シシラン及びβ−（３，４エポキシシクロヘキシル）エ
チルトリメトキシシランｉｏ、２〜３重量部、硬化促進
剤２−チル−４−メチルイミダゾール’ｉｏ、５〜３重
量部の割合で添加しｔものをそれぞれ十分攪拌混合した
。EXAMPLE A practical example of the present invention will be described below with reference to the drawings and tables. In this actual winding example, the base resin 2 made of thermosetting epoxy resin, for example, Shikoku Kasei MC-467G, Asahi Kaken C
2 to 3 parts by weight of epoxy silane/camping agent 2, such as γ-glycidoxypropyltrimethoxysilane and β-(3,4 epoxycyclohexyl)ethyltrimethoxysilane io, to accelerate curing, per 100 parts by weight of R-20 etc. The agent 2-thyl-4-methylimidazole'io was added in a proportion of 5 to 3 parts by weight and mixed with thorough stirring.
次に第１図に示すセラミック基板１に銀・パラジウムか
らなる導体２で０．２閣線幅・間隔のくし形導体パター
ンを形成後、第１表に示す条件で樹脂組成物３″ｆｔ：
硬化させた。硬化の判定は、作製し几試料の硬化樹脂組
成物を示差熱分析にて未反応部の発熱ピークの有無によ
シ行なった。第２図とに示されるように硬化が完全であ
れば発熱ピークは出現せず、第２図すに示すように硬化
が不十分であれば未硬化に伴なう発熱ピークが観測され
之。Next, after forming a comb-shaped conductor pattern with a conductor width of 0.2 cm and an interval of 0.2 mm on the ceramic substrate 1 shown in FIG.
hardened. Curing was determined by differential thermal analysis of the prepared sample cured resin composition based on the presence or absence of exothermic peaks in unreacted areas. As shown in FIG. 2, if the curing is complete, no exothermic peak will appear, and as shown in FIG. 2, if the curing is insufficient, an exothermic peak due to uncuredness will be observed.
硬化させた樹脂組成物と回路基板との密着性は、作製し
た試料を６時水の中で煮沸後ＪＩＳＤ−０２０２，８−
１０の密着性試験に準じて密着性を調べ、剥離した面積
比率にて判定した。防湿絶縁性は作製し之試料’１６０
Ｃ・９０％の高温高湿環境下で３０Ｖ電圧金印加し、１
６００時間後の銀・パラジウム導体から発生し之銀マイ
グレーション発生率にて判定した。尚、密着性及び防湿
絶縁性は各添加条件下で示差熱分析結果より、最適の硬
化条件のものについて行また。The adhesion between the cured resin composition and the circuit board was determined by JISD-0202, 8- after boiling the prepared sample in water for 6 hours.
Adhesion was examined according to the adhesion test in No. 10, and judged based on the peeled area ratio. Moisture-proof insulation was prepared as a sample '160.
C. 30V voltage was applied in a high temperature and high humidity environment of 90%, and 1
Judgment was made based on the rate of silver migration generated from the silver/palladium conductor after 600 hours. In addition, adhesion and moisture-proof insulation were measured under the optimum curing conditions based on the results of differential thermal analysis under each addition condition.
第１表から明らかなように、ベース樹脂単独の保護皮膜
（試料番号１）では、密着性及び防湿絶縁性とも満足す
べきものでない。また、ベース樹脂に２−エチル−４−
メチルイミダゾールのみを添加した場合（試料番号２，
３）及びエポキシシランカップリング剤のみを添加し几
場合（試料番号４，５）は、伴に防湿絶縁性が不十分で
ある。As is clear from Table 1, the protective film made of base resin alone (sample number 1) is not satisfactory in terms of adhesion and moisture-proof insulation. In addition, 2-ethyl-4-
When only methylimidazole was added (sample number 2,
3) and the case where only the epoxy silane coupling agent was added (sample numbers 4 and 5), the moisture-proof insulation properties were both insufficient.
本発明の添加配合割合の場合（試料番号７，８゜１１．
１２）、初めて硬化時間が短く且つ密着性及び防湿絶縁
性とも実用に適し之ものとなっている。尚、本発明の添
加配合割合を外れ之樹脂組成物（試料番号６，９，１０
．１３）では、硬化時間が長くなシ、密着性及び防湿絶
縁性が不十分となり実用に適さなくなる。In the case of the addition blending ratio of the present invention (sample numbers 7, 8゜11.
12) For the first time, the curing time is short, and both adhesion and moisture-proof insulation properties are suitable for practical use. In addition, the resin compositions (sample numbers 6, 9, 10
．． In 13), the curing time is long and the adhesion and moisture-proof insulation properties are insufficient, making it unsuitable for practical use.
発明の効果
以上のように本発明の樹脂組成物は、密着性及び防湿絶
縁性に浸れており、且つ硬化時間を短縮できる定め生産
性が向上し実用上きわめて有利なものである。Effects of the Invention As described above, the resin composition of the present invention has excellent adhesion and moisture-proof insulation properties, can shorten curing time, and improves productivity, making it extremely advantageous in practice.
第１図は本発明の樹脂組成物を塗布した回路基板の断面
図、第２図ａ、ｂは樹脂の硬化状態を示す示差熱分析チ
ャートである。
３・・・・・・コーティング樹脂。FIG. 1 is a sectional view of a circuit board coated with the resin composition of the present invention, and FIGS. 2a and 2b are differential thermal analysis charts showing the cured state of the resin. 3...Coating resin.
Claims (1)
部に対して、エポキシシランカップリング剤を０．２〜
３重量部、２−エチル−４−メチルイミダゾールを０．
５〜３重量部の割合で配合したことを特徴とする保護皮
膜用の樹脂組成物。0.2 to 100 parts by weight of an epoxy silane coupling agent is added to 100 parts by weight of a base resin made of thermosetting epoxy fat.
3 parts by weight, 0.2 parts by weight of 2-ethyl-4-methylimidazole.
A resin composition for a protective film, characterized in that the resin composition is blended in a proportion of 5 to 3 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24520984A JPS61123619A (en) | 1984-11-20 | 1984-11-20 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24520984A JPS61123619A (en) | 1984-11-20 | 1984-11-20 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61123619A true JPS61123619A (en) | 1986-06-11 |
Family
ID=17130246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24520984A Pending JPS61123619A (en) | 1984-11-20 | 1984-11-20 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123619A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011152716A (en) * | 2010-01-27 | 2011-08-11 | Canon Inc | Inkjet head, inkjet apparatus, and inkjet apparatus production method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623761A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Epoxy resin composition for sealing semiconductor device |
| JPS57155753A (en) * | 1981-03-20 | 1982-09-25 | Mitsubishi Electric Corp | Sealing resin compound for semiconductor |
-
1984
- 1984-11-20 JP JP24520984A patent/JPS61123619A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623761A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Epoxy resin composition for sealing semiconductor device |
| JPS57155753A (en) * | 1981-03-20 | 1982-09-25 | Mitsubishi Electric Corp | Sealing resin compound for semiconductor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011152716A (en) * | 2010-01-27 | 2011-08-11 | Canon Inc | Inkjet head, inkjet apparatus, and inkjet apparatus production method |
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