JPS59139712A - Production of chip type crystal oscillator - Google Patents
Production of chip type crystal oscillatorInfo
- Publication number
- JPS59139712A JPS59139712A JP17875582A JP17875582A JPS59139712A JP S59139712 A JPS59139712 A JP S59139712A JP 17875582 A JP17875582 A JP 17875582A JP 17875582 A JP17875582 A JP 17875582A JP S59139712 A JPS59139712 A JP S59139712A
- Authority
- JP
- Japan
- Prior art keywords
- crystal oscillator
- type crystal
- oscillator
- chip type
- crystal resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 abstract description 7
- 239000012778 molding material Substances 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は大量生産に適するチップ形水晶振動子の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a chip-type crystal resonator suitable for mass production.
第１図は従来の音叉形水晶振動子の一例を示す図で２本
の端子１，２を植設したペース３に音叉形の振動子本体
４の下端面を固着している。FIG. 1 shows an example of a conventional tuning-fork crystal resonator, in which the lower end surface of a tuning-fork-shaped resonator main body 4 is fixed to a pitch 3 in which two terminals 1 and 2 are implanted.
そしてこの振動子本体４に形成した電極を導電性接着剤
等によ＼って、上記端子１，２に電気的に接続している
。さらにこの振動子本体４に図示破線で示すようにケー
ス６をかぶせその開口をペース３に−・ンダ等によって
気密に封止するようにしている。The electrodes formed on the vibrator body 4 are electrically connected to the terminals 1 and 2 using a conductive adhesive or the like. Further, the vibrator main body 4 is covered with a case 6 as shown by broken lines in the figure, and the opening thereof is hermetically sealed with a paste 3 or the like.
ところで近時、種々の電子機器の組立て工程を自動化す
ることが望まれ、このために抵抗、コンデンサ、半導体
素子等の電子部品をチップ化することが打力われている
。このようにチ。Nowadays, it is desired to automate the assembly process of various electronic devices, and for this purpose, efforts are being made to make electronic components such as resistors, capacitors, and semiconductor elements into chips. Like this.
！化した所謂チップ部品では、所望の部品を内蔵するチ
ップの表面に所要数の導体部を形成しこの導体部に部品
のリード線を電気的に接続している。そしてこのような
チップ部品を予め所望の電気回路を構成する配線パター
ンを形成した印刷配線基板の７２ターン上に載置する。! In today's so-called chip components, a required number of conductor portions are formed on the surface of a chip containing a desired component, and lead wires of the component are electrically connected to the conductor portions. Then, such a chip component is placed on 72 turns of a printed wiring board on which a wiring pattern constituting a desired electric circuit has been formed in advance.
そして両者の接合部に−・ンダクリーム等を塗布し、熱
線、熱風叫によシフリームを溶融させた彼、固化させ、
チップ部品の導体部を上記パターンに接続するとともに
機械的に保持するようにしている。したがって、このよ
うな組立て方法によれば部品を、供給装置、たとえばパ
ーツフィーダ等によル配線基板上の所定位置へ自動的に
載置することができる。このために、従来、行なわれて
いるような配線基板に穿設した部品取付穴へ部品のリー
ド線を挿通し、このリード線を所定長に切断して基板の
裏面からハンダ付けするものに比して自動化を容易に行
なえそれによってコストを著るしく低減することができ
る。Then, he applied Nada Cream etc. to the joint between the two, melted it using heat rays and hot air, and solidified it.
The conductor portion of the chip component is connected to the pattern and is also mechanically held. Therefore, according to such an assembly method, components can be automatically placed at predetermined positions on the wiring board using a supply device such as a parts feeder. This is compared to the conventional method of inserting component lead wires into component mounting holes drilled in the wiring board, cutting the lead wires to a predetermined length, and soldering them from the back of the board. can be easily automated, thereby significantly reducing costs.
