JPS5793557A - Lead frame for integrated circuit device - Google Patents

Lead frame for integrated circuit device

Info

Publication number
JPS5793557A
JPS5793557A JP17007380A JP17007380A JPS5793557A JP S5793557 A JPS5793557 A JP S5793557A JP 17007380 A JP17007380 A JP 17007380A JP 17007380 A JP17007380 A JP 17007380A JP S5793557 A JPS5793557 A JP S5793557A
Authority
JP
Japan
Prior art keywords
lead frame
frames
integrated circuit
surrounded
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17007380A
Other languages
Japanese (ja)
Inventor
Shinji Kobayashi
Tomoichi Oku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17007380A priority Critical patent/JPS5793557A/en
Publication of JPS5793557A publication Critical patent/JPS5793557A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To form a lead frame capable of coping with the increase in the number of pins by providing two thick outer frames extending in parallel with each other and a plurality of die stages internally surrounded by a support connected between the frames. CONSTITUTION:A plurality of die stages 1 surrounded by an inner lead unit 13 connected to an external lead unit 4 at the tie bar are provided in the interior surrounded by two thick outer frames 6 extending in parallel with each other and a support 6 connected between the frames. Thus, a lead frame capable of copying with the increase in the number of pins without using fine and slender lead can be obtained, and can reduce the cost and can improve the quality thereof.
JP17007380A 1980-12-02 1980-12-02 Lead frame for integrated circuit device Pending JPS5793557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17007380A JPS5793557A (en) 1980-12-02 1980-12-02 Lead frame for integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17007380A JPS5793557A (en) 1980-12-02 1980-12-02 Lead frame for integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5793557A true JPS5793557A (en) 1982-06-10

Family

ID=15898129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17007380A Pending JPS5793557A (en) 1980-12-02 1980-12-02 Lead frame for integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5793557A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032542A (en) * 1988-11-18 1991-07-16 Sanyo Electric Co., Ltd. Method of mass-producing integrated circuit devices using strip lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032542A (en) * 1988-11-18 1991-07-16 Sanyo Electric Co., Ltd. Method of mass-producing integrated circuit devices using strip lead frame

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