JPS5698127A - Bonding of metal frame panels by high frequency dielectric heating - Google Patents
Bonding of metal frame panels by high frequency dielectric heatingInfo
- Publication number
- JPS5698127A JPS5698127A JP109480A JP109480A JPS5698127A JP S5698127 A JPS5698127 A JP S5698127A JP 109480 A JP109480 A JP 109480A JP 109480 A JP109480 A JP 109480A JP S5698127 A JPS5698127 A JP S5698127A
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- high frequency
- materials
- electrode material
- frame assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To exactly bond frame materials with uniform electric field intensity for the adhesive portion by inserting a V-shaped elastic electrode material projecting from a power-feeding tool into a space between frame materials formed into the corners for a metal frame assembly and then supplying a power to the electrode material.
CONSTITUTION: Metal frame materials 4 of a U-shaped section are assembled so as to form a space 5 with the same width in the bonded portion of the frame materials 4 in four corner portions in order to form a metal frame assembly. Then, a thermosetting resin adhesive 2 is coated on the upper and lower both surfaces of the frame assembly 1, face materials 3 are laid on the upper and lower both surfaces to form metal frame panel a V-shaped elastic electrode material 7 projecting from a movable power-feeding tool 6 is inserted into the space 5 between the corners of the frame assembly 1, the metal frame panel is put between the upper and lower parallel electrodes 9, and then a high frequency current is supplied from a high frequency power source 10 to harden the adhesive 2.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP109480A JPS5698127A (en) | 1980-01-09 | 1980-01-09 | Bonding of metal frame panels by high frequency dielectric heating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP109480A JPS5698127A (en) | 1980-01-09 | 1980-01-09 | Bonding of metal frame panels by high frequency dielectric heating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5698127A true JPS5698127A (en) | 1981-08-07 |
Family
ID=11491899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP109480A Pending JPS5698127A (en) | 1980-01-09 | 1980-01-09 | Bonding of metal frame panels by high frequency dielectric heating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5698127A (en) |
-
1980
- 1980-01-09 JP JP109480A patent/JPS5698127A/en active Pending
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