JPS5710622A - Catalyst for polymerizing epoxy compound - Google Patents

Catalyst for polymerizing epoxy compound

Info

Publication number
JPS5710622A
JPS5710622A JP8456980A JP8456980A JPS5710622A JP S5710622 A JPS5710622 A JP S5710622A JP 8456980 A JP8456980 A JP 8456980A JP 8456980 A JP8456980 A JP 8456980A JP S5710622 A JPS5710622 A JP S5710622A
Authority
JP
Japan
Prior art keywords
catalyst
epoxy compound
polymerizing
group
diketone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8456980A
Other languages
Japanese (ja)
Other versions
JPS5757491B2 (en
Inventor
Shuji Hayase
Shinichi Sanada
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8456980A priority Critical patent/JPS5710622A/en
Publication of JPS5710622A publication Critical patent/JPS5710622A/en
Publication of JPS5757491B2 publication Critical patent/JPS5757491B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: The titled catalyst having improved stability, compatibility with a resin composition, and high activity at low temperature, capable of providing a polymer having improved electric properties by low-temperature curing in high yield, comprising an Al complex comprising a β-diketone as a ligand and a silanol group-containing organosilicon compound.
CONSTITUTION: A catalyst for polymerizing an epoxy compound is prepared by feeding (A) an aluminum complex[e.g., tris (dipivaloyl-methanato) aluminum, etc.] comprising a β-diketone as a ligand wherein a carbon in α-position of carbonyl group has an alkyl group and (B) an organosilicon compound(e.g., diphenylsilanediol, etc.) having a hydroxyl group of silanol to a polymerizing pipe replaced by N2 gas. An epoxy compound (e.g., cyclohexene oxide, etc.) is added to the catalyst and blended fully. The pipe is sealed hermetically and polymerization reaction is carried out, to give a polymer.
COPYRIGHT: (C)1982,JPO&Japio
JP8456980A 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound Granted JPS5710622A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8456980A JPS5710622A (en) 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8456980A JPS5710622A (en) 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound

Publications (2)

Publication Number Publication Date
JPS5710622A true JPS5710622A (en) 1982-01-20
JPS5757491B2 JPS5757491B2 (en) 1982-12-04

Family

ID=13834290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8456980A Granted JPS5710622A (en) 1980-06-24 1980-06-24 Catalyst for polymerizing epoxy compound

Country Status (1)

Country Link
JP (1) JPS5710622A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014185276A1 (en) * 2013-05-16 2014-11-20 信越化学工業株式会社 Aluminium chelate compound, and room-temperature-curable resin composition including same
JP2014224066A (en) * 2013-05-16 2014-12-04 信越化学工業株式会社 New aluminum chelate compound
JP2015187210A (en) * 2014-03-26 2015-10-29 三菱化学株式会社 thermosetting resin composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477504A (en) * 1977-12-02 1979-06-21 Matsushita Electric Ind Co Ltd Wireless hearing aid device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477504A (en) * 1977-12-02 1979-06-21 Matsushita Electric Ind Co Ltd Wireless hearing aid device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014185276A1 (en) * 2013-05-16 2014-11-20 信越化学工業株式会社 Aluminium chelate compound, and room-temperature-curable resin composition including same
JP2014224066A (en) * 2013-05-16 2014-12-04 信越化学工業株式会社 New aluminum chelate compound
CN105209425A (en) * 2013-05-16 2015-12-30 信越化学工业株式会社 Aluminium chelate compound, and room-temperature-curable resin composition including same
EP2998287A4 (en) * 2013-05-16 2016-12-14 Shinetsu Chemical Co Aluminium chelate compound, and room-temperature-curable resin composition including same
CN105209425B (en) * 2013-05-16 2017-12-12 信越化学工业株式会社 Aluminium chelate compound and the room temperature-curable resin composition containing aluminium chelate compound
US10428183B2 (en) 2013-05-16 2019-10-01 Shin-Etsu Chemical Co., Ltd. Room temperature-curable resin composition containing an aluminum chelate compound
JP2015187210A (en) * 2014-03-26 2015-10-29 三菱化学株式会社 thermosetting resin composition

Also Published As

Publication number Publication date
JPS5757491B2 (en) 1982-12-04

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