JPS58215111A - Chip form crystal oscillator - Google Patents

Abstract

PURPOSE:To form a chip form crystal oscillator whose characteristic is not deteriorated even at high temperature, by forming the entire shape as chip for making the element suitable for an automatic assembling process. CONSTITUTION:The crystal oscillator 11 is contained in a cylindrical case, and tuned to a desired resonance frequency with terminals 11a, 11b led out. Further, a holding base 12 is formed as a channel shape as a whole. Then, the crystal oscillator 11 is inserted to a notch 12a between the said arms from the front side and the terminals 11a, 11b are led out to the base side. Further, the conductor foil on the front and back side of the holding base 12 is split into a pair of conductors 12b, 12c at the center of the base so as to be soldered to the terminals 11a, 11b respectively. Moreover, notches 12d, 12e are formed in the broadwise direction at the tip of the said arms so as to connect the conductors on the front and back plate sides mutually. In this way, the so-called chip component where the pair of conductors 12b, 12c at the back side of the holding base 12 are exposed externally is formed. Thus, the conductors 12b, 12c are placed on a pattern of a printed wiring board forming a prescribed circuit, for attaining electric connection of both and mechanical holding.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped crystal resonator having a chip shape. .

FIG. 1 shows an example of a conventional tuning-fork crystal resonator, in which the lower end surface of a tuning-fork-shaped resonator main body 4 is placed on a base 3 on which two terminals t and 2 are implanted.

Then, the electrodes of the vibrator main body 4C are electrically connected to the terminals 1.2 using a conductive adhesive or the like C.

Connected. Furthermore, as shown by the broken line in the figure, this vibrator main body 4C2 is covered with a case 6, and its opening is hermetically sealed with paste 3I solder etc. It is desired to automate the assembly process of towers, and for this purpose, heavy components such as C2 resistors, capacitors, and semiconductor elements are being made into chips. A required number of conductor parts are formed on the surface C2 of the chip containing the components, and the lead wires of the two parts are electrically connected to each other. On the pattern of the printed wiring board that has formed the wiring pattern to be configured C; O to be placed; Connect the conductor parts of the pattern C2 and mechanically hold the pattern C1.
Therefore, according to such an assembly method 12, parts can be automatically placed at a predetermined position on a wiring board from a parts supply device, a so-called parts feeder, etc. For this purpose, as is conventionally done, the lead wires of the components are inserted into the component mounting holes drilled in the wiring board.2. This lead wire is cut to a predetermined length C and soldered from the back side of the board, but automation is easier than that.
Therefore, it is possible to significantly reduce the cost.Therefore, it is desired that crystal resonators, which are widely used in various electronic circuits, be made into chips to improve assembly efficiency. However, it has been difficult to make a crystal resonator into a chip because it is thermally and mechanically extremely delicate. In other words, the resonant frequency of the crystal resonator has an extremely high quotient accuracy c
However, the holding state and the connection state between the terminals will change.For example, if high temperature is applied to this type of crystal unit f2, the seal at the joint between the base 3 and case 5 will break and air will leak out. There have been problems such as infiltration and oxidation of the electrodes of the vibrator body 4, resulting in lead formation over time, or contact with the vibrator body 4 due to misalignment of the case 5, which significantly impairs vibration characteristics.Especially in chip parts. Since the parts are connected by melting the soldered parts using hot wire, hot air, etc., the whole part is exposed to a higher temperature than in conventional soldering, so the same heat resistance is desired.

Therefore, the crystal resonator is housed in a case made of ceramic, etc., which has relatively good insulation properties and is extremely soft.
It is also being considered to make it into a chip. However, ceramic molded products.

The cost is high, and when used in a relatively inexpensive vibrator, the overall cost increases significantly.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a chip-shaped crystal resonator that can obtain good heat resistance, low cost, stable performance, and is suitable for mass production. This is the purpose. Hereinafter, one embodiment of the present invention will be described in detail with reference to the oblique diagram shown in FIG.

Heishin II is a crystal oscillator, and the analogy is as follows:
2 cylindrical case housing, terminal Z7a.

11b is derived and tuned to a desired resonance frequency. Reference numerals 0 and 12 are holding substrates, which consist of a so-called wiring board on which conductor foil such as copper foil is pasted on the front and back plate surfaces of insulation insulation, and the base and Arms are provided that extend parallel to each other from this base.

