JPH11186700A - Circuit board and manufacture thereof - Google Patents
Circuit board and manufacture thereofInfo
- Publication number
- JPH11186700A JPH11186700A JP9357804A JP35780497A JPH11186700A JP H11186700 A JPH11186700 A JP H11186700A JP 9357804 A JP9357804 A JP 9357804A JP 35780497 A JP35780497 A JP 35780497A JP H11186700 A JPH11186700 A JP H11186700A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- coil
- circuit board
- forming
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coils Of Transformers For General Uses (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、炊飯器やエアコン
等に用いられるスイッチング電源や、インバータ回路、
オーディオ回路等に用いられているコイルを含む電気回
路を備えた回路基板形成方法及び回路基板に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a switching power supply used for a rice cooker and an air conditioner, an inverter circuit, and the like.
The present invention relates to a circuit board forming method including an electric circuit including a coil used for an audio circuit and the like, and a circuit board.
【0002】[0002]
【従来の技術】従来、コイルを含む電気回路を備えた回
路基板を製造する際には、裏面に導体にて配線パターン
が形成された基板の表面に別途に製造されたコイルを搭
載し、コイルの導線の両端を基板に設けられた一対の実
装用貫通穴に挿入し、基板裏面の配線パーターンや取付
端子に半田にて接合することによりコイルの固定と電気
的導通を図り、回路基板を構成していた。また、コイル
は、環状鉄心にその円周上に沿って細い導線を螺旋状に
巻き付けることによって形成していた。2. Description of the Related Art Conventionally, when manufacturing a circuit board provided with an electric circuit including a coil, a separately manufactured coil is mounted on a surface of a substrate having a wiring pattern formed of conductors on the back surface. The two ends of the conductor wire are inserted into a pair of mounting through holes provided on the board, and soldered to the wiring patterns and mounting terminals on the back side of the board to secure the coil and achieve electrical continuity, forming a circuit board Was. Further, the coil is formed by spirally winding a thin conductive wire around the annular core along the circumference thereof.
【0003】図11、図12に従来のコイルを含む電気
回路を備えた回路基板の一例として平滑回路を備えた回
路基板を示す。図11、図12において、21は回路基
板で、その表面に1つのコイル22と2つのコンデンサ
23が搭載されている。コイル22は環状鉄心24に導
線25を螺旋状に巻回して構成され、導線25の両端が
基板21を貫通して裏面の導体パターン26に半田27
にて接合されている。FIGS. 11 and 12 show a conventional circuit board having a smoothing circuit as an example of a circuit board having an electric circuit including a coil. 11 and 12, reference numeral 21 denotes a circuit board on which one coil 22 and two capacitors 23 are mounted. The coil 22 is formed by spirally winding a conducting wire 25 around an annular core 24, and both ends of the conducting wire 25 penetrate the substrate 21 and are soldered to a conductor pattern 26 on the back surface.
Are joined together.
【0004】コンデンサ23のリード28も同様に基板
21を貫通して裏面の導体パターン26に半田27にて
接合されている。A lead 28 of the capacitor 23 also penetrates the substrate 21 and is joined to a conductor pattern 26 on the back surface by solder 27.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、上記コ
イル22の製造工程においてはコアとなる環状鉄心24
に導線25を螺旋状に巻き付ける工程を巻線機を用いて
行い、また場合によって手作業に依存しているため、コ
イル22の製造に時間を必要とし、環状鉄心24に巻き
付ける導線25の巻き数が増えるほど加工時間を必要と
し、生産性が低いという問題があった。However, in the manufacturing process of the coil 22, the annular core 24 serving as a core is used.
The step of spirally winding the conductive wire 25 is performed by using a winding machine, and depending on the case, depending on the manual operation, time is required for manufacturing the coil 22 and the number of turns of the conductive wire 25 wound around the annular core 24 is required. As the number increases, processing time is required, and there is a problem that productivity is low.
【0006】その生産性の低さはコストに影響し、コイ
ルの加工コストは他の電子部品と比べて大きいものとな
っている。そのため、コイルを用いた回路基板の場合、
コイルを用いない回路基板に比べて部品コストが大きく
なり、回路基板自体のコストを抑えることが困難である
という問題があった。[0006] The low productivity affects the cost, and the processing cost of the coil is higher than other electronic parts. Therefore, in the case of a circuit board using a coil,
There is a problem that component costs are higher than a circuit board that does not use a coil, and it is difficult to reduce the cost of the circuit board itself.
