JPS57148362A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57148362A
JPS57148362A JP56034439A JP3443981A JPS57148362A JP S57148362 A JPS57148362 A JP S57148362A JP 56034439 A JP56034439 A JP 56034439A JP 3443981 A JP3443981 A JP 3443981A JP S57148362 A JPS57148362 A JP S57148362A
Authority
JP
Japan
Prior art keywords
container
outer lead
same plane
side face
led out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56034439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342860B2 (enFirst
Inventor
Toru Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56034439A priority Critical patent/JPS57148362A/ja
Publication of JPS57148362A publication Critical patent/JPS57148362A/ja
Publication of JPS6342860B2 publication Critical patent/JPS6342860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP56034439A 1981-03-10 1981-03-10 Semiconductor device Granted JPS57148362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56034439A JPS57148362A (en) 1981-03-10 1981-03-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56034439A JPS57148362A (en) 1981-03-10 1981-03-10 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57148362A true JPS57148362A (en) 1982-09-13
JPS6342860B2 JPS6342860B2 (enFirst) 1988-08-25

Family

ID=12414252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56034439A Granted JPS57148362A (en) 1981-03-10 1981-03-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57148362A (enFirst)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (ja) * 1982-11-17 1984-05-28 松下電器産業株式会社 電子部品接続構造
JPH0297050A (ja) * 1988-10-03 1990-04-09 Mitsubishi Electric Corp 半導体集積回路
JPH05211204A (ja) * 1991-11-29 1993-08-20 Akira Kitahara 表面実装電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5462778A (en) * 1977-10-28 1979-05-21 Toshiba Corp Laminated frame for power ic
JPS54144872A (en) * 1978-05-04 1979-11-12 Omron Tateisi Electronics Co Electronic circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5462778A (en) * 1977-10-28 1979-05-21 Toshiba Corp Laminated frame for power ic
JPS54144872A (en) * 1978-05-04 1979-11-12 Omron Tateisi Electronics Co Electronic circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978638U (ja) * 1982-11-17 1984-05-28 松下電器産業株式会社 電子部品接続構造
JPH0297050A (ja) * 1988-10-03 1990-04-09 Mitsubishi Electric Corp 半導体集積回路
JPH05211204A (ja) * 1991-11-29 1993-08-20 Akira Kitahara 表面実装電子部品

Also Published As

Publication number Publication date
JPS6342860B2 (enFirst) 1988-08-25

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