JPS57178823A - Induction bonding method - Google Patents

Induction bonding method

Info

Publication number
JPS57178823A
JPS57178823A JP6642281A JP6642281A JPS57178823A JP S57178823 A JPS57178823 A JP S57178823A JP 6642281 A JP6642281 A JP 6642281A JP 6642281 A JP6642281 A JP 6642281A JP S57178823 A JPS57178823 A JP S57178823A
Authority
JP
Japan
Prior art keywords
bonded
bonding
electrically conductive
parts
pressed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6642281A
Other languages
Japanese (ja)
Inventor
Takao Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6642281A priority Critical patent/JPS57178823A/en
Publication of JPS57178823A publication Critical patent/JPS57178823A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain a bonded body by an induction bonding method the heating efficiency of which is high and by which the bonding is positive, by induction bonding of parts to be bonded, which each include dielectric material inner layers with an electrically conductive material along the bonding surface, with a thermosetting adhesive. CONSTITUTION:The parts 1, 1 to be bonded each include a plywood comprising a plurality of bonded dielectric materials such as wood single plates 2, and further each have an electrically conductive film 3 such as a copper or aluminum film as an electrically conductive material 4 forming an inner layer between the wood single plates 2, 2. The thus constituted parts 1 are put one upon the other with their bonding surfaces 5 therebetween to form a body 6 to be pressed. With the body 6 pressed from both the surfaces by press plates, a high frequency voltage is energizied to the opposite sides of the bonding surface 5 where a thermosetting adhesive has been applied through a circuit 9 including the electrically conductive materials 4 as electrodes and a high-frequency oscillator 8 as an electric source, so that the parts 1, 1 are bonded.
JP6642281A 1981-04-30 1981-04-30 Induction bonding method Pending JPS57178823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6642281A JPS57178823A (en) 1981-04-30 1981-04-30 Induction bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6642281A JPS57178823A (en) 1981-04-30 1981-04-30 Induction bonding method

Publications (1)

Publication Number Publication Date
JPS57178823A true JPS57178823A (en) 1982-11-04

Family

ID=13315335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6642281A Pending JPS57178823A (en) 1981-04-30 1981-04-30 Induction bonding method

Country Status (1)

Country Link
JP (1) JPS57178823A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61236880A (en) * 1985-04-12 1986-10-22 Mitsubishi Electric Corp Bonding method
JP3708128B2 (en) * 1995-08-01 2005-10-19 トレイシー・エイ・ワイアット Batch and curing process control
CN102850945A (en) * 2012-10-08 2013-01-02 李文忠 Fusion bonding method of plastic film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374580A (en) * 1976-12-15 1978-07-03 Gotou Miyo Method for bonding container to wrapper
JPS5480337A (en) * 1977-12-08 1979-06-27 Sugiyama Sangyo Kagaku Kenk Highhfrequency heating adhesive

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5374580A (en) * 1976-12-15 1978-07-03 Gotou Miyo Method for bonding container to wrapper
JPS5480337A (en) * 1977-12-08 1979-06-27 Sugiyama Sangyo Kagaku Kenk Highhfrequency heating adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61236880A (en) * 1985-04-12 1986-10-22 Mitsubishi Electric Corp Bonding method
JP3708128B2 (en) * 1995-08-01 2005-10-19 トレイシー・エイ・ワイアット Batch and curing process control
CN102850945A (en) * 2012-10-08 2013-01-02 李文忠 Fusion bonding method of plastic film

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