【0007】また、製造工程に手作業を介在させた場
合、要求される特性値が実現されなかったり、形状が歪
である等の品質上の問題を発生する恐れもあった。In addition, when a manual operation is interposed in the manufacturing process, there is a possibility that a required characteristic value is not realized or a quality problem such as a shape distortion occurs.
【0008】本発明は、上記従来の問題点に鑑み、コイ
ルを含む電気回路を備えた回路基板を低コストにて安定
した品質で製造できる回路基板形成方法及び回路基板を
提供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a circuit board forming method and a circuit board capable of manufacturing a circuit board having an electric circuit including a coil at low cost and with stable quality. I have.
【0009】[0009]
【課題を解決するための手段】本発明は、導体とそれを
覆う樹脂によって構成された基板上にコイルを含む電気
回路を形成する回路基板形成方法において、導体に幹部
から複数の枝部が延出された櫛形状部を成形し、鉄心を
枝部上に幹部とほぼ平行に載置し、枝部を鉄心を巻き込
むように成形してその先端を隣接する枝部の根部に接合
し、その後幹部を切り落とすことによりコイルを基板上
に形成するものであり、コイルの製造における導線の巻
付け工程を、導体の打ち抜き、フォーミング、接合の工
程によって置き換えることができ、時間の大幅な短縮が
図れ、コスト低下を図ることができるとともに、自動化
して品質の安定を図ることができる。According to the present invention, there is provided a circuit board forming method for forming an electric circuit including a coil on a substrate formed of a conductor and a resin covering the conductor, wherein a plurality of branches extend from a trunk to the conductor. Formed comb-shaped part, put the iron core on the branch part almost parallel to the trunk, shape the branch part so as to wind the core, join the tip to the root of the adjacent branch part, and then The coil is formed on the substrate by cutting off the trunk, and the winding process of the conductor wire in the manufacture of the coil can be replaced by the punching, forming, and joining processes of the conductor, and the time can be greatly reduced. The cost can be reduced, and the quality can be stabilized by automation.
【0010】また、一体鉄心を用いることにより、コイ
ルの電気的特性及び品質の安定を図ることができる。[0010] Further, by using an integral iron core, the electrical characteristics and quality of the coil can be stabilized.
【0011】また、枝部の先端と根部の接合に際し、他
の実装済み部品と同時に接合すると、コイル製造の1工
程を削減することができ、さらにコスト低下を図ること
ができる。Further, when joining the tip of the branch portion and the root portion together with other mounted components, one step of coil manufacturing can be reduced, and the cost can be further reduced.
【0012】また、導体に一対の長方形部を並列して形
成し、かつこれら長方形部にその両側から交互に切り込
みを入れ、切り込みにより形成された片を交互に上下に
移動させて上下の片間に空間を形成し、切り込みと直角
方向から空間に鉄心を挿入することによりコイルを基板
上に形成すると、複数の鉄心を用いて接合する必要があ
り、一体の鉄心は用いることができないが、導体の接合
箇所を減少することができて信頼性を向上することがで
きる。Further, a pair of rectangular portions are formed in parallel on the conductor, and cuts are alternately formed in the rectangular portions from both sides thereof, and the pieces formed by the cuts are alternately moved up and down to form a gap between the upper and lower pieces. When a coil is formed on a board by forming a space in the space and inserting an iron core into the space from the direction perpendicular to the notch, it is necessary to join using multiple iron cores, and an integral iron core can not be used, but conductors Can be reduced, and the reliability can be improved.
【0013】また、本発明の回路基板は、導体とそれを
覆う樹脂によって構成された基板上にコイルを含む電気
回路を形成した回路基板であって、導体上に配置した鉄
心の周囲にその導体にて形成された螺旋状導体部を巻き
付けて成るコイルを備えたものであり、基板の導体にて
コイルの螺旋状導体部を構成しているので別途にコイル
を製造する必要がなく、コイルを含む回路基板のコスト
低下を図ることができる。A circuit board according to the present invention is a circuit board in which an electric circuit including a coil is formed on a board made of a conductor and a resin covering the conductor, and the conductor is provided around an iron core disposed on the conductor. It is provided with a coil formed by winding the spiral conductor portion formed in the above.Since the spiral conductor portion of the coil is constituted by the conductor of the substrate, there is no need to separately manufacture a coil, and the coil is The cost of a circuit board including the same can be reduced.
