JPS57107054A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57107054A
JPS57107054A JP18422880A JP18422880A JPS57107054A JP S57107054 A JPS57107054 A JP S57107054A JP 18422880 A JP18422880 A JP 18422880A JP 18422880 A JP18422880 A JP 18422880A JP S57107054 A JPS57107054 A JP S57107054A
Authority
JP
Japan
Prior art keywords
film
region
electrode
regist
whole surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18422880A
Other languages
Japanese (ja)
Inventor
Mitsunao Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP18422880A priority Critical patent/JPS57107054A/en
Publication of JPS57107054A publication Critical patent/JPS57107054A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To prevent breaking of a staged part by thickening of an Al film thickness at a staged part, by a method wherein an Al layer is adhered to a whole surface of a substrate whereon an element region is formed, and after a region except an electrode wiring part is anodic-oxidated, the whole surface is irradiated with energy beam. CONSTITUTION:In a process to manufacture an electrode of an MOSFET, a regist mask 5 is masked to form a gate electrode 4, and after impurity is poured to a source region 6 and drain region 7, the regist film 5 is removed to vacuum- evaporate an Al film to the whole surface. A regist pattern 9 is formed on an Al film 8 of an electrode wiring region, and the Al film at other region is anodic-oxidated to form an alumina film 10. Then, after the resist is removed, for example, the total surface is scanned and irradiated with laser beam to fuse the Al film 8 on a staged part to thicken a thin part into a gentle slope. This permits the prevention of breaking of an electrode at a staged part and enables the improvement of contact with the substrate.
JP18422880A 1980-12-25 1980-12-25 Manufacture of semiconductor device Pending JPS57107054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18422880A JPS57107054A (en) 1980-12-25 1980-12-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18422880A JPS57107054A (en) 1980-12-25 1980-12-25 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57107054A true JPS57107054A (en) 1982-07-03

Family

ID=16149609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18422880A Pending JPS57107054A (en) 1980-12-25 1980-12-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57107054A (en)

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