JPS6379635U - - Google Patents

Info

Publication number
JPS6379635U
JPS6379635U JP17383386U JP17383386U JPS6379635U JP S6379635 U JPS6379635 U JP S6379635U JP 17383386 U JP17383386 U JP 17383386U JP 17383386 U JP17383386 U JP 17383386U JP S6379635 U JPS6379635 U JP S6379635U
Authority
JP
Japan
Prior art keywords
photoresist
semiconductor manufacturing
coating
semiconductor wafer
maintaining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17383386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17383386U priority Critical patent/JPS6379635U/ja
Publication of JPS6379635U publication Critical patent/JPS6379635U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案に係る半導体製造装置の一実
施例を示す概略縦断側面図、第2図は第1図の半
導体製造装置によつてフオトレジスト膜を形成し
た半導体ウエーハを示す縦断側面図、第3図は本
考案に係る半導体製造装置の他の実施例を示す概
略側断面図、第4図並びに第5図は夫々、従来の
半導体製造装置を示す概略縦断側面図、第6図乃
至第8図は、上記従来の半導体製造装置における
問題点を説明するための図面である。 W……半導体ウエーハ、F……フオトレジスト
膜、20……チヤンバー。
FIG. 1 is a schematic vertical side view showing an embodiment of a semiconductor manufacturing apparatus according to the present invention, and FIG. 2 is a vertical side view showing a semiconductor wafer on which a photoresist film is formed by the semiconductor manufacturing apparatus shown in FIG. , FIG. 3 is a schematic side sectional view showing another embodiment of the semiconductor manufacturing apparatus according to the present invention, FIGS. 4 and 5 are schematic longitudinal sectional side views showing a conventional semiconductor manufacturing apparatus, and FIGS. FIG. 8 is a diagram for explaining problems in the conventional semiconductor manufacturing apparatus. W...Semiconductor wafer, F...Photoresist film, 20...Chamber.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエーハにフオトレジストを塗布してフ
オトレジスト膜を形成する装置であつて、上記フ
オトレジスト塗布作業領域を、上記フオトレジス
トに含まれる溶剤と同一溶剤の蒸気雰囲気に保つ
た手段を設けたことを特徴とする半導体製造装置
An apparatus for coating a semiconductor wafer with a photoresist to form a photoresist film, comprising means for maintaining the photoresist coating work area in a vapor atmosphere of the same solvent as that contained in the photoresist. Features of semiconductor manufacturing equipment.
JP17383386U 1986-11-11 1986-11-11 Pending JPS6379635U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17383386U JPS6379635U (en) 1986-11-11 1986-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17383386U JPS6379635U (en) 1986-11-11 1986-11-11

Publications (1)

Publication Number Publication Date
JPS6379635U true JPS6379635U (en) 1988-05-26

Family

ID=31111667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17383386U Pending JPS6379635U (en) 1986-11-11 1986-11-11

Country Status (1)

Country Link
JP (1) JPS6379635U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687471A (en) * 1979-12-17 1981-07-16 Matsushita Electric Ind Co Ltd Coating process
JPS6010248A (en) * 1983-06-30 1985-01-19 Fujitsu Ltd Resist coating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687471A (en) * 1979-12-17 1981-07-16 Matsushita Electric Ind Co Ltd Coating process
JPS6010248A (en) * 1983-06-30 1985-01-19 Fujitsu Ltd Resist coating method

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