【0014】[0014]
【発明の実施の形態】以下、本発明の回路基板形成方法
を、導体の両面を樹脂で覆うように成形した基板上に1
つのコイルと2つのコンデンサから成る平滑回路を形成
して成る回路基板の製造に適用した一実施形態につい
て、図1〜図6を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a circuit board forming method according to the present invention will be described in which one surface of a conductor is covered with a resin.
One embodiment applied to the manufacture of a circuit board formed by forming a smoothing circuit composed of one coil and two capacitors will be described with reference to FIGS.
【0015】まず、基板1の製造工程において、図1、
図4に示すように、基板1は導体2の両面を樹脂3で覆
って形成されているが、コイルやコンデンサの実装箇所
の表面及び裏面の所要範囲は樹脂3を形成しない状態に
成形されている。次に、コイルの実装箇所において表面
側に露出している導体2を、図1に示すように、パンチ
や金型等で、幹部6から鉄心10を巻き込む導体部分と
なる多数の枝部5が延出された一対の櫛形状部4、4に
打ち抜き加工する。これら櫛形状部4は、一方の櫛形状
部4の各枝部5、5間に他方の櫛形状部4の枝部5が入
り込むようにかつ若干傾斜させて形成する。また、枝部
5の先端5aは細く加工し、枝部5の根部5bには後の
工程で先端5aを挿入できるように挿入穴7を形成す
る。First, in the manufacturing process of the substrate 1, FIG.
As shown in FIG. 4, the substrate 1 is formed by covering both surfaces of the conductor 2 with the resin 3. However, the required area of the surface and the back surface of the mounting location of the coil or the capacitor is formed so that the resin 3 is not formed. I have. Next, as shown in FIG. 1, the conductor 2 exposed on the surface side at the coil mounting portion is formed with a large number of branch portions 5 serving as conductor portions for winding the iron core 10 from the trunk portion 6 with a punch, a mold or the like. Punching is performed on the pair of extended comb-shaped portions 4, 4. These comb-shaped portions 4 are formed such that the branches 5 of the other comb-shaped portion 4 enter between the branches 5 of the one comb-shaped portion 4 and are slightly inclined. Further, the tip 5a of the branch 5 is processed to be thin, and an insertion hole 7 is formed in the root 5b of the branch 5 so that the tip 5a can be inserted in a later step.
【0016】次に、図2に示すように、両櫛形状部4、
4の幹部6、6の中間にそれらと平行に鉄心10を載置
し、鉄心10を螺旋状に包み込むように枝部5を加工す
る。Next, as shown in FIG.
An iron core 10 is placed in the middle of the trunks 6 and 6 of 4 in parallel with them, and the branch 5 is processed so as to spirally wrap the iron core 10.
【0017】その際、各枝部5を鉄心10を巻き込むよ
うに成形して先端5aを隣接する他の枝部5の根部5b
の挿入穴7に差し込む。At this time, each branch 5 is formed so as to wind around the iron core 10 and the tip 5a is connected to the root 5b of another adjacent branch 5.
Into the insertion hole 7.
【0018】その後、図3、図4に示すように、櫛形状
部4、4における幹部6の不要部分をパンチや金型等で
打ち抜き、枝部5にて形成されたコイル巻線9が鉄心1
0を螺旋状に巻回している状態にしてコイル11を仕上
げる。Then, as shown in FIGS. 3 and 4, an unnecessary portion of the trunk portion 6 of the comb-shaped portions 4, 4 is punched by a punch, a mold or the like, and the coil winding 9 formed by the branch portion 5 is made of an iron core. 1
Then, the coil 11 is finished in a state where 0 is spirally wound.
