JPS57109918A - Cutting device of glass substrate - Google Patents

Cutting device of glass substrate

Info

Publication number
JPS57109918A
JPS57109918A JP18607980A JP18607980A JPS57109918A JP S57109918 A JPS57109918 A JP S57109918A JP 18607980 A JP18607980 A JP 18607980A JP 18607980 A JP18607980 A JP 18607980A JP S57109918 A JPS57109918 A JP S57109918A
Authority
JP
Japan
Prior art keywords
substrate
conveyor
glass
glass substrate
presser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18607980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6228097B2 (it
Inventor
Sadao Kanetani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP18607980A priority Critical patent/JPS57109918A/ja
Publication of JPS57109918A publication Critical patent/JPS57109918A/ja
Publication of JPS6228097B2 publication Critical patent/JPS6228097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP18607980A 1980-12-26 1980-12-26 Cutting device of glass substrate Granted JPS57109918A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18607980A JPS57109918A (en) 1980-12-26 1980-12-26 Cutting device of glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18607980A JPS57109918A (en) 1980-12-26 1980-12-26 Cutting device of glass substrate

Publications (2)

Publication Number Publication Date
JPS57109918A true JPS57109918A (en) 1982-07-08
JPS6228097B2 JPS6228097B2 (it) 1987-06-18

Family

ID=16182004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18607980A Granted JPS57109918A (en) 1980-12-26 1980-12-26 Cutting device of glass substrate

Country Status (1)

Country Link
JP (1) JPS57109918A (it)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06305758A (ja) * 1993-04-22 1994-11-01 Casio Comput Co Ltd ガラス切断方法
US7002660B2 (en) 1997-10-15 2006-02-21 Bae Systems Plc Liquid crystal displays
JP2006062891A (ja) * 2004-08-24 2006-03-09 Amagasaki Kosakusho:Kk 合せガラス切断方法およびその装置
GB2419852A (en) * 2004-11-05 2006-05-10 Lg Philips Lcd Co Ltd Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus and substrate cutting method using the substrate cutting apparatus
GB2436232A (en) * 2004-11-05 2007-09-19 Lg Philips Lcd Co Ltd A substrate cutting method using a substrate cutting apparatus
GB2436231A (en) * 2004-11-05 2007-09-19 Lg Philips Lcd Co Ltd Substrate cutting apparatus equipped with a scribing apparatus
WO2013108568A1 (ja) * 2012-01-20 2013-07-25 旭硝子株式会社 ガラス板の切断装置
CN104003610A (zh) * 2014-05-15 2014-08-27 华南理工大学 液晶玻璃基板双刀轮切割装置和方法
CN104803594A (zh) * 2014-01-29 2015-07-29 三星钻石工业股份有限公司 切断装置
JP2017140844A (ja) * 2017-03-24 2017-08-17 三星ダイヤモンド工業株式会社 ブレイク装置
JP2019081373A (ja) * 2014-08-21 2019-05-30 三星ダイヤモンド工業株式会社 基板ブレイク装置
CN112405881A (zh) * 2020-10-30 2021-02-26 重庆邮电大学 基于智能控制的切割装置
WO2023112612A1 (ja) * 2021-12-16 2023-06-22 日東電工株式会社 シート材の分断方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140199U (it) * 1987-03-06 1988-09-14
JPH0533752Y2 (it) * 1987-03-23 1993-08-26
JPH01141393U (it) * 1988-03-22 1989-09-28
JPH01315691A (ja) * 1988-06-15 1989-12-20 Mitsubishi Heavy Ind Ltd 立軸形ポンプ
JPH0356894U (it) * 1989-10-03 1991-05-31

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06305758A (ja) * 1993-04-22 1994-11-01 Casio Comput Co Ltd ガラス切断方法
US7002660B2 (en) 1997-10-15 2006-02-21 Bae Systems Plc Liquid crystal displays
JP2006062891A (ja) * 2004-08-24 2006-03-09 Amagasaki Kosakusho:Kk 合せガラス切断方法およびその装置
GB2419852A (en) * 2004-11-05 2006-05-10 Lg Philips Lcd Co Ltd Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus and substrate cutting method using the substrate cutting apparatus
GB2436232A (en) * 2004-11-05 2007-09-19 Lg Philips Lcd Co Ltd A substrate cutting method using a substrate cutting apparatus
GB2436231A (en) * 2004-11-05 2007-09-19 Lg Philips Lcd Co Ltd Substrate cutting apparatus equipped with a scribing apparatus
GB2436232B (en) * 2004-11-05 2008-02-06 Lg Philips Lcd Co Ltd A substrate cutting method using a substrate cutting apparatus
GB2419852B (en) * 2004-11-05 2008-02-20 Lg Philips Lcd Co Ltd Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus
GB2436231B (en) * 2004-11-05 2008-03-26 Lg Philips Lcd Co Ltd Substrate cutting apparatus equipped with a scribing apparatus
US7528341B2 (en) 2004-11-05 2009-05-05 Lg Display Co., Ltd. Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus
CN104080747A (zh) * 2012-01-20 2014-10-01 旭硝子株式会社 玻璃板的切断装置
TWI506000B (zh) * 2012-01-20 2015-11-01 Asahi Glass Co Ltd A glass plate cutting apparatus, a glass plate cutting method, and a glass plate manufacturing method
WO2013108568A1 (ja) * 2012-01-20 2013-07-25 旭硝子株式会社 ガラス板の切断装置
JP5605726B2 (ja) * 2012-01-20 2014-10-15 旭硝子株式会社 ガラス板の切断装置
JP2014240354A (ja) * 2012-01-20 2014-12-25 旭硝子株式会社 ガラス板の切断方法及びガラス板の製造方法
CN105776836B (zh) * 2012-01-20 2018-04-24 旭硝子株式会社 玻璃板的切断方法及玻璃板的制造方法
CN105776836A (zh) * 2012-01-20 2016-07-20 旭硝子株式会社 玻璃板的切断方法及玻璃板的制造方法
CN104080747B (zh) * 2012-01-20 2016-05-18 旭硝子株式会社 玻璃板的切断装置
JP2015140289A (ja) * 2014-01-29 2015-08-03 三星ダイヤモンド工業株式会社 ブレイク装置
CN104803594A (zh) * 2014-01-29 2015-07-29 三星钻石工业股份有限公司 切断装置
CN104003610A (zh) * 2014-05-15 2014-08-27 华南理工大学 液晶玻璃基板双刀轮切割装置和方法
JP2019081373A (ja) * 2014-08-21 2019-05-30 三星ダイヤモンド工業株式会社 基板ブレイク装置
JP2017140844A (ja) * 2017-03-24 2017-08-17 三星ダイヤモンド工業株式会社 ブレイク装置
CN112405881A (zh) * 2020-10-30 2021-02-26 重庆邮电大学 基于智能控制的切割装置
CN112405881B (zh) * 2020-10-30 2022-06-10 重庆邮电大学 基于智能控制的切割装置
WO2023112612A1 (ja) * 2021-12-16 2023-06-22 日東電工株式会社 シート材の分断方法

Also Published As

Publication number Publication date
JPS6228097B2 (it) 1987-06-18

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