JPS5687471A - Coating process - Google Patents
Coating processInfo
- Publication number
- JPS5687471A JPS5687471A JP16440479A JP16440479A JPS5687471A JP S5687471 A JPS5687471 A JP S5687471A JP 16440479 A JP16440479 A JP 16440479A JP 16440479 A JP16440479 A JP 16440479A JP S5687471 A JPS5687471 A JP S5687471A
- Authority
- JP
- Japan
- Prior art keywords
- closed space
- semiconductor substrate
- photosensitive resin
- space zone
- control system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE: To form a uniform coating film and to improve a dimensional accuracy of LSI patterns, by providing a closed space zone on a surface of an article to be coated in a rotation coating process, the closed space zone being maintained at a pressure level near a saturated pressure.
CONSTITUTION: A photosensitive resin is dropped onto a semiconductor substrate 1 which is fixed on a spinner head 3. A closed space zone 21 is formed with a closed space forming plate 11 which is arranged above the semiconductor substrate 1 with a gap 17 by a control system 10. The closed space zone 21 is substantially saturated with a volatile solvent part of the photosensitive resin dropped onto the semiconductor substrate 1, owing to the rotation coating movement by a control system 4. In this state, a photosensitive resin film is generated on the semiconductor substrate 1 by the rotation movement by the control system 4. The obtained photosensitive resin film has an extremely flat surface and suitable for making accurate patterns by exposing and developing.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16440479A JPS5687471A (en) | 1979-12-17 | 1979-12-17 | Coating process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16440479A JPS5687471A (en) | 1979-12-17 | 1979-12-17 | Coating process |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5687471A true JPS5687471A (en) | 1981-07-16 |
JPS621793B2 JPS621793B2 (en) | 1987-01-16 |
Family
ID=15792484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16440479A Granted JPS5687471A (en) | 1979-12-17 | 1979-12-17 | Coating process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5687471A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950525A (en) * | 1982-09-16 | 1984-03-23 | M Setetsuku Kk | Photo resist applying device |
JPS60149131A (en) * | 1984-01-17 | 1985-08-06 | Fujitsu Ltd | Method of applying resist |
JPS60193339A (en) * | 1984-03-14 | 1985-10-01 | Fujitsu Ltd | Method of coating resist film |
JPS6156414A (en) * | 1984-08-28 | 1986-03-22 | Fujitsu Ltd | Spin coating method |
JPS61119341U (en) * | 1985-01-10 | 1986-07-28 | ||
JPS6379635U (en) * | 1986-11-11 | 1988-05-26 | ||
US5001084A (en) * | 1986-11-27 | 1991-03-19 | Mitsubishi Denki Kabushiki Kaisha | Method for applying a treatment liquid on a semiconductor wafer |
JP2004160336A (en) * | 2002-11-12 | 2004-06-10 | Seiko Epson Corp | Film forming apparatus, film forming method, manufacturing method for organic el device and liquid discharge device |
-
1979
- 1979-12-17 JP JP16440479A patent/JPS5687471A/en active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950525A (en) * | 1982-09-16 | 1984-03-23 | M Setetsuku Kk | Photo resist applying device |
JPS60149131A (en) * | 1984-01-17 | 1985-08-06 | Fujitsu Ltd | Method of applying resist |
JPH0463532B2 (en) * | 1984-01-17 | 1992-10-12 | Fujitsu Ltd | |
JPS60193339A (en) * | 1984-03-14 | 1985-10-01 | Fujitsu Ltd | Method of coating resist film |
JPS6156414A (en) * | 1984-08-28 | 1986-03-22 | Fujitsu Ltd | Spin coating method |
JPS61119341U (en) * | 1985-01-10 | 1986-07-28 | ||
JPH0236276Y2 (en) * | 1985-01-10 | 1990-10-03 | ||
JPS6379635U (en) * | 1986-11-11 | 1988-05-26 | ||
US5001084A (en) * | 1986-11-27 | 1991-03-19 | Mitsubishi Denki Kabushiki Kaisha | Method for applying a treatment liquid on a semiconductor wafer |
JP2004160336A (en) * | 2002-11-12 | 2004-06-10 | Seiko Epson Corp | Film forming apparatus, film forming method, manufacturing method for organic el device and liquid discharge device |
Also Published As
Publication number | Publication date |
---|---|
JPS621793B2 (en) | 1987-01-16 |
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