このために種々の電子回路に広く用いられている水晶振
動子もチ、ゾ化し、作業の効率を向上することが望まれ
ている。しかしながらこの種の水晶振動子は形状が小型
で、たとえば直径３１１１１長さ８ｍｌ程度のケースに
収納しているために作業性が悪くコストの上昇、均一な
仕上りを得難い等の問題があった。For this reason, it is desired that crystal oscillators widely used in various electronic circuits also be made into chisels and zoons to improve work efficiency. However, this type of crystal oscillator is small in size, and is housed in a case with a diameter of 31111 and a length of 8 ml, for example, resulting in problems such as poor workability, increased cost, and difficulty in obtaining a uniform finish.
本発明は上記の事情に鑑みてなされたもので、流れ作業
によって製造工程を構成でき生産性が良好で大量生産に
適するチップ形水晶振動子の製造方法を提供することを
目的とするもやである。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method for manufacturing a chip-type crystal resonator that can configure the manufacturing process by assembly-line operations, has good productivity, and is suitable for mass production. be.
以下本発明の一実施例を第２図に示す図面を参照して詳
細に説明する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawing shown in FIG.
第２図において１ノは、たとえば図示しないリールから
送シ出されて矢示Ａ方向へ送行する一対の金属帯である
。そして１２は、たとえば第１図に示すように円筒形の
金属ケースに収納した水晶振動子である。そしてこの水
晶振動子１２の端子１３をスポット溶接等によって各金
属帯１１に溶接する。なおこのステ、ト溶接は金属帯１
１と端子１３とを電極１４で挾持し、ここに大電流を流
しこの際に発生するジュール熱によシ溶接を行なう。し
たがって金属帯１ノとしては電気的な抵抗の大きい鉄、
コバルト等を用いるととが好ましい。そして金属帯１１
に端子１３をスポット溶接した水晶振動子１２を上記金
属帯１１の非溶接側の板面が外部に露出するようにエポ
キシ樹脂、ポリイミド樹脂等の合成樹脂からなるモール
ド材１５でモールドする。In FIG. 2, reference numeral 1 denotes a pair of metal bands that are fed out from a reel (not shown) and fed in the direction of arrow A, for example. 12 is a crystal resonator housed in a cylindrical metal case, as shown in FIG. 1, for example. Then, the terminals 13 of this crystal resonator 12 are welded to each metal band 11 by spot welding or the like. Note that this step and step welding are performed on metal strip 1.
1 and the terminal 13 are held between the electrodes 14, and a large current is passed therethrough to perform welding using the Joule heat generated at this time. Therefore, iron, which has a high electrical resistance, should be used as the first metal strip.
It is preferable to use cobalt or the like. and metal band 11
The crystal resonator 12 with terminals 13 spot-welded thereon is molded with a molding material 15 made of synthetic resin such as epoxy resin or polyimide resin so that the non-welded surface of the metal band 11 is exposed to the outside.
なおこのモールド工程においてモールド材１５の外形形
状を均一に成形するために図示しないモールド型内でモ
ールドするようＫしてもよい。In this molding process, the mold material 15 may be molded in a mold (not shown) in order to have a uniform outer shape.
そして金属帯１１に連なるモールドした水晶振動子１２
を個々にシャー１６で切断して、チップ型水晶振動子１
７を得る。And a molded crystal oscillator 12 connected to the metal band 11
are individually cut with a shear 16 to form a chip-type crystal resonator 1.
Get 7.
