JPS5478087A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPS5478087A JPS5478087A JP14509277A JP14509277A JPS5478087A JP S5478087 A JPS5478087 A JP S5478087A JP 14509277 A JP14509277 A JP 14509277A JP 14509277 A JP14509277 A JP 14509277A JP S5478087 A JPS5478087 A JP S5478087A
- Authority
- JP
- Japan
- Prior art keywords
- container
- lead
- leads
- external frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent deformation with the fixing between a container and external frame made tight by inserting a grounding lead unitized with the external frame of a lead frame into an IC-element resin sealing container with a protruding electrode extraction lead and by sealing a lead, unitized with the container and disconnected from the element, in the container in addition to the grounding lead.
CONSTITUTION: In container 11a of epoxy resin, IC element 11 is sealed and electrode extraction leads 11b and 11b' are made to protrude from the side surface of container 11a. Next, grounding leads 11d and 11d' unitized with external frame 21 of the lead frame are inserted into container 11a and connected together, and container 11a is fixed to lead frames. Further, leads 11c and 11c' unitized with external frame 21 of the frame are inserted into container 11a, but disconnected from the electrode of element 11 because leads are for tightening the fixing between container 11a and external frame 21. In this constitution, these leads are connected to the socket to measure electric characteristics and after the measurement, press cutting between external frame 21 and all of leads is achieved to separate it into ICs.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14509277A JPS5478087A (en) | 1977-12-05 | 1977-12-05 | Manufacture of semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14509277A JPS5478087A (en) | 1977-12-05 | 1977-12-05 | Manufacture of semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5478087A true JPS5478087A (en) | 1979-06-21 |
JPS6131625B2 JPS6131625B2 (en) | 1986-07-21 |
Family
ID=15377185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14509277A Granted JPS5478087A (en) | 1977-12-05 | 1977-12-05 | Manufacture of semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5478087A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57170233A (en) * | 1981-04-15 | 1982-10-20 | Japan Radio Ueda Co Ltd | Ultrasonic probe for ultrasonic diagnosis |
EP1329952A3 (en) * | 2002-01-21 | 2009-03-04 | W.C. Heraeus GmbH | Method for fixing chip carriers |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63105847A (en) * | 1986-10-23 | 1988-05-11 | Nippon Telegr & Teleph Corp <Ntt> | Assembly device for optical connector |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53108368A (en) * | 1977-03-04 | 1978-09-21 | Hitachi Ltd | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture |
-
1977
- 1977-12-05 JP JP14509277A patent/JPS5478087A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53108368A (en) * | 1977-03-04 | 1978-09-21 | Hitachi Ltd | Manufacture for resin seal type semiconductor device and its lead frame for its manufacture |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57170233A (en) * | 1981-04-15 | 1982-10-20 | Japan Radio Ueda Co Ltd | Ultrasonic probe for ultrasonic diagnosis |
EP1329952A3 (en) * | 2002-01-21 | 2009-03-04 | W.C. Heraeus GmbH | Method for fixing chip carriers |
Also Published As
Publication number | Publication date |
---|---|
JPS6131625B2 (en) | 1986-07-21 |
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