【0019】次に、図5、図6に示すように、2つのコ
ンデンサ12をそのリード13を基板1の所定位置に形
成されたコンデンサ挿入穴8に挿入して実装する。但
し、コイル11とコンデンサ12などのその他の部品の
実装手順は特に問わない。最後に、枝部5の先端5aと
根部5bとの接合、及びコンデンサ12のリード13と
導体2との半田14による接合を同時に行う。こうし
て、1つのコイル11と2つのコンデンサ12から成る
平滑回路を形成して成る回路基板が製造される。Next, as shown in FIGS. 5 and 6, two capacitors 12 are mounted by inserting their leads 13 into capacitor insertion holes 8 formed at predetermined positions on the substrate 1. However, the mounting procedure of other components such as the coil 11 and the capacitor 12 is not particularly limited. Finally, the joining of the tip 5a of the branch 5 and the root 5b and the joining of the lead 13 of the capacitor 12 and the conductor 2 with the solder 14 are performed simultaneously. In this way, a circuit board having a smoothing circuit composed of one coil 11 and two capacitors 12 is manufactured.
【0020】次に、本発明の回路基板形成方法の他の実
施形態について、図7〜図10を参照して説明する。な
お、上記実施形態と同一の構成要素については同一参照
番号を付して説明を省略し、相違点のみを説明する。Next, another embodiment of the circuit board forming method of the present invention will be described with reference to FIGS. Note that the same components as those in the above embodiment are denoted by the same reference numerals, description thereof will be omitted, and only different points will be described.
【0021】本実施形態では、コイル実装箇所の導体2
に、図7に示すように、一対の長方形部15を並列して
形成し、かつこれら長方形部15にその両側から交互に
切り込み16を入れる。次に、図8、図10に示すよう
に、切り込み16により形成された片17を折り曲げ加
工して交互に上下に移動させることにより、導体2を鉄
心10の断面形状に対応する空間18を有する螺旋状に
成形する。なお、この工程は説明のために先の工程と分
けたが、導体2に切り込み16を入れる加工と折り曲げ
て螺旋状に成形する工程は金型等にて同時に行うことも
可能である。最後に、図9、図10に示すように、切り
込み16と直角方向から空間18内に一対又はそれ以上
に分割した鉄心10aを挿入し、半田付けや溶接等にて
接合することにより鉄心10を構成する。以上の工程に
よって基板1上にコイル11が形成される。In this embodiment, the conductor 2 at the coil mounting location is
Next, as shown in FIG. 7, a pair of rectangular portions 15 are formed in parallel, and cuts 16 are made in these rectangular portions 15 alternately from both sides thereof. Next, as shown in FIGS. 8 and 10, the conductor 2 has a space 18 corresponding to the cross-sectional shape of the iron core 10 by bending a piece 17 formed by the cut 16 and moving the same alternately up and down. Form into a spiral. Although this step is separated from the previous step for the purpose of explanation, the step of forming the cut 16 in the conductor 2 and the step of bending and spirally forming the conductor 2 can be performed simultaneously with a mold or the like. Finally, as shown in FIGS. 9 and 10, the core 10 a divided into a pair or more is inserted into the space 18 from a direction perpendicular to the cut 16 and joined by soldering or welding. Constitute. The coil 11 is formed on the substrate 1 by the above steps.
【0022】[0022]
【発明の効果】本発明の回路基板形成方法によれば、以
上の説明から明らかなように、導体に幹部から複数の枝
部が延出された櫛形状部を成形し、鉄心を枝部上に幹部
とほぼ平行に載置し、枝部を鉄心を巻き込むように成形
してその先端を隣接する枝部の根部に接合し、その後幹
部を切り落とすことによりコイルを基板上に形成するも
のであり、コイルの製造における導線の巻付け工程を、
導体の打ち抜き、フォーミング、接合の工程によって置
き換えることができ、時間の大幅な短縮が図れ、コスト
低下を図ることができるとともに、自動化して品質の安
定を図ることができる。According to the circuit board forming method of the present invention, as is apparent from the above description, a comb-shaped portion having a plurality of branches extending from a trunk portion is formed on a conductor, and an iron core is placed on the branches. A coil is formed on a substrate by placing the branch approximately parallel to the trunk, forming the branch so as to wind the core, joining the tip to the root of the adjacent branch, and then cutting off the trunk. , The winding process of the conductor in the manufacture of the coil,
It can be replaced by the steps of punching, forming, and joining conductors, so that time can be greatly reduced, cost can be reduced, and quality can be stabilized by automation.
【0023】また、一体鉄心を用いることにより、コイ
ルの電気的特性及び品質の安定を図ることができる。Further, by using an integral core, the electrical characteristics and quality of the coil can be stabilized.