なお各工程における加工は金属帯１ノの走行速度に同期
して行なうことによシ流れ作業として行なえ、かつ最終
工程でシャー１６により各チップ型水晶振動子１７を切
離すようにしているので金属帯１ノをガイド兼搬送具と
して利用でき合理的である。したがって大量生産に適し
、安価かつ均一な特性のチップ型水晶振動子１７を得ら
れる。また水晶振動子１２の端子１３をスポット溶接に
よって金属帯１１７／Ｃ溶接するようにしているので溶
接部品の機械的な強度も優れかつ溶接時の発熱も局部的
なために水晶振動子が損傷することもない。The processing in each step can be carried out in synchronization with the traveling speed of the metal strip 1, so that it can be carried out as assembly work, and in the final step, each chip type crystal resonator 17 is separated by the shear 16, so that the metal It is reasonable that the belt 1 can be used as a guide and a conveyor. Therefore, it is possible to obtain a chip-type crystal resonator 17 that is suitable for mass production, is inexpensive, and has uniform characteristics. In addition, since the terminals 13 of the crystal resonator 12 are welded to the metal strip 117/C by spot welding, the mechanical strength of the welded parts is excellent, and the heat generated during welding is localized, so the crystal resonator is not damaged. Not at all.
なお本発明は上記実施例に限定されるもので杜なく、た
とえば１枚の金属帯１８に対してプレス加工等によって
孔′１９を穿設し、ここに水晶振動子１２を配置しその
端子１３をス／、）溶接によシ金属帯１８に溶接す、る
ようにしてもよい。この場合もモールド材１５でモール
ド後、切断することによシチッメ型水晶振動子１３を得
ることは勿論である。Note that the present invention is not limited to the above-mentioned embodiments, and for example, a hole '19 is formed in one metal band 18 by press working or the like, and the crystal resonator 12 is placed in the hole '19. The metal strip 18 may be welded to the metal strip 18 by welding. In this case as well, it goes without saying that by molding with the molding material 15 and cutting, the cut-out type crystal resonator 13 can be obtained.
以上詳述したように本発明は連続的に走行する金属帯に
水晶振動子の端子をスポット溶接し、この後金属帯の少
なくとも一部分を外部に露出してモールドし、さらに各
水晶振動子毎に金属帯を切断するようにしたものである
。したがって、大量生産に適し、安価に均一な特性のチ
。As detailed above, the present invention spot-welds the terminals of the crystal oscillators to a continuously running metal strip, then molds the metal strip with at least a portion exposed to the outside, and then It is designed to cut metal strips. Therefore, it is suitable for mass production and has uniform characteristics at low cost.
ゾ型水晶振動子を得ることができるチップ型水晶振動子
の製造方法を提供できる。It is possible to provide a method for manufacturing a chip-type crystal resonator that can obtain a zo-type crystal resonator.
第１図は水晶振動子の一例を示す斜視図、第２図は本発
明の方法の一実施例を説明する図、第３図は本発明の方
法の他の実施例を説明する図である。
ＩＩ・・・金属帯、１２・・・水晶振動子、１３・・・
端子、１４・・・電極、１５・・・モールド材、１６・
・・シャー、１７・・・チップ型水晶振動子。FIG. 1 is a perspective view showing an example of a crystal oscillator, FIG. 2 is a diagram explaining one embodiment of the method of the present invention, and FIG. 3 is a diagram explaining another embodiment of the method of the present invention. . II...Metal band, 12...Crystal resonator, 13...
Terminal, 14... Electrode, 15... Mold material, 16.
...Shar, 17...Chip type crystal resonator.
