JPS61214442A - Formation of lead wire - Google Patents

Formation of lead wire

Info

Publication number
JPS61214442A
JPS61214442A JP60054937A JP5493785A JPS61214442A JP S61214442 A JPS61214442 A JP S61214442A JP 60054937 A JP60054937 A JP 60054937A JP 5493785 A JP5493785 A JP 5493785A JP S61214442 A JPS61214442 A JP S61214442A
Authority
JP
Japan
Prior art keywords
lead wire
wire
electrode
forming
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60054937A
Other languages
Japanese (ja)
Inventor
Masanobu Horii
堀井　政信
Yutaka Makino
豊 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60054937A priority Critical patent/JPS61214442A/en
Publication of JPS61214442A publication Critical patent/JPS61214442A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To meet the variation of a kind of the title object by presetting a pitch and an attaching direction for each lead wire formed on an electrode. CONSTITUTION:A lead wire 1 is fed by a wire feeding means 2 as far as the front end of wire 1 comes right under an iron 9. A substrate 6 is moved by an X-Y table 7 and an electrode 5 is positioned right under the front end of lead wire 1 and the iron. If an attaching direction of the lead wire 1 changes, the substrate is moved by the X-Y table 7 as well as it is rotated by a theta-table 8 to preset the attaching direction. A cutter chuck 3 and a cutter acceptor 4 chuck the lead wire 1 and lower to cut the lead wire 1 into a predetermined length and position it on the electrode 5. The iron 9 lowers to be in contact with the lead wire 1 and the electrode 5 and supplies a wire-like solder 10 to effect soldering.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、ハイブリッドＩＣの製造工程において外部リ
ード線を形成する方法に関するものである０ 従来の技術 図面を参照しながら、従来のリード線形成方法の一例に
ついて説明する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for forming external lead wires in the manufacturing process of a hybrid IC. An example will be explained.

第７図は従来のリード線形成方法の構成を示す図、第８
図はリード線の形成工程を示す図である。FIG. 7 is a diagram showing the configuration of a conventional lead wire forming method, and FIG.
The figure shows the process of forming lead wires.

第７図において、１８は基板、１９は電極、２０は前工
程で供給された半田、２１はリード線材、２２はリード
線、２３は加熱治具である。リード線材２１のリードａ
２２のピッチは基板１８上の電極１９のピッチと同じに
なるようにしている。In FIG. 7, 18 is a substrate, 19 is an electrode, 20 is solder supplied in the previous process, 21 is a lead wire, 22 is a lead wire, and 23 is a heating jig. Lead a of lead wire material 21
The pitch of the electrodes 22 is made to be the same as the pitch of the electrodes 19 on the substrate 18.

以上のように構成されたリード線形成方法について、以
下その動作を説明する。The operation of the lead wire forming method configured as above will be described below.

第８図に示すように、基板１８の電極１９の上にリード
線材２１のリード線２２が来るように位置決めする。リ
ード線２２の上から加熱治具２３を押付け、電極１９と
リード線２２を半田付けする。加熱治具２３をリード線
２２から離し半田付けが終了した後、リード線材２１の
不要部分２４をカットする。As shown in FIG. 8, the lead wire 22 of the lead wire 21 is positioned over the electrode 19 of the substrate 18. A heating jig 23 is pressed onto the lead wire 22 to solder the electrode 19 and the lead wire 22. After the heating jig 23 is separated from the lead wire 22 and soldering is completed, the unnecessary portion 24 of the lead wire 21 is cut.

発明が解決しようとする問題点 しかしながら上記のような構成では、基板の電極の数、
ピッチやリード線の取付方向が異なる品種については専
用のリードを用意しなければならないので、リード線の
金型の費用がかさむ。また、半田付終了後リード線材の
不要部分をカットして捨てるので材料のロスが大きく、
コストが高くなるという問題点を有していた。Problems to be Solved by the Invention However, in the above configuration, the number of electrodes on the substrate,
For products with different pitches and lead wire attachment directions, special leads must be prepared, which increases the cost of lead wire molds. In addition, after soldering is completed, unnecessary parts of the lead wire are cut and discarded, resulting in a large loss of material.
The problem was that the cost was high.

本発明は上記問題点に鑑み、基板の電極の数。In view of the above-mentioned problems, the present invention reduces the number of electrodes on the substrate.

ピッチやリード線の取付方向が変っても対応でき、しか
もリード線材の材料ロスがないリード線形成方法を提供
するものである。To provide a lead wire forming method that can cope with changes in pitch and lead wire attachment direction and does not cause material loss of lead wire materials.

