JPS57138181A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57138181A
JPS57138181A JP56023860A JP2386081A JPS57138181A JP S57138181 A JPS57138181 A JP S57138181A JP 56023860 A JP56023860 A JP 56023860A JP 2386081 A JP2386081 A JP 2386081A JP S57138181 A JPS57138181 A JP S57138181A
Authority
JP
Japan
Prior art keywords
substrate
film
gate electrodes
electrodes
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56023860A
Other languages
Japanese (ja)
Other versions
JPH0320907B2 (en
Inventor
Katsuhiro Kawabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56023860A priority Critical patent/JPS57138181A/en
Publication of JPS57138181A publication Critical patent/JPS57138181A/en
Publication of JPH0320907B2 publication Critical patent/JPH0320907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)

Abstract

PURPOSE:To obtain a multigated construction with no punch-through production, by making gate electrodes close to a drain region wider than other electrodes as for a semiconductor device which provides a plurality of gate electrodes via an insulation film on a semicnductor substrate and a drain region of inverse- conductive type to that of the substrate on the substrate of one side electrode rows. CONSTITUTION:A thick oxide film 12 for inter-element separation is formed around a p type Si substrate 11. The first gate thin oxide film 13 is attached on the substrate 11 surrounded by it. The first layer of a polycrystalline Si film 14 is grown on the whole surface including it. Next, the film 14 is etched selectively. A plurality of Si gate electrodes 141-143 are made for certain intervals apart. These open surface is covered with the second gate oxide film 15. And then, the second layer of a polycrystalline Si film 16 is grown on the whole surface. Si gate electrodes 161-163 are made by etching selectively. At the same time, chosen between an n<+> type source region 17 and a drain region 18, only electrode 163 close to the region 18 is made wider than the other electrodes 161 and 162.
JP56023860A 1981-02-20 1981-02-20 Semiconductor device Granted JPS57138181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56023860A JPS57138181A (en) 1981-02-20 1981-02-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56023860A JPS57138181A (en) 1981-02-20 1981-02-20 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57138181A true JPS57138181A (en) 1982-08-26
JPH0320907B2 JPH0320907B2 (en) 1991-03-20

Family

ID=12122188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56023860A Granted JPS57138181A (en) 1981-02-20 1981-02-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57138181A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218140A (en) * 1975-08-01 1977-02-10 Nec Corp Ccd delay line
JPS5341188A (en) * 1976-08-25 1978-04-14 Hitachi Ltd Mis type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218140A (en) * 1975-08-01 1977-02-10 Nec Corp Ccd delay line
JPS5341188A (en) * 1976-08-25 1978-04-14 Hitachi Ltd Mis type semiconductor device

Also Published As

Publication number Publication date
JPH0320907B2 (en) 1991-03-20

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