Claims (1)
的に走行する金属帯に接続する工程と、上記水晶振動子
を上記金属帯の少なくとも一部分を外部に露出してモー
ルドする工程と、上記金属帯を各水晶振動子毎に切断す
る工程からなるチ、ｆ形水晶振動子の製造方法。a step of connecting terminals of a crystal resonator whose main body is housed in a case to a continuously running metal band; a step of molding the crystal resonator with at least a portion of the metal band exposed to the outside; A method for manufacturing an F-type crystal oscillator comprising the step of cutting a metal band into each crystal oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17875582A JPS59139712A (en) | 1982-10-12 | 1982-10-12 | Production of chip type crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17875582A JPS59139712A (en) | 1982-10-12 | 1982-10-12 | Production of chip type crystal oscillator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59139712A true JPS59139712A (en) | 1984-08-10 |
| JPH0229246B2 JPH0229246B2 (en) | 1990-06-28 |
Family
ID=16054024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17875582A Granted JPS59139712A (en) | 1982-10-12 | 1982-10-12 | Production of chip type crystal oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59139712A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234410A (en) * | 1985-08-07 | 1987-02-14 | Meidensha Electric Mfg Co Ltd | Manufacture of crystal resonator |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826838U (en) * | 1971-08-03 | 1973-03-31 | ||
| JPS50155264A (en) * | 1974-06-05 | 1975-12-15 | ||
| JPS5484993A (en) * | 1977-12-19 | 1979-07-06 | Matsushita Electric Ind Co Ltd | Armor method of electric parts |
| JPS5540754U (en) * | 1978-09-11 | 1980-03-15 | ||
| JPS5546638A (en) * | 1978-09-28 | 1980-04-01 | Matsushima Kogyo Co Ltd | Manufacture of piezoelectric vibrator |
| JPS55104113A (en) * | 1979-02-02 | 1980-08-09 | Citizen Watch Co Ltd | Manufacture for crystal oscillator |
| JPS55138221A (en) * | 1979-04-10 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Chip type electronic component and method of manufacturing same |
| JPS5641382U (en) * | 1979-09-05 | 1981-04-16 | ||
| JPS5690544A (en) * | 1979-12-22 | 1981-07-22 | Fujitsu Ltd | Production of semiconductor device |
| JPS56137443U (en) * | 1980-03-17 | 1981-10-17 | ||
| JPS5745221A (en) * | 1980-08-29 | 1982-03-15 | Elna Co Ltd | Chip type electrolytic condenser |
| JPS5789320A (en) * | 1980-11-22 | 1982-06-03 | Murata Mfg Co Ltd | Piezoelectric parts and their production |
| JPS57190312A (en) * | 1981-05-18 | 1982-11-22 | Elna Co Ltd | Method of producing chip type electrolytic condenser |
-
1982
- 1982-10-12 JP JP17875582A patent/JPS59139712A/en active Granted
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826838U (en) * | 1971-08-03 | 1973-03-31 | ||
| JPS50155264A (en) * | 1974-06-05 | 1975-12-15 | ||
| JPS5484993A (en) * | 1977-12-19 | 1979-07-06 | Matsushita Electric Ind Co Ltd | Armor method of electric parts |
| JPS5540754U (en) * | 1978-09-11 | 1980-03-15 | ||
| JPS5546638A (en) * | 1978-09-28 | 1980-04-01 | Matsushima Kogyo Co Ltd | Manufacture of piezoelectric vibrator |
| JPS55104113A (en) * | 1979-02-02 | 1980-08-09 | Citizen Watch Co Ltd | Manufacture for crystal oscillator |
| JPS55138221A (en) * | 1979-04-10 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Chip type electronic component and method of manufacturing same |
| JPS5641382U (en) * | 1979-09-05 | 1981-04-16 | ||
| JPS5690544A (en) * | 1979-12-22 | 1981-07-22 | Fujitsu Ltd | Production of semiconductor device |
| JPS56137443U (en) * | 1980-03-17 | 1981-10-17 | ||
| JPS5745221A (en) * | 1980-08-29 | 1982-03-15 | Elna Co Ltd | Chip type electrolytic condenser |
| JPS5789320A (en) * | 1980-11-22 | 1982-06-03 | Murata Mfg Co Ltd | Piezoelectric parts and their production |
| JPS57190312A (en) * | 1981-05-18 | 1982-11-22 | Elna Co Ltd | Method of producing chip type electrolytic condenser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234410A (en) * | 1985-08-07 | 1987-02-14 | Meidensha Electric Mfg Co Ltd | Manufacture of crystal resonator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0229246B2 (en) | 1990-06-28 |
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