JPS5698127A - Bonding of metal frame panels by high frequency dielectric heating - Google Patents

Bonding of metal frame panels by high frequency dielectric heating

Info

Publication number
JPS5698127A
JPS5698127A JP109480A JP109480A JPS5698127A JP S5698127 A JPS5698127 A JP S5698127A JP 109480 A JP109480 A JP 109480A JP 109480 A JP109480 A JP 109480A JP S5698127 A JPS5698127 A JP S5698127A
Authority
JP
Japan
Prior art keywords
metal frame
high frequency
materials
electrode material
frame assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP109480A
Other languages
Japanese (ja)
Inventor
Tameyoshi Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National House Industrial Co Ltd
Original Assignee
National House Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National House Industrial Co Ltd filed Critical National House Industrial Co Ltd
Priority to JP109480A priority Critical patent/JPS5698127A/en
Publication of JPS5698127A publication Critical patent/JPS5698127A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To exactly bond frame materials with uniform electric field intensity for the adhesive portion by inserting a V-shaped elastic electrode material projecting from a power-feeding tool into a space between frame materials formed into the corners for a metal frame assembly and then supplying a power to the electrode material.
CONSTITUTION: Metal frame materials 4 of a U-shaped section are assembled so as to form a space 5 with the same width in the bonded portion of the frame materials 4 in four corner portions in order to form a metal frame assembly. Then, a thermosetting resin adhesive 2 is coated on the upper and lower both surfaces of the frame assembly 1, face materials 3 are laid on the upper and lower both surfaces to form metal frame panel a V-shaped elastic electrode material 7 projecting from a movable power-feeding tool 6 is inserted into the space 5 between the corners of the frame assembly 1, the metal frame panel is put between the upper and lower parallel electrodes 9, and then a high frequency current is supplied from a high frequency power source 10 to harden the adhesive 2.
COPYRIGHT: (C)1981,JPO&Japio
JP109480A 1980-01-09 1980-01-09 Bonding of metal frame panels by high frequency dielectric heating Pending JPS5698127A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP109480A JPS5698127A (en) 1980-01-09 1980-01-09 Bonding of metal frame panels by high frequency dielectric heating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP109480A JPS5698127A (en) 1980-01-09 1980-01-09 Bonding of metal frame panels by high frequency dielectric heating

Publications (1)

Publication Number Publication Date
JPS5698127A true JPS5698127A (en) 1981-08-07

Family

ID=11491899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP109480A Pending JPS5698127A (en) 1980-01-09 1980-01-09 Bonding of metal frame panels by high frequency dielectric heating

Country Status (1)

Country Link
JP (1) JPS5698127A (en)

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