問題点を解決するための手段 上記問題点を解決するために本発明のリード線形成方法
は、線状のリード線材を用い、リード線材と基板上の電
極とを相対的に移動させて位置決めする工程と、リード
線材の切断工程と、電極への移載工程と、半田付手段と
、リード線材の供給工程とを有しさらには、前記各工程
に加え、線材を成形する成形工程を有するもので、それ
ぞれの電極について線状のリード線材を所定長さに切断
し、位置決めし、半田付けするという工程を繰返すとい
う構成を備えたものである。Means for Solving the Problems In order to solve the above problems, the lead wire forming method of the present invention uses a linear lead wire material and positions the lead wire material and the electrode on the substrate by moving them relatively. a step of cutting the lead wire material, a step of transferring the lead wire material to the electrode, a soldering means, a step of supplying the lead wire material, and a forming step of forming the wire material in addition to each of the above steps. The structure is such that the process of cutting a linear lead wire material to a predetermined length, positioning it, and soldering it to each electrode is repeated.

作　　用 本発明は上記の構成により、電極に形成するリード線毎
にピッチ及び取付方向を設定できるので、品種が変って
も対応することができる。しかも、線状のリード線材を
必要な長さに切断し加えて必要に応じて成形して用いる
ので、材料ロスはない。Function: With the above configuration, the present invention can set the pitch and attachment direction for each lead wire formed on the electrode, so it can be adapted to different types of products. Furthermore, since the linear lead wire material is cut to the required length and then shaped and used as necessary, there is no material loss.

実施例 以下本発明の一実施例のリード線形成方法について、図
面を参照しながら説明する。EXAMPLE Hereinafter, a lead wire forming method according to an example of the present invention will be described with reference to the drawings.

第１図は本発明の第１の実施例におけるリード線形成方
法の構成を示す図、第２図はリード線の形成工程を示す
図である。第１図において、１はリード線材、２は線材
送り手段、３はカッタ・チャック、４はカッタ受け、５
は電極、６は基板、７はＸＹテーブル、８は０テーブル
、９はコテ、１０は糸半田である。FIG. 1 is a diagram showing the structure of a lead wire forming method in a first embodiment of the present invention, and FIG. 2 is a diagram showing a lead wire forming process. In Fig. 1, 1 is a lead wire, 2 is a wire feeding means, 3 is a cutter/chuck, 4 is a cutter receiver, and 5 is a wire feeding means.
1 is an electrode, 6 is a substrate, 7 is an XY table, 8 is an 0 table, 9 is a soldering iron, and 10 is a solder wire.

以上のように構成されたリード線形成方法について、以
下第２図を用いてその動作を説明する。The operation of the lead wire forming method configured as above will be described below with reference to FIG. 2.

第２図に示すように、リード線材１の先端がコテ９の真
下に来るまで線材送り手段２により送る。As shown in FIG. 2, the lead wire 1 is fed by the wire feeding means 2 until its tip is directly below the iron 9.

基板６はＸＹテーブル７により移動し、リード線材１の
先端及びコテの真下に電極５を位置決めする。リード線
材１の取付方向が変る場合には、基板６はＸＹテーブル
７で移動するとともに、θテーブル８で回転し取付方向
を設定する。カッタ・チャック３とカッタ受け４がリー
′ド線材１をチャックし、そのまま下降してリード線材
１を所定長さに切断するとともに、電極６上に位置決め
する。The substrate 6 is moved by the XY table 7, and the electrode 5 is positioned at the tip of the lead wire 1 and directly below the soldering iron. When the mounting direction of the lead wire 1 changes, the board 6 is moved by the XY table 7 and rotated by the θ table 8 to set the mounting direction. The cutter/chuck 3 and the cutter receiver 4 chuck the lead wire 1 and then descend to cut the lead wire 1 into a predetermined length and position it on the electrode 6.

リード線材１及び電極５に当接するようにコテ９が下降
し、糸半田１０を供給して半田付けする。The iron 9 is lowered so as to come into contact with the lead wire 1 and the electrode 5, and a thread solder 10 is supplied to perform soldering.

半田付終了後、コテ９が上昇し、カッタ・チャック３及
びカッタ受け４によるリード線材１のチャックを開放す
る。カッタ・チャック３及びカッタ受け４は元の位置ま
で上昇する。以下上記の動作を繰返す。After soldering is completed, the iron 9 is raised to release the chuck of the lead wire 1 by the cutter chuck 3 and the cutter receiver 4. The cutter chuck 3 and cutter receiver 4 rise to their original positions. Repeat the above operation.

以上の動作をフローチャートにより示すと、第３図のよ
うになる。The above operation is shown in a flowchart as shown in FIG.

