JPH0480042U - - Google Patents

Info

Publication number
JPH0480042U
JPH0480042U JP12538890U JP12538890U JPH0480042U JP H0480042 U JPH0480042 U JP H0480042U JP 12538890 U JP12538890 U JP 12538890U JP 12538890 U JP12538890 U JP 12538890U JP H0480042 U JPH0480042 U JP H0480042U
Authority
JP
Japan
Prior art keywords
carrier
drying
semiconductor wafer
groove
blowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12538890U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12538890U priority Critical patent/JPH0480042U/ja
Publication of JPH0480042U publication Critical patent/JPH0480042U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Solid Materials (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の第1実施例のブロツク図で
ある。第2図はこの考案の第2実施例の概略図で
ある。 12……ウエーハ直上のノズル、13,14…
…キヤリア溝と平行なノズル、15……ウエーハ
、16……キヤリア、16a……キヤリアの溝、
17……ステージ。
FIG. 1 is a block diagram of a first embodiment of this invention. FIG. 2 is a schematic diagram of a second embodiment of this invention. 12... Nozzle directly above the wafer, 13, 14...
...Nozzle parallel to the carrier groove, 15...Wafer, 16...Carrier, 16a...Carrier groove,
17...Stage.

Claims (1)

【実用新案登録請求の範囲】 1 キヤリアに乗せた半導体ウエーハを不活性ガ
スや乾燥空気のブローにより乾燥する装置におい
て、 キヤリアの溝部に平行にブローするノズルを設
けたことを特徴とする半導体ウエーハの乾燥装置
。 2 溝と垂直方向のキヤリア片端が上下する構造
を持つことを特徴とする半導体ウエーハの乾燥装
置。
[Scope of Claim for Utility Model Registration] 1. A device for drying a semiconductor wafer placed on a carrier by blowing inert gas or dry air, characterized in that a nozzle for blowing parallel to the groove of the carrier is provided. drying equipment. 2. A semiconductor wafer drying device characterized by having a structure in which one end of the carrier in a direction perpendicular to the groove moves up and down.
JP12538890U 1990-11-27 1990-11-27 Pending JPH0480042U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12538890U JPH0480042U (en) 1990-11-27 1990-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12538890U JPH0480042U (en) 1990-11-27 1990-11-27

Publications (1)

Publication Number Publication Date
JPH0480042U true JPH0480042U (en) 1992-07-13

Family

ID=31872988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12538890U Pending JPH0480042U (en) 1990-11-27 1990-11-27

Country Status (1)

Country Link
JP (1) JPH0480042U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142343A (en) * 2010-12-28 2012-07-26 Fujitsu Semiconductor Ltd Cleaning method and cleaning device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142343A (en) * 2010-12-28 2012-07-26 Fujitsu Semiconductor Ltd Cleaning method and cleaning device

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