JPS5478087A - Manufacture of semiconductor - Google Patents

Manufacture of semiconductor

Info

Publication number
JPS5478087A
JPS5478087A JP14509277A JP14509277A JPS5478087A JP S5478087 A JPS5478087 A JP S5478087A JP 14509277 A JP14509277 A JP 14509277A JP 14509277 A JP14509277 A JP 14509277A JP S5478087 A JPS5478087 A JP S5478087A
Authority
JP
Japan
Prior art keywords
container
lead
leads
external frame
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14509277A
Other languages
Japanese (ja)
Other versions
JPS6131625B2 (en
Inventor
Kazuo Oizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14509277A priority Critical patent/JPS5478087A/en
Publication of JPS5478087A publication Critical patent/JPS5478087A/en
Publication of JPS6131625B2 publication Critical patent/JPS6131625B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent deformation with the fixing between a container and external frame made tight by inserting a grounding lead unitized with the external frame of a lead frame into an IC-element resin sealing container with a protruding electrode extraction lead and by sealing a lead, unitized with the container and disconnected from the element, in the container in addition to the grounding lead.
CONSTITUTION: In container 11a of epoxy resin, IC element 11 is sealed and electrode extraction leads 11b and 11b' are made to protrude from the side surface of container 11a. Next, grounding leads 11d and 11d' unitized with external frame 21 of the lead frame are inserted into container 11a and connected together, and container 11a is fixed to lead frames. Further, leads 11c and 11c' unitized with external frame 21 of the frame are inserted into container 11a, but disconnected from the electrode of element 11 because leads are for tightening the fixing between container 11a and external frame 21. In this constitution, these leads are connected to the socket to measure electric characteristics and after the measurement, press cutting between external frame 21 and all of leads is achieved to separate it into ICs.
COPYRIGHT: (C)1979,JPO&Japio
JP14509277A 1977-12-05 1977-12-05 Manufacture of semiconductor Granted JPS5478087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14509277A JPS5478087A (en) 1977-12-05 1977-12-05 Manufacture of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14509277A JPS5478087A (en) 1977-12-05 1977-12-05 Manufacture of semiconductor

Publications (2)

Publication Number Publication Date
JPS5478087A true JPS5478087A (en) 1979-06-21
JPS6131625B2 JPS6131625B2 (en) 1986-07-21

Family

ID=15377185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14509277A Granted JPS5478087A (en) 1977-12-05 1977-12-05 Manufacture of semiconductor

Country Status (1)

Country Link
JP (1) JPS5478087A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170233A (en) * 1981-04-15 1982-10-20 Japan Radio Ueda Co Ltd Ultrasonic probe for ultrasonic diagnosis
EP1329952A3 (en) * 2002-01-21 2009-03-04 W.C. Heraeus GmbH Method for fixing chip carriers

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63105847A (en) * 1986-10-23 1988-05-11 Nippon Telegr & Teleph Corp <Ntt> Assembly device for optical connector

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53108368A (en) * 1977-03-04 1978-09-21 Hitachi Ltd Manufacture for resin seal type semiconductor device and its lead frame for its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53108368A (en) * 1977-03-04 1978-09-21 Hitachi Ltd Manufacture for resin seal type semiconductor device and its lead frame for its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170233A (en) * 1981-04-15 1982-10-20 Japan Radio Ueda Co Ltd Ultrasonic probe for ultrasonic diagnosis
EP1329952A3 (en) * 2002-01-21 2009-03-04 W.C. Heraeus GmbH Method for fixing chip carriers

Also Published As

Publication number Publication date
JPS6131625B2 (en) 1986-07-21

Similar Documents

Publication Publication Date Title
EP0069901A3 (en) Current rectifier module
JPS5478087A (en) Manufacture of semiconductor
JPS51112174A (en) The indicator
JPS52127756A (en) Semiconductor unit
JPS5645054A (en) Resin sealing semiconductor device
JPS54152966A (en) Manufacture of semiconductor integrated-circuit device
JPS53117378A (en) Assembling device of semiconductor device
JPS5487474A (en) Semiconductor device
JPS6480051A (en) Electric device
JPS5415101A (en) Small-sized mold motor
JPS5333574A (en) Semiconductor integrated circuit package
JPS5690544A (en) Production of semiconductor device
JPS54103668A (en) Electronic gun assembly
JPS53124795A (en) Waterproofing means for connector
JPS54579A (en) Resin seal semiconductor device
JPS53124998A (en) Liquid crystal display device
JPS5518043A (en) Integrated circuit device
JPS55159185A (en) Oscillator module of crystal watch
JPS5487476A (en) Resin-sealed type semiconductor device
JPS5310272A (en) Ic unit of electronic watch
JPS5414674A (en) Lead fram an resin-sealed electronic parts using it
JPS5449070A (en) Container for semiconductor device
JPS6476744A (en) Resin sealed semiconductor device
JPS55166944A (en) Lead frame for semiconductor device
JPS5745964A (en) Manufacture of hybrid integrated circuit