以上のように本実施例によれば、電極１つずつにつきリ
ード線を形成していくので、品種により電極の数、ピッ
チや取付方向が変っても対応することができ、しかも線
状のリード線材を必要−二長さだけ切断するので材料ロ
スもない。As described above, according to this embodiment, a lead wire is formed for each electrode, so it is possible to accommodate changes in the number of electrodes, pitch, and mounting direction depending on the product. There is no material loss because the wire is cut to the required length.

以下本発明の第２の実施例について図面を参照しながら
説明する。A second embodiment of the present invention will be described below with reference to the drawings.

第４図は本発明の第２の実施例におけるリード線形成方
法の構成を示す断面図である。第６図はリード線の形成
工程を示す断面図である。第４図において第１図の構成
と異なるのは、カッタ・チャック１１及びカッタ受け１
２の先端にそれぞれ互いに対応する段１４及び１６を設
けた点である。FIG. 4 is a sectional view showing the structure of a lead wire forming method in a second embodiment of the present invention. FIG. 6 is a sectional view showing the lead wire forming process. The configuration of FIG. 4 differs from that of FIG. 1 in that the cutter chuck 11 and cutter receiver 1
The point is that steps 14 and 16 corresponding to each other are provided at the tips of the two.

上記のように構成されたリード線形成方法について、以
下その動作を説明する。The operation of the lead wire forming method configured as described above will be described below.

第６図に示すように、カッタ・チャック１１とカッタ受
け１２がリード線材１３をチャックすると、それぞれの
先端に設けた互いに対応する段１４及び１６によりリー
ド線材１３が段付きに成形される。As shown in FIG. 6, when the cutter chuck 11 and the cutter receiver 12 chuck the lead wire 13, the lead wire 13 is formed into a stepped shape by corresponding steps 14 and 16 provided at each tip.

第６図に示すように、基板１６の両面にリード線１７を
形成する場合、リード線１７を段付きに成形することに
より、基板１６が薄い場合でも、リード１ｓ１７同士の
ショートを防ぐことができる０なお、第１の実施例にお
いてリード線材１は１　　　本のみ供給するとしたが、
リード線材１は複数本同時に供給しても良く、複数本同
時に半田付けすると生産能率がさらに上が９、効果はよ
り一層増大する。As shown in FIG. 6, when the lead wires 17 are formed on both sides of the substrate 16, by forming the lead wires 17 in a stepped manner, short circuits between the leads 1s17 can be prevented even if the substrate 16 is thin. 0 In the first embodiment, only one lead wire 1 was supplied, but
A plurality of lead wires 1 may be supplied at the same time, and if a plurality of lead wires 1 are soldered at the same time, the production efficiency is further increased9 and the effect is further increased.

発明の効果 以上のように本発明は、線状のＩＪ−−ド線材を用い、
リード線材と基板上の電極との位置決め手段と、リード
線材の切断手段と、電極への移載手段と、半田付手段と
、リード線材の供給手段とさらに場合によってはリード
線の成形工程とを設けることにより、品種により電極の
ピッチや取付方向が変っても対応することができ、リー
ド線材の材料ロスもなく、また、リード線材の成形手段
を設けることにより、基板の両面にリード線を形成する
場合に、リード線同士のショートを防ぐことができる。Effects of the Invention As described above, the present invention uses a linear IJ-do wire,
A means for positioning the lead wire and the electrode on the substrate, a means for cutting the lead wire, a means for transferring the lead wire to the electrode, a soldering means, a means for supplying the lead wire, and, in some cases, a step for forming the lead wire. By providing this, it is possible to cope with changes in the pitch and mounting direction of the electrodes depending on the product, and there is no loss of lead wire material.In addition, by providing a means for forming the lead wire material, lead wires can be formed on both sides of the board. In this case, short circuits between lead wires can be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の第１の実施例におけるリード線形成方
法の構成を示す図、第２図はリード線の形成工程を示す
図、第３図は同工程のフローチャート図、第４図は本発
明の第２の実施例におけるリード線形成方法と実施する
装置の構成を示す断面図、第６図はリード線の形成工程
の状態を示す断面図、第６図は第２の実施例により形成
されたり〜ド線を示す平面図、第７図は従来のリード線
形成方法の構成を示す図、第８図はリード線の形成工程
の状態を示す図である。 １・・・・・・リード線材、２・・・・・・線材送り手
段、３・・・・・・カッタ・チャック、４・・・・・・
カッタ受け、６・・・・・・電極、６・・・・・・基板
、７・・・・・・ＸＹテーブル、８・・・・・・Ｏテー
ブル、９・・・・・・コテ、１Ｑ・・・・・・糸半田。 代理人の氏名　弁理士　中　尾　敏　男　ぼか１名５−
−・朽グ　トヤク７ ４°−ｓブタ喧１ｒ 菓　１　図　　　　　　　　　　５−１ｆ：礒Ｓ−五薮 ７・−ＸＹｆ−γ４ トー°θ？−７°ル 第３図 第４図 第５図 箔６図FIG. 1 is a diagram showing the structure of the lead wire forming method in the first embodiment of the present invention, FIG. 2 is a diagram showing the lead wire forming process, FIG. 3 is a flowchart of the same process, and FIG. A sectional view showing a lead wire forming method and the configuration of an apparatus for carrying out the method according to the second embodiment of the present invention, FIG. 6 is a sectional view showing the state of the lead wire forming process, and FIG. FIG. 7 is a plan view showing the formed lead wire, FIG. 7 is a diagram showing the configuration of a conventional lead wire forming method, and FIG. 8 is a diagram showing the state of the lead wire forming process. 1... Lead wire, 2... Wire feeding means, 3... Cutter/chuck, 4...
Cutter receiver, 6... Electrode, 6... Substrate, 7... XY table, 8... O table, 9... Soldering iron, 1Q... Thread soldering. Name of agent Patent attorney Toshi Nakao Male 1 person 5-
-・Kuchugu Toyaku 7 4°-s Butaden 1r Ka 1 Figure 5-1f: Iso S-Goyabu 7・-XYf-γ4 To°θ? -7° Figure 3 Figure 4 Figure 5 Foil Figure 6

