JPS57147255A - Multichip lsi package - Google Patents

Multichip lsi package

Info

Publication number
JPS57147255A
JPS57147255A JP56031691A JP3169181A JPS57147255A JP S57147255 A JPS57147255 A JP S57147255A JP 56031691 A JP56031691 A JP 56031691A JP 3169181 A JP3169181 A JP 3169181A JP S57147255 A JPS57147255 A JP S57147255A
Authority
JP
Japan
Prior art keywords
chip carrier
multichip
lsi package
multilayer wiring
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56031691A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6217871B2 (enExample
Inventor
Toshihiko Watari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56031691A priority Critical patent/JPS57147255A/ja
Publication of JPS57147255A publication Critical patent/JPS57147255A/ja
Publication of JPS6217871B2 publication Critical patent/JPS6217871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/774—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56031691A 1981-03-05 1981-03-05 Multichip lsi package Granted JPS57147255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56031691A JPS57147255A (en) 1981-03-05 1981-03-05 Multichip lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56031691A JPS57147255A (en) 1981-03-05 1981-03-05 Multichip lsi package

Publications (2)

Publication Number Publication Date
JPS57147255A true JPS57147255A (en) 1982-09-11
JPS6217871B2 JPS6217871B2 (enExample) 1987-04-20

Family

ID=12338093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56031691A Granted JPS57147255A (en) 1981-03-05 1981-03-05 Multichip lsi package

Country Status (1)

Country Link
JP (1) JPS57147255A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6381844B1 (en) 1999-12-15 2002-05-07 Sun Microsystems, Inc. Method for thermally connecting a heat sink to a cabinet
FR2967763A1 (fr) * 2010-11-19 2012-05-25 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN109920755A (zh) * 2019-02-25 2019-06-21 天津大学 一种纳米银焊膏低压辅助烧结夹具及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143395U (enExample) * 1989-05-02 1990-12-05

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6381844B1 (en) 1999-12-15 2002-05-07 Sun Microsystems, Inc. Method for thermally connecting a heat sink to a cabinet
FR2967763A1 (fr) * 2010-11-19 2012-05-25 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN109920755A (zh) * 2019-02-25 2019-06-21 天津大学 一种纳米银焊膏低压辅助烧结夹具及方法
CN109920755B (zh) * 2019-02-25 2021-01-05 天津大学 一种纳米银焊膏低压辅助烧结夹具及方法

Also Published As

Publication number Publication date
JPS6217871B2 (enExample) 1987-04-20

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