JPS5685846A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5685846A
JPS5685846A JP16249179A JP16249179A JPS5685846A JP S5685846 A JPS5685846 A JP S5685846A JP 16249179 A JP16249179 A JP 16249179A JP 16249179 A JP16249179 A JP 16249179A JP S5685846 A JPS5685846 A JP S5685846A
Authority
JP
Japan
Prior art keywords
approx
wire
3mum
therefor
polysilicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16249179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216546B2 (enrdf_load_stackoverflow
Inventor
Shuji Tabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16249179A priority Critical patent/JPS5685846A/ja
Publication of JPS5685846A publication Critical patent/JPS5685846A/ja
Publication of JPS6216546B2 publication Critical patent/JPS6216546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
  • Read Only Memory (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
JP16249179A 1979-12-14 1979-12-14 Semiconductor integrated circuit device Granted JPS5685846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16249179A JPS5685846A (en) 1979-12-14 1979-12-14 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16249179A JPS5685846A (en) 1979-12-14 1979-12-14 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5685846A true JPS5685846A (en) 1981-07-13
JPS6216546B2 JPS6216546B2 (enrdf_load_stackoverflow) 1987-04-13

Family

ID=15755620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16249179A Granted JPS5685846A (en) 1979-12-14 1979-12-14 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5685846A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197874A (ja) * 1982-05-14 1983-11-17 Nec Corp 半導体装置およびその製法
US5672905A (en) * 1992-08-26 1997-09-30 At&T Global Information Solutions Company Semiconductor fuse and method
US5759877A (en) * 1992-02-05 1998-06-02 At&T Global Information Solutions Company Semiconductor fuse structure
US5963825A (en) * 1992-08-26 1999-10-05 Hyundai Electronics America Method of fabrication of semiconductor fuse with polysilicon plate
JP2006073947A (ja) * 2004-09-06 2006-03-16 Renesas Technology Corp ヒューズ構造
US7425472B2 (en) 2002-08-23 2008-09-16 Micron Technology, Inc. Semiconductor fuses and semiconductor devices containing the same
JP2010098185A (ja) * 2008-10-17 2010-04-30 Nec Electronics Corp 半導体装置
JP2011216240A (ja) * 2010-03-31 2011-10-27 Oki Semiconductor Co Ltd 電流ヒューズ、半導体装置及び電流ヒューズの切断方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493311A (enrdf_load_stackoverflow) * 1972-05-06 1974-01-12
JPS52149482A (en) * 1976-06-04 1977-12-12 Bosch Gmbh Robert Device for isolating conductive path on ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493311A (enrdf_load_stackoverflow) * 1972-05-06 1974-01-12
JPS52149482A (en) * 1976-06-04 1977-12-12 Bosch Gmbh Robert Device for isolating conductive path on ic

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197874A (ja) * 1982-05-14 1983-11-17 Nec Corp 半導体装置およびその製法
US5759877A (en) * 1992-02-05 1998-06-02 At&T Global Information Solutions Company Semiconductor fuse structure
US5672905A (en) * 1992-08-26 1997-09-30 At&T Global Information Solutions Company Semiconductor fuse and method
US5963825A (en) * 1992-08-26 1999-10-05 Hyundai Electronics America Method of fabrication of semiconductor fuse with polysilicon plate
US7425472B2 (en) 2002-08-23 2008-09-16 Micron Technology, Inc. Semiconductor fuses and semiconductor devices containing the same
JP2006073947A (ja) * 2004-09-06 2006-03-16 Renesas Technology Corp ヒューズ構造
JP2010098185A (ja) * 2008-10-17 2010-04-30 Nec Electronics Corp 半導体装置
US9111934B2 (en) 2008-10-17 2015-08-18 Renesas Electronics Corporation Semiconductor device
JP2011216240A (ja) * 2010-03-31 2011-10-27 Oki Semiconductor Co Ltd 電流ヒューズ、半導体装置及び電流ヒューズの切断方法

Also Published As

Publication number Publication date
JPS6216546B2 (enrdf_load_stackoverflow) 1987-04-13

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