JPS5777528A - Bonding method of face sheet of panel - Google Patents

Bonding method of face sheet of panel

Info

Publication number
JPS5777528A
JPS5777528A JP55155700A JP15570080A JPS5777528A JP S5777528 A JPS5777528 A JP S5777528A JP 55155700 A JP55155700 A JP 55155700A JP 15570080 A JP15570080 A JP 15570080A JP S5777528 A JPS5777528 A JP S5777528A
Authority
JP
Japan
Prior art keywords
face sheets
panel
electrode plates
highly dielectric
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55155700A
Other languages
Japanese (ja)
Other versions
JPS6124979B2 (en
Inventor
Mitsumasa Sakaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP55155700A priority Critical patent/JPS5777528A/en
Publication of JPS5777528A publication Critical patent/JPS5777528A/en
Publication of JPS6124979B2 publication Critical patent/JPS6124979B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To provide a method of bonding face sheets of a panel wherein the thermal efficiency is good, the productivity is excellent, and positive thoroughly bonding is effected, by abutting metal face sheets on panel frames with an adhesive therebetween, interposing them between electrode plates with highly dielectric matters, and applying a high frequency voltage between the electrode plates and the face sheets.
CONSTITUTION: Panel frames 1 and inner interposition members 6 to be bonded are sandwitched between the metal face plates 2, 3 with a thermosetting adhesive applied therebetween, the highly dielectric matters 7, 8 are abutted on the surfaces of the face sheets 2, 3 with the pressing electrode plates 9, 10 thereon, and a high frequency voltage is independently applied between each of the face plates 2, 3 and each of the pressing electrode plates 9, 10. The reference numerals 12, 13 indicate oscillators. Use is made of for example asbestos slates for the highly dielectric materials 7, 8. Thus when a high frequency voltage is applied, the highly dielectric matters 7, 8 are heated to cure the thermosetting adhesive so that the face sheets 2, 3, the panel frames 1 and the inner interposition members 6 are bonded.
COPYRIGHT: (C)1982,JPO&Japio
JP55155700A 1980-10-31 1980-10-31 Bonding method of face sheet of panel Granted JPS5777528A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55155700A JPS5777528A (en) 1980-10-31 1980-10-31 Bonding method of face sheet of panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55155700A JPS5777528A (en) 1980-10-31 1980-10-31 Bonding method of face sheet of panel

Publications (2)

Publication Number Publication Date
JPS5777528A true JPS5777528A (en) 1982-05-14
JPS6124979B2 JPS6124979B2 (en) 1986-06-13

Family

ID=15611601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55155700A Granted JPS5777528A (en) 1980-10-31 1980-10-31 Bonding method of face sheet of panel

Country Status (1)

Country Link
JP (1) JPS5777528A (en)

Also Published As

Publication number Publication date
JPS6124979B2 (en) 1986-06-13

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