JPH05339800A - Jet plating device having soluble anode and insoluble anode - Google Patents

Abstract

PURPOSE:To obtain a plating having uniform thickness and to prolong the service life of a plating soln. in the electroplating using ordinarily a soluble anode of copper, nickel, etc., for a multilayer substrate. CONSTITUTION:In the jet plating device, a pump 10 is provided for ejecting and circulating a plating soln. 12 and a box 5 is provided on the pipeline connected to a plating chamber 6, and a basket 3 charged with a pellet 2 (soluble anode) is placed in the box 5. The basket 3 is covered with an anode bag 4 to prevent anode sliming. The deterioration of a solution is prevented owing to the soluble anode in the basket 3. Meanwhile, an insoluble mesh anode 1 is placed in the plating chamber 6 to make the current distribution reproducible, and the film thickness is easily uniformized.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a jet plating apparatus having a soluble anode and an insoluble anode.

[0002]

2. Description of the Related Art In the prior art, as shown in FIG. 2, a plating tank 11 for containing a plating solution 12 and an object 7 to be plated are provided.
A plating chamber 6 for placing the metal plating, a mesh anode 13 mounted therein, a pump 10 for circulating and ejecting the plating solution 12 from the plating tank 11 to the plating chamber 5, and a power supply for supplying a plating current. 8
have.

Next, the operation will be described. A plate-shaped object 7 to be plated such as a wiring board is placed on the plating chamber 6 and connected to the power supply 8. The plating solution 12 is circulated by the pump 10 and jetted onto the non-plated product 6. And power supply 8
By supplying a predetermined current from the plate, the object 6 to be plated is plated.

[0004]

In the prior art, when an insoluble anode is used in the case of plating using a soluble anode, such as copper plating and nickel plating, the composition of the plating solution varies greatly and the plating solution changes. The life of is shortened remarkably. Further, when the soluble anode is used in the form of a mesh, the anode is dissolved as the plating is performed and the shape of the anode is changed, so that the current distribution is changed and thus the plating film thickness distribution is changed. Therefore, since the reproducibility of the plating film thickness distribution cannot be obtained, it is difficult to make the plating film thickness uniform. Further, when using a soluble anode, it is necessary to cover the anode with an anode bag to prevent anode slime. Therefore, the structure becomes complicated and replacement of the anode becomes difficult. Further, there is a problem that it takes time to confirm the plating film thickness after the anode replacement.

[0005]

A jet plating apparatus having a soluble anode and an insoluble anode according to the present invention is provided with a box in the middle of a pipe between a pump and a plating chamber, and a granular soluble particle is placed in the box. A basket is provided to hold the anode pellets, the basket is covered with an anode bag to prevent anode slime, and the plating power source is connected.In addition, an insoluble anode is installed in the plating chamber and connected to another power source. Have

[0006]

The present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention. A plating tank 11 for containing a plating solution 12 and a plating chamber 6 for placing an object 7 to be plated on the plating tank 11 are installed. Inside the plating chamber 6,
A mesh-shaped insoluble anode 1 is attached and connected to a power supply 8. The plating solution 12 is circulated and jetted from the plating tank 11 to the plating chamber 6 by the pump 10. A box 5 is installed in the middle of a pipe connecting the pump 10 and the plating chamber 6, and the basket 3 covered with the anode bag 4 is put therein. Inside the basket 3, pellets 2 which are small granular soluble anodes are placed, and the basket 3 is connected to a power source 9 different from that connected to the insoluble anode 1. Next, the operation will be described. An object 7 to be plated such as a wiring board is placed on the plating chamber 6 with the plating surface facing down and connected to the power sources 8 and 9. Pump 10
The plating solution 12 from the plating tank 11 to the box 5
The pellet 2 inside and the insoluble anode 1 in the plating chamber 6 are returned to the plating tank 11 below the plating chamber 6. The power supply 8 is connected to the insoluble anode 1,
The power source 9 is connected to the pellet 2, which is a soluble anode, so that a predetermined plating power source can be supplied to the insoluble anode 1 and the pellet 2 at an arbitrary ratio. When the plating solution 12 is jetted by the pump 10 onto the plating surface of the object 7 to be plated in the plating chamber 6 and is circulated, a predetermined plating current is caused to flow from the power sources 8 and 9 to thereby cause the surface of the object 7 to be plated. The metal is electrochemically detected and plated on.

Further, the pellet 2 which is a soluble anode in the basket 3 is eluted as metal ions during plating, and the plating solution can be supplemented with metal ions.

[0009]

As described above, the present invention has two types of anodes, an insoluble anode and a soluble anode, and separate power sources are attached to the respective anodes, so that the current distribution can be reproducible by the insoluble anodes. And the possibility that the plating film thickness can be easily made uniform, and the possibility that the anode can replenish the metal ions of the plating solution, thus extending the life of the plating solution. Have.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 Insoluble mesh anode 2 Pellet (soluble anode) 3 Basket 4 Anode back 5 Box 6 Plating chamber 7 Plated object 8 Power source 9 Power source 10 Pump 11 Plating tank 12 Plating solution 13 Mesh anode

Claims (1)

[Claims] 1. A pump for ejecting a plating solution onto the surface of an object to be plated on the plating chamber and a basket for putting a granular soluble anode in the middle of a pipe between the plating chamber, and insoluble in the plating chamber. Plating apparatus having a soluble anode and an insoluble anode, characterized in that it is provided with a conductive anode.