JPS5699272A - Dielectric bonding method of panel - Google Patents

Dielectric bonding method of panel

Info

Publication number
JPS5699272A
JPS5699272A JP167380A JP167380A JPS5699272A JP S5699272 A JPS5699272 A JP S5699272A JP 167380 A JP167380 A JP 167380A JP 167380 A JP167380 A JP 167380A JP S5699272 A JPS5699272 A JP S5699272A
Authority
JP
Japan
Prior art keywords
panel
surface material
metal frame
auxiliary frame
superposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP167380A
Other languages
Japanese (ja)
Inventor
Tameyoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National House Industrial Co Ltd
Original Assignee
National House Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National House Industrial Co Ltd filed Critical National House Industrial Co Ltd
Priority to JP167380A priority Critical patent/JPS5699272A/en
Publication of JPS5699272A publication Critical patent/JPS5699272A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form a decorated panel economically by positioning it easily and in a short time by a method in which a surface material and a metal frame positioned through a wooden auxiliary frame and then a high frequency voltage is applied to the assembly.
CONSTITUTION: A rectangular wooden auxiliary frame 3 whose vertical pieces 3a and 3b are integrally projected toward the up and down sides of its peripheral edge is superposed on a metal frame 1 coated with a thermosetting resin adhesive 2, e.g., epoxy resin, etc., and then on the surface of the wooden auxiliary frame 3, a surface material 5 is superposed and fixed, while the metal frame 1 and the surface material 5 are respectively positioned and held by the vertical pieces 3a and 3b. Then, electrode plates 6 are provided on both sides of the assembly and then a high frequency voltage is applied between the electrodes 6 to harden the adhesive 4 in order to form a panel.
COPYRIGHT: (C)1981,JPO&Japio
JP167380A 1980-01-10 1980-01-10 Dielectric bonding method of panel Pending JPS5699272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP167380A JPS5699272A (en) 1980-01-10 1980-01-10 Dielectric bonding method of panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP167380A JPS5699272A (en) 1980-01-10 1980-01-10 Dielectric bonding method of panel

Publications (1)

Publication Number Publication Date
JPS5699272A true JPS5699272A (en) 1981-08-10

Family

ID=11508031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP167380A Pending JPS5699272A (en) 1980-01-10 1980-01-10 Dielectric bonding method of panel

Country Status (1)

Country Link
JP (1) JPS5699272A (en)

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