JPS5699271A - Bonding method of fabricated panel by dielectric heating - Google Patents
Bonding method of fabricated panel by dielectric heatingInfo
- Publication number
- JPS5699271A JPS5699271A JP167080A JP167080A JPS5699271A JP S5699271 A JPS5699271 A JP S5699271A JP 167080 A JP167080 A JP 167080A JP 167080 A JP167080 A JP 167080A JP S5699271 A JPS5699271 A JP S5699271A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- sides
- fabricated panel
- dielectric material
- fabricated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To bond fabricated panel by heating under easier control system in a short time by a procedure in which a surface steel plate is overlaid on both sides of a steel framework coated with a thermosetting adhesive and then the both sides are provided with a heating dielectric material to which a high frequency high voltage is applied.
CONSTITUTION: A thermosetting resin adhesive 2 is coated on both sides of a steel framework and then a surface steel plate 3 is overlaid on the steel framework 1 to form a fabricated panel 4. Then, a heating dielectric material (e.g., asbestos slate) 5, having a great dielectric loss, is provided on both sides of the panel 4, and while pressing on the panel 4, a high frequency high voltage is applied between both electrode plates 6 provided outside of the dielectric material 5 to heat the fabricated panel 4, thereby causing the fabricated panel 4 to bond with good heat efficiency.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP167080A JPS5699271A (en) | 1980-01-10 | 1980-01-10 | Bonding method of fabricated panel by dielectric heating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP167080A JPS5699271A (en) | 1980-01-10 | 1980-01-10 | Bonding method of fabricated panel by dielectric heating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5699271A true JPS5699271A (en) | 1981-08-10 |
Family
ID=11507947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP167080A Pending JPS5699271A (en) | 1980-01-10 | 1980-01-10 | Bonding method of fabricated panel by dielectric heating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5699271A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100404535B1 (en) * | 2001-08-28 | 2003-11-05 | 이월주 | A board for fabricated house |
-
1980
- 1980-01-10 JP JP167080A patent/JPS5699271A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100404535B1 (en) * | 2001-08-28 | 2003-11-05 | 이월주 | A board for fabricated house |
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