JPS57112055A - Integrated circuit package - Google Patents

Integrated circuit package

Info

Publication number
JPS57112055A
JPS57112055A JP18728380A JP18728380A JPS57112055A JP S57112055 A JPS57112055 A JP S57112055A JP 18728380 A JP18728380 A JP 18728380A JP 18728380 A JP18728380 A JP 18728380A JP S57112055 A JPS57112055 A JP S57112055A
Authority
JP
Japan
Prior art keywords
chip
concave
heat
cap
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18728380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634714B2 (enrdf_load_stackoverflow
Inventor
Tetsushi Wakabayashi
Kiyoshi Muratake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18728380A priority Critical patent/JPS57112055A/ja
Publication of JPS57112055A publication Critical patent/JPS57112055A/ja
Publication of JPS634714B2 publication Critical patent/JPS634714B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP18728380A 1980-12-29 1980-12-29 Integrated circuit package Granted JPS57112055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18728380A JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18728380A JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Publications (2)

Publication Number Publication Date
JPS57112055A true JPS57112055A (en) 1982-07-12
JPS634714B2 JPS634714B2 (enrdf_load_stackoverflow) 1988-01-30

Family

ID=16203279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18728380A Granted JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Country Status (1)

Country Link
JP (1) JPS57112055A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (ja) * 1985-11-13 1987-05-26 Nec Corp 集積回路の放熱構造
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
JPH05144959A (ja) * 1991-11-18 1993-06-11 Fujitsu Ltd 半導体装置
JPH08124633A (ja) * 1994-10-24 1996-05-17 Nec Corp コネクタ
EP0883175A3 (en) * 1997-06-03 1999-06-09 Lsi Logic Corporation High performance heat spreader for flip chip packages
JP2004140289A (ja) * 2002-10-21 2004-05-13 Funai Electric Co Ltd 電子部品の放熱構造およびこれを備えたディスクドライブ装置
JP2010012850A (ja) * 2008-07-02 2010-01-21 Nsk Ltd 電動パワーステアリング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836595A (enrdf_load_stackoverflow) * 1971-09-13 1973-05-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836595A (enrdf_load_stackoverflow) * 1971-09-13 1973-05-30

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (ja) * 1985-11-13 1987-05-26 Nec Corp 集積回路の放熱構造
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
JPH05144959A (ja) * 1991-11-18 1993-06-11 Fujitsu Ltd 半導体装置
JPH08124633A (ja) * 1994-10-24 1996-05-17 Nec Corp コネクタ
EP0883175A3 (en) * 1997-06-03 1999-06-09 Lsi Logic Corporation High performance heat spreader for flip chip packages
JP2004140289A (ja) * 2002-10-21 2004-05-13 Funai Electric Co Ltd 電子部品の放熱構造およびこれを備えたディスクドライブ装置
JP2010012850A (ja) * 2008-07-02 2010-01-21 Nsk Ltd 電動パワーステアリング装置

Also Published As

Publication number Publication date
JPS634714B2 (enrdf_load_stackoverflow) 1988-01-30

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