JPS5698126A - Dielectric bonding of assembly panel - Google Patents

Dielectric bonding of assembly panel

Info

Publication number
JPS5698126A
JPS5698126A JP72280A JP72280A JPS5698126A JP S5698126 A JPS5698126 A JP S5698126A JP 72280 A JP72280 A JP 72280A JP 72280 A JP72280 A JP 72280A JP S5698126 A JPS5698126 A JP S5698126A
Authority
JP
Japan
Prior art keywords
panel
panels
electrode plates
frame material
pressed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP72280A
Other languages
Japanese (ja)
Inventor
Tameyoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National House Industrial Co Ltd
Original Assignee
National House Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National House Industrial Co Ltd filed Critical National House Industrial Co Ltd
Priority to JP72280A priority Critical patent/JPS5698126A/en
Publication of JPS5698126A publication Critical patent/JPS5698126A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To bond panels in a short time while preventing the radiation of heat by a method in which a specific dielectric material is covered on the periphery of panels assembled with the interposition of a thermosetting resin adhesive on the upper and lower both faces of a frame material, the panels are put between the upper and lower electrode plates, and then a high frequency voltage is applied.
CONSTITUTION: Plate materials 3 are adhered to a frame material 1 whose both sides are coated with a thermosetting resin adhesive 2 to form an assembly panel 4. Then, a dielectric material 6 having higher dielectric characteristic and heat insulation than those of the material of phenol resin, etc., for the panel 4 is pressed by mechanical pressure on the four outsides of the panel 4 and pressed from above and below by means of parallel electrode boards serving as the electrode plates 5, and then high frequency and high-voltage is applied between the electrode plates 5 to harden the adhesive 2 so as to bond between the frame material 1 and the plate materials 3.
COPYRIGHT: (C)1981,JPO&Japio
JP72280A 1980-01-08 1980-01-08 Dielectric bonding of assembly panel Pending JPS5698126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP72280A JPS5698126A (en) 1980-01-08 1980-01-08 Dielectric bonding of assembly panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP72280A JPS5698126A (en) 1980-01-08 1980-01-08 Dielectric bonding of assembly panel

Publications (1)

Publication Number Publication Date
JPS5698126A true JPS5698126A (en) 1981-08-07

Family

ID=11481632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP72280A Pending JPS5698126A (en) 1980-01-08 1980-01-08 Dielectric bonding of assembly panel

Country Status (1)

Country Link
JP (1) JPS5698126A (en)

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