JPS5699271A - Bonding method of fabricated panel by dielectric heating - Google Patents

Bonding method of fabricated panel by dielectric heating

Info

Publication number
JPS5699271A
JPS5699271A JP167080A JP167080A JPS5699271A JP S5699271 A JPS5699271 A JP S5699271A JP 167080 A JP167080 A JP 167080A JP 167080 A JP167080 A JP 167080A JP S5699271 A JPS5699271 A JP S5699271A
Authority
JP
Japan
Prior art keywords
panel
sides
fabricated panel
dielectric material
fabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP167080A
Other languages
Japanese (ja)
Inventor
Tameyoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National House Industrial Co Ltd
Original Assignee
National House Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National House Industrial Co Ltd filed Critical National House Industrial Co Ltd
Priority to JP167080A priority Critical patent/JPS5699271A/en
Publication of JPS5699271A publication Critical patent/JPS5699271A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To bond fabricated panel by heating under easier control system in a short time by a procedure in which a surface steel plate is overlaid on both sides of a steel framework coated with a thermosetting adhesive and then the both sides are provided with a heating dielectric material to which a high frequency high voltage is applied.
CONSTITUTION: A thermosetting resin adhesive 2 is coated on both sides of a steel framework and then a surface steel plate 3 is overlaid on the steel framework 1 to form a fabricated panel 4. Then, a heating dielectric material (e.g., asbestos slate) 5, having a great dielectric loss, is provided on both sides of the panel 4, and while pressing on the panel 4, a high frequency high voltage is applied between both electrode plates 6 provided outside of the dielectric material 5 to heat the fabricated panel 4, thereby causing the fabricated panel 4 to bond with good heat efficiency.
COPYRIGHT: (C)1981,JPO&Japio
JP167080A 1980-01-10 1980-01-10 Bonding method of fabricated panel by dielectric heating Pending JPS5699271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP167080A JPS5699271A (en) 1980-01-10 1980-01-10 Bonding method of fabricated panel by dielectric heating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP167080A JPS5699271A (en) 1980-01-10 1980-01-10 Bonding method of fabricated panel by dielectric heating

Publications (1)

Publication Number Publication Date
JPS5699271A true JPS5699271A (en) 1981-08-10

Family

ID=11507947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP167080A Pending JPS5699271A (en) 1980-01-10 1980-01-10 Bonding method of fabricated panel by dielectric heating

Country Status (1)

Country Link
JP (1) JPS5699271A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100404535B1 (en) * 2001-08-28 2003-11-05 이월주 A board for fabricated house

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100404535B1 (en) * 2001-08-28 2003-11-05 이월주 A board for fabricated house

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