JPS5670657A - Semiconductor memory device - Google Patents
Semiconductor memory deviceInfo
- Publication number
- JPS5670657A JPS5670657A JP14732279A JP14732279A JPS5670657A JP S5670657 A JPS5670657 A JP S5670657A JP 14732279 A JP14732279 A JP 14732279A JP 14732279 A JP14732279 A JP 14732279A JP S5670657 A JPS5670657 A JP S5670657A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- layer
- memory cell
- film
- capacity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Static Random-Access Memory (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To obtain a dynamic memory preventing the occurrence of improper memory cell on account of the microminiaturization and increase in capacity of the memory by using electrostatic capacity due to buried insulating film formed within a semiconductor substrate as a memory cell capacity. CONSTITUTION:A field oxide film 24 is formed on a p type Si substrate 21. Then, nitrogen ion is selectively implanted on an MOS capacitor forming region using a mask, and a buried insulating film 25 is formed. Subsequently, phosphorus is implanted, and an n<+> type layer 26 is formed thereon. Thereafter, a polycrystalline silicon layer 28 is formed on the gate oxide film 27, a gate oxide film 29 and a polycrystalline film 30 are sequentially laminated thereon, holes are opened thereat, and n<+> type drain and bit wire 31 is formed therethrough. Then, an oxide film 32 is accumulated thereon, and a word line 33 is formed. Since the layer 26 is isolated from the layer 25 in this manner, it can eliminate the thermally produced carrier at the p-n junction and software error due to the alpha rays, thereby preventing the occurrence of improper memory cell.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14732279A JPS5670657A (en) | 1979-11-14 | 1979-11-14 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14732279A JPS5670657A (en) | 1979-11-14 | 1979-11-14 | Semiconductor memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5670657A true JPS5670657A (en) | 1981-06-12 |
JPS6322069B2 JPS6322069B2 (en) | 1988-05-10 |
Family
ID=15427554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14732279A Granted JPS5670657A (en) | 1979-11-14 | 1979-11-14 | Semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5670657A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56107571A (en) * | 1980-01-30 | 1981-08-26 | Fujitsu Ltd | Semiconductor memory storage device |
JPS58125863A (en) * | 1981-12-29 | 1983-07-27 | Fujitsu Ltd | Semiconductor device |
US4586789A (en) * | 1982-10-08 | 1986-05-06 | Hitachi, Ltd. | Liquid crystal display unit with particular electrode terminal groupings |
US4903094A (en) * | 1986-08-26 | 1990-02-20 | General Electric Company | Memory cell structure having radiation hardness |
US5264712A (en) * | 1989-03-20 | 1993-11-23 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
US5734188A (en) * | 1987-09-19 | 1998-03-31 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
US5917211A (en) * | 1988-09-19 | 1999-06-29 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5637663A (en) * | 1979-09-05 | 1981-04-11 | Mitsubishi Electric Corp | Capacitor |
-
1979
- 1979-11-14 JP JP14732279A patent/JPS5670657A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5637663A (en) * | 1979-09-05 | 1981-04-11 | Mitsubishi Electric Corp | Capacitor |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56107571A (en) * | 1980-01-30 | 1981-08-26 | Fujitsu Ltd | Semiconductor memory storage device |
JPH0131308B2 (en) * | 1980-01-30 | 1989-06-26 | Fujitsu Ltd | |
JPS58125863A (en) * | 1981-12-29 | 1983-07-27 | Fujitsu Ltd | Semiconductor device |
JPS602780B2 (en) * | 1981-12-29 | 1985-01-23 | 富士通株式会社 | semiconductor equipment |
US4586789A (en) * | 1982-10-08 | 1986-05-06 | Hitachi, Ltd. | Liquid crystal display unit with particular electrode terminal groupings |
US4903094A (en) * | 1986-08-26 | 1990-02-20 | General Electric Company | Memory cell structure having radiation hardness |
US5734188A (en) * | 1987-09-19 | 1998-03-31 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
US5917211A (en) * | 1988-09-19 | 1999-06-29 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
US5264712A (en) * | 1989-03-20 | 1993-11-23 | Hitachi, Ltd. | Semiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6322069B2 (en) | 1988-05-10 |
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