JPS6124979B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for bonding a panel face plate.

Conventionally, when bonding metal surface plates to both sides of a metal panel frame, a hot press method as shown in FIG. 1 has been adopted. That is, the surface plates 2 and 3 are brought into contact with both surfaces of the panel frame 1, and a thermosetting adhesive is applied to the contact surfaces. And these surface plates 2 and 3
In this method, the panel frame 1 and the panel frame 1 are clamped from both sides by a pair of hot plates 4 and 5. 6 is an internal insert material such as a honeycomb core or a heat insulating material, and this internal insert material 6
is also bonded to the panel frame 1 and the top plates 2 and 3 at the same time. However, in this method, since the hot plates 4 and 5 must be constantly heated, there are problems in that thermal efficiency is poor and it takes time to raise the temperature, resulting in poor productivity.

In addition, as a dielectric bonding method, high dielectric materials 7 and 8 are attached to the surface plates 2 and 3 on both sides of the panel as shown in Figure 2.
A method has been proposed in which the press electrode plates 9 and 10 are pressed against each other through the press electrode plates 9 and 10, and a high frequency voltage of an oscillator 11 is applied between the press electrode plates 9 and 10. With this method, the high dielectric materials 7 and 8 are heated by a high frequency voltage to thermally cure the adhesive, so the temperature can be raised quickly, and the thermal efficiency can be improved by heating only during bonding. . However, since the surrounding panel frame 1 is made of metal and has high conductivity, and the internal insert 6 is non-conductive, the surface plate 2, 3
A current flows only around the periphery of the surface plates 2 and 3, and no current flows through the center portions of the surface plates 2 and 3. Therefore, the high dielectric materials 7 and 8 are locally heated only in the portion corresponding to the panel frame 1, and therefore the surface plates 2 and 3 and the internal insert 6
There was a problem in that the adhesion to the material could not be achieved well.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for adhering a panel face plate, which has good thermal efficiency, excellent productivity, and can bond the entire surface of the face plate well.

An embodiment of this invention is shown in FIG. In other words, this panel surface plate bonding method involves stacking metal surface plates 2 and 3 on both sides of the panel frame 1 and internal insert 6, which are members to be bonded, using a thermosetting adhesive. Pressed electrode plates 9 and 10 are pressed onto the surfaces of the face plates 2 and 3 via high dielectric materials 7 and 8, respectively, and a high frequency voltage is applied independently between each face plate 2 and 3 and the pressed electrode plates 9 and 10. This is a method of applying . 12 and 13 are oscillators. For example, asbestos slate is used for the high dielectric materials 7 and 8.

In this way, by applying a high frequency voltage, the high dielectric materials 7 and 8 are heated, and the thermosetting adhesive is cured, so that the surface plates 2 and 3, the panel frame 1, and the internal insert 6 are bonded together. be done. In this way, since heating is performed using a dielectric method, it is possible to apply a high frequency voltage only at the time of adhesion to perform adhesion, which has better thermal efficiency than the conventional hot press that requires constant heating. Furthermore, the temperature can be raised in a short time, resulting in good production efficiency. In addition, the surface plate 2 to be bonded,
Since power is supplied using 3 itself as an electrode, high dielectric material 7,
Heating is performed uniformly over the entire area. Therefore, the adhesive is well cured on the entire surfaces of the top plates 2 and 3, and the top plates 2 and 3 and the internal insert 6 are also reliably bonded.

As described above, the method for adhering a panel surface plate according to the present invention involves bonding a metal surface plate with an adhesive to a metal panel frame with an internal intervening material inserted. This is a method in which the thermosetting adhesive is cured by stacking electrode plates through the body and applying a high frequency voltage between the surface plate and the electrode plate to generate heat in the high dielectric material.
The temperature can be raised in a short time, so it is necessary to supply power and heat only during bonding, resulting in good thermal efficiency and productivity. Moreover, since the top plate itself is used as an electrode, the entire surface of the top plate can be uniformly heated by the high dielectric material, and therefore the adhered members can be reliably bonded over the entire surface of the top plate. .

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view showing the conventional surface plate bonding method;
FIG. 2 is a sectional view showing a proposed example of the surface plate bonding method, and FIG. 3 is a sectional view of an embodiment of the present invention. 1... Panel frame (member to be bonded), 2, 3... Surface plate, 6... Internal insert material (member to be bonded), 7, 8
...High dielectric, 9,10...Pressed electrode plate, 1
2, 13... Oscillator.

Claims (1)

[Claims] 1. A metal panel frame with internal intervening material inserted is brought into contact with a metal surface plate using a thermosetting adhesive, and an electrode is attached to the surface of this surface plate via a high dielectric material. A method for bonding a panel surface plate by stacking the plates and applying a high frequency voltage between the electrode plate and the surface plate.