【0024】また、枝部の先端と根部の接合に際し、他
の実装済み部品と同時に接合すると、コイル製造の1工
程を削減することができ、さらにコスト低下を図ること
ができる。Further, when the tip of the branch portion and the root portion are joined together with other mounted components, one step of coil production can be reduced, and the cost can be further reduced.
【0025】また、導体に一対の長方形部を並列して形
成し、かつこれら長方形部にその両側から交互に切り込
みを入れ、切り込みにより形成された片を交互に上下に
移動させて上下の片間に空間を形成し、切り込みと直角
方向から空間に鉄心を挿入することによりコイルを基板
上に形成すると、導体の接合箇所を減少することができ
て信頼性を向上することができる。Also, a pair of rectangular portions are formed on the conductor in parallel, and cuts are made alternately from both sides of these rectangular portions, and the pieces formed by the cuts are alternately moved up and down to form a gap between the upper and lower pieces. When a coil is formed on a substrate by forming a space in the space and inserting an iron core into the space in a direction perpendicular to the notch, the number of joints between conductors can be reduced, and reliability can be improved.
【0026】また、本発明の回路基板は、導体とそれを
覆う樹脂によって構成された基板上にコイルを含む電気
回路を形成した回路基板において、導体上に配置した鉄
心の周囲にその導体にて形成された螺旋状導体部を巻き
付けて成るコイルを備えているので、基板の導体にてコ
イルの螺旋状導体部を構成しているので別途にコイルを
製造する必要がなく、コイルを含む回路基板のコスト低
下を図ることができる。In addition, the circuit board of the present invention is a circuit board in which an electric circuit including a coil is formed on a board composed of a conductor and a resin covering the conductor. Since a coil formed by winding the formed spiral conductor is provided, the coil conductor is constituted by the conductor of the substrate, so that there is no need to separately manufacture a coil, and the circuit board including the coil is not required. Cost can be reduced.
【図1】本発明の回路基板形成方法の一実施形態におい
て、基板の導体に櫛形形状を形成した状態の平面図であ
る。FIG. 1 is a plan view showing a state in which a conductor of a substrate has a comb shape in an embodiment of a circuit board forming method of the present invention.
【図2】同実施形態において、基板上に鉄心を配置して
導体で包み込むように加工した状態の平面図である。FIG. 2 is a plan view showing a state in which an iron core is arranged on a substrate and processed so as to be wrapped by a conductor in the embodiment.
【図3】同実施形態において、不要な導体を切断除去し
た状態の平面図である。FIG. 3 is a plan view showing a state in which unnecessary conductors are cut and removed in the embodiment.
【図4】図3のA−A矢視断面図である。FIG. 4 is a sectional view taken along the line AA of FIG. 3;
【図5】同実施形態において、平滑回路を形成した状態
の平面図である。FIG. 5 is a plan view showing a state where a smoothing circuit is formed in the embodiment.
【図6】図5のB−B矢視断面図である。FIG. 6 is a sectional view taken along the line BB of FIG. 5;
【図7】本発明の回路基板形成方法の他の実施形態にお
いて、基板の導体を所定形状の打ち抜き加工した状態の
平面図である。FIG. 7 is a plan view showing a state in which a conductor of a substrate is punched into a predetermined shape in another embodiment of the circuit board forming method of the present invention.
【図8】同実施形態において、導体を所定形状にフォー
ミングした状態の平面図である。FIG. 8 is a plan view of the same embodiment in a state where a conductor is formed into a predetermined shape.
【図9】同実施形態において、鉄心を挿入・接合してコ
イルを形成した状態の平面図である。FIG. 9 is a plan view showing a state where a coil is formed by inserting and joining an iron core in the embodiment.
【図10】図9のC−C矢視断面図である。FIG. 10 is a sectional view taken along the line CC of FIG. 9;
【図11】従来例における平滑回路を有する回路基板の
平面図である。FIG. 11 is a plan view of a circuit board having a smoothing circuit in a conventional example.
