JPS566796A - Silver braze alloy - Google Patents
Silver braze alloyInfo
- Publication number
- JPS566796A JPS566796A JP8179679A JP8179679A JPS566796A JP S566796 A JPS566796 A JP S566796A JP 8179679 A JP8179679 A JP 8179679A JP 8179679 A JP8179679 A JP 8179679A JP S566796 A JPS566796 A JP S566796A
- Authority
- JP
- Japan
- Prior art keywords
- braze
- roughening
- brazing
- decreasing
- kinds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8179679A JPS566796A (en) | 1979-06-28 | 1979-06-28 | Silver braze alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8179679A JPS566796A (en) | 1979-06-28 | 1979-06-28 | Silver braze alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS566796A true JPS566796A (en) | 1981-01-23 |
JPS6236798B2 JPS6236798B2 (ja) | 1987-08-08 |
Family
ID=13756445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8179679A Granted JPS566796A (en) | 1979-06-28 | 1979-06-28 | Silver braze alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS566796A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57147055U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS57147054U (ja) * | 1981-03-10 | 1982-09-16 | ||
CN102029484A (zh) * | 2010-12-15 | 2011-04-27 | 常熟市双华电子有限公司 | 一种用于电子器件封焊的低银电真空钎料 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6858102B1 (en) | 2000-11-15 | 2005-02-22 | Honeywell International Inc. | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets |
CN112605556A (zh) * | 2020-12-22 | 2021-04-06 | 无锡日月合金材料有限公司 | 一种真空器件多级钎焊用钎料及其制备方法 |
-
1979
- 1979-06-28 JP JP8179679A patent/JPS566796A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57147055U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS57147054U (ja) * | 1981-03-10 | 1982-09-16 | ||
JPS6224535Y2 (ja) * | 1981-03-10 | 1987-06-23 | ||
JPS6316535Y2 (ja) * | 1981-03-10 | 1988-05-11 | ||
CN102029484A (zh) * | 2010-12-15 | 2011-04-27 | 常熟市双华电子有限公司 | 一种用于电子器件封焊的低银电真空钎料 |
Also Published As
Publication number | Publication date |
---|---|
JPS6236798B2 (ja) | 1987-08-08 |
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