JPS5690974A - Target device for sputtering - Google Patents

Target device for sputtering

Info

Publication number
JPS5690974A
JPS5690974A JP16794279A JP16794279A JPS5690974A JP S5690974 A JPS5690974 A JP S5690974A JP 16794279 A JP16794279 A JP 16794279A JP 16794279 A JP16794279 A JP 16794279A JP S5690974 A JPS5690974 A JP S5690974A
Authority
JP
Japan
Prior art keywords
back plate
sputter
anode
cathode
plural
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16794279A
Other languages
Japanese (ja)
Inventor
Shigeru Kanbara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Toyo Electronics Industry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Toyo Electronics Industry Corp filed Critical Rohm Co Ltd
Priority to JP16794279A priority Critical patent/JPS5690974A/en
Publication of JPS5690974A publication Critical patent/JPS5690974A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Abstract

PURPOSE:To enable a sputter film of arbitrary compositions to be easily formed by juxtaposing a plural of single sputter materials on the surface of a back plate. CONSTITUTION:Plural pure metals 3a, 3b constituting sputter films are uniformly dispersed on the surface 1a of a back plate 1, and these are disposed alternately or zigzag. The surface 1a of this back plate 1 is so disposed as to oppose to an anode to each other, and with the back plate 1 as cathode, voltage is applied between the anode and the cathode, whereby discharge is caused. If at this time an area ratio of the pure metals 3a, 3b are suitably changed, the sputter film by the alloy of a desired composition ratio is formed on the anode substrate to be sputtered.
JP16794279A 1979-12-24 1979-12-24 Target device for sputtering Pending JPS5690974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16794279A JPS5690974A (en) 1979-12-24 1979-12-24 Target device for sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16794279A JPS5690974A (en) 1979-12-24 1979-12-24 Target device for sputtering

Publications (1)

Publication Number Publication Date
JPS5690974A true JPS5690974A (en) 1981-07-23

Family

ID=15858902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16794279A Pending JPS5690974A (en) 1979-12-24 1979-12-24 Target device for sputtering

Country Status (1)

Country Link
JP (1) JPS5690974A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8910890B2 (en) 2010-11-24 2014-12-16 Honda Motor Co., Ltd. Seeding device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144754B1 (en) * 1971-04-15 1976-11-30
JPS53108884A (en) * 1977-03-04 1978-09-22 Nec Corp Sputtering device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144754B1 (en) * 1971-04-15 1976-11-30
JPS53108884A (en) * 1977-03-04 1978-09-22 Nec Corp Sputtering device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8910890B2 (en) 2010-11-24 2014-12-16 Honda Motor Co., Ltd. Seeding device

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