【図12】図11のD−D矢視断面図である。FIG. 12 is a sectional view taken along the line DD in FIG. 11;
1 基板 2 導体 3 樹脂 4 櫛形状部 5 枝部 5a 先端 5b 根部 6 幹部 10 鉄心 11 コイル 15 長方形部 16 切り込み 17 片 18 空間 DESCRIPTION OF SYMBOLS 1 Substrate 2 Conductor 3 Resin 4 Comb part 5 Branch part 5a Tip 5b Root part 6 Trunk part 10 Iron core 11 Coil 15 Rectangular part 16 Notch 17 Piece 18 Space
フロントページの続き (72)発明者 中嶋 雄一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Continued on the front page (72) Inventor Yuichi Nakajima 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (5)
た基板上にコイルを含む電気回路を形成する回路基板形
成方法において、導体に幹部から複数の枝部が延出され
た櫛形状部を成形し、鉄心を枝部上に幹部とほぼ平行に
載置し、枝部を鉄心を巻き込むように成形してその先端
を隣接する枝部の根部に接合し、その後幹部を切り落と
すことによりコイルを基板上に形成することを特徴とす
る回路基板形成方法。1. A circuit board forming method for forming an electric circuit including a coil on a substrate composed of a conductor and a resin covering the conductor, wherein a comb-shaped portion having a plurality of branches extending from a trunk portion is formed on the conductor. Then, the core is placed on the branch almost parallel to the trunk, the branch is formed so as to involve the core, the tip is joined to the root of the adjacent branch, and then the trunk is cut off to mount the coil on the substrate. A method for forming a circuit board, comprising: forming a circuit board on the circuit board;
項1記載の回路基板形成方法。2. The circuit board forming method according to claim 1, wherein the iron core is integrated.
装済み部品と同時に接合することを特徴とする請求項1
記載の回路基板形成方法。3. The joint between the tip of the branch and the root is simultaneously joined with another mounted component.
The method for forming a circuit board according to the above.
る基板上にコイルを含む電気回路を形成する基板形成方
法において、導体に一対の長方形部を並列して成形し、
かつこれら長方形部にその両側から交互に切り込みを入
れ、切り込みにより形成された片を交互に上下に移動さ
せて上下の片間に空間を形成し、切り込みと直角方向か
ら空間に鉄心を挿入することによりコイルを基板上に形
成することを特徴とする回路基板形成方法。4. A substrate forming method for forming an electric circuit including a coil on a substrate constituted by a conductor and a resin covering the conductor, wherein a pair of rectangular portions are formed in parallel on the conductor,
In addition, cuts are made alternately from both sides of these rectangular parts, and the pieces formed by the cuts are alternately moved up and down to form a space between the upper and lower pieces, and an iron core is inserted into the space from a direction perpendicular to the cut. Forming a coil on a substrate by using the method described above.
た基板上にコイルを含む電気回路を形成した回路基板で
あって、導体上に配置した鉄心の周囲にその導体にて形
成された螺旋状の導体を巻き付けて成るコイルを備えた
ことを特徴とする回路基板。5. A circuit board in which an electric circuit including a coil is formed on a board composed of a conductor and a resin covering the conductor, and a spiral formed by the conductor around an iron core disposed on the conductor. A circuit board comprising: a coil formed by winding a conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35780497A JP3996986B2 (en) | 1997-12-25 | 1997-12-25 | Circuit board forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35780497A JP3996986B2 (en) | 1997-12-25 | 1997-12-25 | Circuit board forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11186700A true JPH11186700A (en) | 1999-07-09 |
JP3996986B2 JP3996986B2 (en) | 2007-10-24 |
Family
ID=18456013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP35780497A Expired - Fee Related JP3996986B2 (en) | 1997-12-25 | 1997-12-25 | Circuit board forming method |
Country Status (1)
Country | Link |
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JP (1) | JP3996986B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004335636A (en) * | 2003-05-06 | 2004-11-25 | Sht Corp Ltd | Coil device, coil using therefor, and manufacturing method thereof |
US7233157B2 (en) * | 2004-05-18 | 2007-06-19 | Samsung Electronics Co., Ltd. | Test board for high-frequency system level test |
-
1997
- 1997-12-25 JP JP35780497A patent/JP3996986B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004335636A (en) * | 2003-05-06 | 2004-11-25 | Sht Corp Ltd | Coil device, coil using therefor, and manufacturing method thereof |
JP4538200B2 (en) * | 2003-05-06 | 2010-09-08 | 株式会社エス・エッチ・ティ | Coil component manufacturing method and coil device manufacturing method |
US7233157B2 (en) * | 2004-05-18 | 2007-06-19 | Samsung Electronics Co., Ltd. | Test board for high-frequency system level test |
Also Published As
Publication number | Publication date |
---|---|
JP3996986B2 (en) | 2007-10-24 |
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