Claims (6)

【特許請求の範囲】[Claims] （１）線材の供給工程と、線材の先端と電子部品の電極
とを相対的に移動させて位置決めする工程と、線材の切
断工程と、切断した線材の電子部品の電極への移載工程
と、切断した線材と電子部品の電極とを電気的に接合す
る工程とを備え、順次上記の工程を繰返して複数の電極
にリード線を形成するリード線形成方法。(1) A process of supplying the wire, a process of relatively moving and positioning the tip of the wire and the electrode of the electronic component, a process of cutting the wire, and a process of transferring the cut wire to the electrode of the electronic component. A lead wire forming method comprising the steps of electrically joining the cut wire material and the electrodes of an electronic component, and forming lead wires on a plurality of electrodes by sequentially repeating the above steps. （２）供給工程においては複数の線材を同時に供給する
特許請求の範囲第１項記載のリード線形成方法。(2) A lead wire forming method according to claim 1, in which a plurality of wire rods are supplied simultaneously in the supply step. （３）切断した線材と電子部品の電極とを電気的に接合
する工程を半田付けによって行なうことを特徴とする特
許請求の範囲第１項記載のリード線形成方法。(3) The lead wire forming method according to claim 1, wherein the step of electrically joining the cut wire and the electrode of the electronic component is performed by soldering. （４）線材の供給工程と、線材の先端と電子部品の電極
とを相対的に移動させて位置決めする工程と、線材を所
定の形状に成形する成形工程と、線材の切断工程と、成
形し切断した線材の電子部品の電極へ移載する工程と、
切断した線材と電子部品の電極とを電気的に接合する工
程とを備え、順次上記の工程を繰返して複数の電極にリ
ード線を形成するリード線形成方法。(4) A process of supplying the wire, a process of relatively moving and positioning the tip of the wire and the electrode of the electronic component, a forming process of forming the wire into a predetermined shape, a cutting process of the wire, and a process of forming the wire into a predetermined shape. A step of transferring the cut wire to the electrode of the electronic component,
A lead wire forming method comprising a step of electrically joining a cut wire rod and an electrode of an electronic component, and forming lead wires on a plurality of electrodes by sequentially repeating the above steps. （５）成形工程においては線材を段を有する形状に成形
する工程を備えた特許請求の範囲第４項記載のリード線
形成方法。(5) The lead wire forming method according to claim 4, wherein the forming step includes a step of forming the wire into a stepped shape. （６）切断した線材と電子部品の電極とを電気的に接合
する工程を半田付けによって行なう特許請求の範囲第４
項記載のリード線形成方法。(6) Claim 4, in which the step of electrically joining the cut wire and the electrode of the electronic component is performed by soldering.
Lead wire forming method described in section.
JP60054937A 1985-03-19 1985-03-19 Formation of lead wire Pending JPS61214442A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60054937A JPS61214442A (en) 1985-03-19 1985-03-19 Formation of lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60054937A JPS61214442A (en) 1985-03-19 1985-03-19 Formation of lead wire

Publications (1)

Publication Number Publication Date
JPS61214442A true JPS61214442A (en) 1986-09-24

Family

ID=12984545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60054937A Pending JPS61214442A (en) 1985-03-19 1985-03-19 Formation of lead wire

Country Status (1)

Country Link
JP (1) JPS61214442A (en)

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