JPS5713200A - Barrel plating device - Google Patents

Barrel plating device

Info

Publication number
JPS5713200A
JPS5713200A JP8751880A JP8751880A JPS5713200A JP S5713200 A JPS5713200 A JP S5713200A JP 8751880 A JP8751880 A JP 8751880A JP 8751880 A JP8751880 A JP 8751880A JP S5713200 A JPS5713200 A JP S5713200A
Authority
JP
Japan
Prior art keywords
plated
parts
cathode
contact
themselves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8751880A
Other languages
Japanese (ja)
Inventor
Yoshitaka Kamibayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Mazda Motor Corp
Toyo Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mazda Motor Corp, Toyo Kogyo Co Ltd filed Critical Mazda Motor Corp
Priority to JP8751880A priority Critical patent/JPS5713200A/en
Publication of JPS5713200A publication Critical patent/JPS5713200A/en
Pending legal-status Critical Current

Links

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To provide a titled device which surely maintains the contact between parts to be plated and themselves and between the parts to be plated and the cathode by sucking the parts to be plated in a barral body downward by means of a magnet disposed in the rear side position of the cathode in the lower part on the outer side of the rotatable barrel body.
CONSTITUTION: After an electroplating soln. is filled from an electroplating tank 10 into a barrel body 2 up to a suitable level through a liquid feeding pipe 12, parts to be plated are charged therein and the body 2 is rotated, whereby plating is accomplished. At this time, downward attraction force is applied to the parts to be plated by the magnetic force of an electromagnet 17, whereby the contact between the parts to be plated and themselves and the contact between the parts to be plated and the cathode 6 are maintained surely. Hence, the uniformity of plating films is enhanced by making the number of revolutions of the body 2 higher than that in the prior art. Here, 5 in the figure is an electromagnetic bar constituting the anode, and 7 is the contacting member connected to the cathode 6, which are connected to each other by connecting wires 8.
COPYRIGHT: (C)1982,JPO&Japio
JP8751880A 1980-06-27 1980-06-27 Barrel plating device Pending JPS5713200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8751880A JPS5713200A (en) 1980-06-27 1980-06-27 Barrel plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8751880A JPS5713200A (en) 1980-06-27 1980-06-27 Barrel plating device

Publications (1)

Publication Number Publication Date
JPS5713200A true JPS5713200A (en) 1982-01-23

Family

ID=13917205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8751880A Pending JPS5713200A (en) 1980-06-27 1980-06-27 Barrel plating device

Country Status (1)

Country Link
JP (1) JPS5713200A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008296366A (en) * 2008-08-10 2008-12-11 Hitachi Chem Co Ltd Laminate end cutting method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008296366A (en) * 2008-08-10 2008-12-11 Hitachi Chem Co Ltd Laminate end cutting method and device

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