JPS5690544A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5690544A
JPS5690544A JP16724379A JP16724379A JPS5690544A JP S5690544 A JPS5690544 A JP S5690544A JP 16724379 A JP16724379 A JP 16724379A JP 16724379 A JP16724379 A JP 16724379A JP S5690544 A JPS5690544 A JP S5690544A
Authority
JP
Japan
Prior art keywords
frame
lead frame
semiconductor device
resin
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16724379A
Other languages
Japanese (ja)
Inventor
Yoshiaki Sano
Kazuya Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16724379A priority Critical patent/JPS5690544A/en
Publication of JPS5690544A publication Critical patent/JPS5690544A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate separation of an outer frame of a lead frame from a semiconductor device after placement thereof on the lead frame by means of a supporting resin piece fastened on both sides of the device simultaneously with the sealing of the resin for the placement. CONSTITUTION:A lead frame is composed of a stage 7 for carrying a semiconductor device 1, a lead extending along both the ends thereof, an outer frame 3 for supporting all said components. Then, after the device 1 is fastened on the stage 7 of the frame positioning, electrodes thereof are separately connected to the leads 2 and the positioning section of the device 1 is separated from the outside end of the leads 2 to make in dependent parts. In such an arrangement, a supporting resin piece 8 is provided projecting on both sides of the device by using the resin sealed as it is in such a manner as to be thicker gradually and then, fixed on the outer frame 3. Accordingly, the separation of the device from the lead frame can be done simply by pressing the piece 8.
JP16724379A 1979-12-22 1979-12-22 Production of semiconductor device Pending JPS5690544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16724379A JPS5690544A (en) 1979-12-22 1979-12-22 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16724379A JPS5690544A (en) 1979-12-22 1979-12-22 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5690544A true JPS5690544A (en) 1981-07-22

Family

ID=15846106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16724379A Pending JPS5690544A (en) 1979-12-22 1979-12-22 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5690544A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139712A (en) * 1982-10-12 1984-08-10 Nippon Dempa Kogyo Co Ltd Production of chip type crystal oscillator
JPH02206153A (en) * 1989-02-06 1990-08-15 Rohm Co Ltd Manufacture of semiconductor component and lead frame used therefor
DE10109936B3 (en) * 2001-02-26 2005-02-24 Infineon Technologies Ag Separating packaged electronic component involves pulling apart or compressing system carrier band with tool near mechanical bridges while allowing separated electronic component out of band

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139712A (en) * 1982-10-12 1984-08-10 Nippon Dempa Kogyo Co Ltd Production of chip type crystal oscillator
JPH0229246B2 (en) * 1982-10-12 1990-06-28 Nippon Denpa Kogyo Kk
JPH02206153A (en) * 1989-02-06 1990-08-15 Rohm Co Ltd Manufacture of semiconductor component and lead frame used therefor
JP2617218B2 (en) * 1989-02-06 1997-06-04 ローム株式会社 Semiconductor component manufacturing method and lead frame used in the manufacturing method
DE10109936B3 (en) * 2001-02-26 2005-02-24 Infineon Technologies Ag Separating packaged electronic component involves pulling apart or compressing system carrier band with tool near mechanical bridges while allowing separated electronic component out of band

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