The entire body is formed into a U-shape ◎Then, the crystal resonator 11 is fitted from the front side into the arm bent notch 12a, and the terminal 1
1fa and llb are led out to the base side. The conductor foils on the front and back surfaces of this holding board 12 are divided at the center of the base to form a pair of conductor portions 12b.

12C, where the terminals 77a and 77b are connected.
C2 is made so as to solder them respectively.

72e is Y, and a varnish through-hole treatment, a conductive paste, etc. are applied thereto to connect the conductive parts on the front and back surfaces to each other. Further, the front side of the holding substrate 12 is molded with a molding material 7.9 made of synthetic resin such as epoxy resin or polyimide resin to form a 62 cube as shown by the broken line in FIG. By performing C2 in this manner, only the pair of conductor parts tzb and tzc on the back side of the holding board 12 can constitute a so-called chip component that is exposed to the outside. Therefore, the conductor part 12
B, I2c are placed on C2 on the pattern of the printed wiring board constituting a predetermined circuit, and C2 solder cream or the like is applied thereto and heated to establish a "nausea" connection between the two (2 machine). In addition, the heat applied in such an assembly process is transmitted through the insulating material layer of the holding substrate 12, which has a low thermal conductivity, and then through the molding material 13 made of vinyl synthetic resin. Case C of the transducer II - reaching ≦ two mouths Therefore, the transducer II is in a thermally insulated state (maintained), and its surface area is increased by the molding material 7JC, from which most of the heat is radiated. Together with that.

Temperature rise of the vibrator itself can be efficiently suppressed. Note that the above-mentioned notch 72a may be pressurized with a semi-hardened material to form a recess, for example, when the base h12 is made of epoxy material. l/'.

As described in detail above (2) the present invention has a front and back plate surface C; an insulating material C having a conductor foil; If you divide and connect the
2.The conductor foil on the back plate surface connected to the 2nd side is exposed to the outside and is molded with 2-mold material. It is possible to provide a chip-type crystal oscillator that is suitable for this process and whose characteristics do not deteriorate due to commercial temperature C2.

[Brief explanation of the drawing]

Figure 1 is a perspective view of an example of a crystal resonator, Figure 2 is a perspective view showing an embodiment of the present invention, and Figure 3 is a perspective view of the holding substrate of the above embodiment. II...Crystal resonator, 12...Holding board, 13...
・Mold material, Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 3 Commissioner of the Patent Office Kazuo Wakasugi 1. Description of the case Japanese Patent Application No. 57-97395 2 Name of the invention Chip-type crystal oscillator 3 Person making the amendment Relationship to the case Patent applicant Nippon'Sakko Kogyo Co., Ltd. 4 Agent 6 Subject of the amendment ( 1) Amend the power of attorney as shown in the attached sheet. (2) Engraving of the specification (no changes to the contents). Procedural amendment Aゎψ7. Information, -98 Kazuo Wakasugi, Commissioner of the Japan Patent Office1, Indication of the case, Patent Application No. 1987-973952, Title of the invention, Chip-type crystal oscillator 3, Person making the amendment, Relationship with the case, Patent applicant: Nippon Dempa Kogyo Co., Ltd. 4, Agent 6, Specification subject to amendment, Drawing/'h'b Q+, \ 7, Contents of amendment (1) In the 16th line of page 5 of the specification, `` is divided at the center of the base. The phrase ``a pair'' should be corrected to ``a pair'' divided at the center of the base and leaving a predetermined gap at the edge of the notch 12m, for example, as shown in Figure $2. (2) Figure 2 of the drawing is corrected as shown in the attached sheet.

Claims (1)

[Claims] When storing the 0BIkIJ child body inside the case, ζ-
A crystal oscillator whose electrodes on the oscillator body are led out to the outside of the case through terminals, and 1.
4! The above-mentioned crystal oscillator is fitted into the notch formed by the remaining part made of A-rutted material and a pair of arm parts led out in the same direction from this base, and the conductor foil on the top surface is arranged according to the number of terminals mentioned above. Connect the above terminals of 6 conductor parts formed by dividing them respectively, and electrically connect the corresponding conductor part of the divided back plate surface with C2 on the top plate surface. A holding board that connects the connecting part, and the holding board and the crystal resonator are integrated into one C while leaving the conductor part on the surface of the top plate exposed to the outside.
Ruterra 1 type crystal oscillator equipped with Nimold 1, Rui 7, and Rudo material.