JPS55116773A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPS55116773A JPS55116773A JP2523179A JP2523179A JPS55116773A JP S55116773 A JPS55116773 A JP S55116773A JP 2523179 A JP2523179 A JP 2523179A JP 2523179 A JP2523179 A JP 2523179A JP S55116773 A JPS55116773 A JP S55116773A
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- component
- whole surface
- pref
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To ensure the intimate mixing of the two components of a two-pack non- solvent type, cold-curing modified acrylate adhesive, and to increase the bonding strength, by applying one of the components to the whole surface of one of the substrate to be bonded and applying the other component to the surface of the former component or to the whole surface of the other substrate to be bonded.
CONSTITUTION: One component 1a of a two-pack non-solvent type cold-curing modified acrylate adhesive is applied to the whole surface 2a of one of the substrates 2 to be bonded pref. to a thickness of ≤0.5mm, and thereafter the other component 1b of the adhesive is applied to the surface of the component 1a or to the whole surface of the other substrate 3 to be bonded to a thickness of pref. ≤0.5mm. Both faces 2a and 3a to be bonded are joined together and pressed to attain the adhesive thickness of pref. 0.1W0.3mm.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2523179A JPS55116773A (en) | 1979-03-05 | 1979-03-05 | Bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2523179A JPS55116773A (en) | 1979-03-05 | 1979-03-05 | Bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55116773A true JPS55116773A (en) | 1980-09-08 |
Family
ID=12160192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2523179A Pending JPS55116773A (en) | 1979-03-05 | 1979-03-05 | Bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55116773A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS624769A (en) * | 1985-07-02 | 1987-01-10 | Asahi Chem Ind Co Ltd | Method for laminating planar conductor board |
JPH04100878A (en) * | 1990-08-17 | 1992-04-02 | Sekisui Chem Co Ltd | Bonding method |
WO2003073158A1 (en) * | 2002-02-04 | 2003-09-04 | Mitsui Chemicals, Inc. | Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell |
-
1979
- 1979-03-05 JP JP2523179A patent/JPS55116773A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS624769A (en) * | 1985-07-02 | 1987-01-10 | Asahi Chem Ind Co Ltd | Method for laminating planar conductor board |
JPH04100878A (en) * | 1990-08-17 | 1992-04-02 | Sekisui Chem Co Ltd | Bonding method |
WO2003073158A1 (en) * | 2002-02-04 | 2003-09-04 | Mitsui Chemicals, Inc. | Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell |
JPWO2003073158A1 (en) * | 2002-02-04 | 2005-06-23 | 三井化学株式会社 | Manufacturing method of liquid crystal display cell and sealing agent for liquid crystal display cell |
CN1304892C (en) * | 2002-02-04 | 2007-03-14 | 三井化学株式会社 | Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell |
US7903230B2 (en) | 2002-02-04 | 2011-03-08 | Mitsui Chemicals, Inc. | Method for producing liquid crystal display cell and sealing agent for liquid crystal display cell |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES296913U (en) | Nontacky acrylonitrile/butadiene adhesive tape. | |
EP0350181A3 (en) | Pressure-sensitive adhesives containing an alkoxy-functional silicon compound | |
JPS55116773A (en) | Bonding method | |
DE2965140D1 (en) | Adhesives or adhesive constituents and their use for bonding two surfaces | |
ATE19645T1 (en) | PROCESS FOR PERMANENTLY STRESS-EQUALIZING JOINING OF CONSTRUCTION PARTS WITH DIFFERENT COEFFICIENTS OF EXPANSION. | |
GB2014170A (en) | Hot melt adhesive and method of bonding adherends | |
JPS5452264A (en) | Joint construction of metal and non-metal material | |
JPS54111534A (en) | Bonding of two-part adhesive | |
DE2860517D1 (en) | Curable polyurethane prepolymers, adhesive compositions containing them, a method of bonding using the adhesive compositions and the bonded articles so obtained | |
JPS51130438A (en) | Method for bonding | |
EP0253628A3 (en) | Method for manufacturing plywood sheets | |
JPS5674165A (en) | Two-pack nonmixing type acrylic adhesive composition | |
JPS5438336A (en) | Bonding method | |
JPS5232028A (en) | Method for applying two-component adhesives | |
JPS5388043A (en) | Adhesion method | |
JPS5783428A (en) | Joining structure of flexible tape | |
JPS5269443A (en) | Method for bonding solid materials to cut surfaces of columns with adh esive tapes | |
JPS57188851A (en) | Method of sealing semiconductor element | |
JPS53142445A (en) | Bonding method | |
JPS52155635A (en) | Bonding of steel plates | |
Hastie | Adhesives for Electronics | |
JPS5667637A (en) | Carpet with pad for automobile | |
JPH01181553A (en) | Side-brazed type ceramic board | |
JPS5380438A (en) | Manufacture of laminated bus bars | |
JPS57180676A (en) | Method of masking adhesive in bonding work |