JPS57148356A - Sample holding device - Google Patents

Sample holding device

Info

Publication number
JPS57148356A
JPS57148356A JP3260481A JP3260481A JPS57148356A JP S57148356 A JPS57148356 A JP S57148356A JP 3260481 A JP3260481 A JP 3260481A JP 3260481 A JP3260481 A JP 3260481A JP S57148356 A JPS57148356 A JP S57148356A
Authority
JP
Japan
Prior art keywords
dielectric
sample
omega
electrode
volume resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3260481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6114660B2 (cg-RX-API-DMAC7.html
Inventor
Yoshio Hokotani
Toshimitsu Miyata
Satoshi Ido
Fujio Komata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
NTT Inc
Original Assignee
Hitachi Ltd
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Nippon Telegraph and Telephone Corp filed Critical Hitachi Ltd
Priority to JP3260481A priority Critical patent/JPS57148356A/ja
Publication of JPS57148356A publication Critical patent/JPS57148356A/ja
Publication of JPS6114660B2 publication Critical patent/JPS6114660B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
JP3260481A 1981-03-09 1981-03-09 Sample holding device Granted JPS57148356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3260481A JPS57148356A (en) 1981-03-09 1981-03-09 Sample holding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3260481A JPS57148356A (en) 1981-03-09 1981-03-09 Sample holding device

Publications (2)

Publication Number Publication Date
JPS57148356A true JPS57148356A (en) 1982-09-13
JPS6114660B2 JPS6114660B2 (cg-RX-API-DMAC7.html) 1986-04-19

Family

ID=12363457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3260481A Granted JPS57148356A (en) 1981-03-09 1981-03-09 Sample holding device

Country Status (1)

Country Link
JP (1) JPS57148356A (cg-RX-API-DMAC7.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124140A (ja) * 1982-12-29 1984-07-18 Fujitsu Ltd 静電吸着装置
JPS59152636A (ja) * 1983-02-21 1984-08-31 Toshiba Corp 静電チャック装置の製造方法
JPS59181622A (ja) * 1983-03-31 1984-10-16 Fujitsu Ltd 半導体装置の製造方法
US4884026A (en) * 1987-06-24 1989-11-28 Tokyo Electron Limited Electrical characteristic measuring apparatus
JPH033250A (ja) * 1989-05-30 1991-01-09 Ulvac Corp 基板保持装置
JPH04277648A (ja) * 1991-01-31 1992-10-02 Internatl Business Mach Corp <Ibm> ダイヤモンド・コーティングを施した静電チャック

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307065A (ja) * 1987-05-29 1988-12-14 Matsushita Electric Ind Co Ltd 部品連
JPH01254571A (ja) * 1988-03-24 1989-10-11 Nippon Dempa Kogyo Co Ltd エンボステープ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124140A (ja) * 1982-12-29 1984-07-18 Fujitsu Ltd 静電吸着装置
JPS59152636A (ja) * 1983-02-21 1984-08-31 Toshiba Corp 静電チャック装置の製造方法
JPS59181622A (ja) * 1983-03-31 1984-10-16 Fujitsu Ltd 半導体装置の製造方法
US4884026A (en) * 1987-06-24 1989-11-28 Tokyo Electron Limited Electrical characteristic measuring apparatus
JPH033250A (ja) * 1989-05-30 1991-01-09 Ulvac Corp 基板保持装置
JPH04277648A (ja) * 1991-01-31 1992-10-02 Internatl Business Mach Corp <Ibm> ダイヤモンド・コーティングを施した静電チャック

Also Published As

Publication number Publication date
JPS6114660B2 (cg-RX-API-DMAC7.html) 1986-04-19

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