JPS5666085A - Semiconductor laser element - Google Patents
Semiconductor laser elementInfo
- Publication number
- JPS5666085A JPS5666085A JP14252079A JP14252079A JPS5666085A JP S5666085 A JPS5666085 A JP S5666085A JP 14252079 A JP14252079 A JP 14252079A JP 14252079 A JP14252079 A JP 14252079A JP S5666085 A JPS5666085 A JP S5666085A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- region
- alxga1
- elements
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
- H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To easily perform the chip splitting work for the subject semiconductor laser element by a method wherein, when an ohmic electrode is provided on the surface of the active layer side of the above laser elements, the elements are left only on the laser irradiated section and the other elements are removed in such a manner that they are orthogonally intersecting one another to the (110) direction and a groove penetrating the active layer is provided on the removed section. CONSTITUTION:On the GaAs substrate 1, AlXGa1-XAs layer 2, AlXGa1-YAs active layer 3, AlXGa1-XAs layer 4, and GaAs layer 5 are laminated and grown, and an impurity region 6 which will be penetrated into the layer 4 by a selective diffusion is formed. Then, a mesa etching is performed in such a manner that the circumference of the etching is reaching the surface of the layer 2 and the masa surface is covered by an ohmic metal electrode layer 7. After that, the layer 7 located in the position corresponding to the region 6 is left and the other layer 7 is orthogonally intersected each other to the direction of (110) parallel to a fragmental groove 9 which is orthogonally intersecting with region 6 and a continuous groove 10 parallel to the region 6 are formed on the remaining layer 7. Then, a groove penetrating a layer 3 is formed along the grooves 9 and 10 so that a chip splitting can be performed easily.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14252079A JPS5666085A (en) | 1979-11-02 | 1979-11-02 | Semiconductor laser element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14252079A JPS5666085A (en) | 1979-11-02 | 1979-11-02 | Semiconductor laser element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5666085A true JPS5666085A (en) | 1981-06-04 |
JPS6249998B2 JPS6249998B2 (en) | 1987-10-22 |
Family
ID=15317261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14252079A Granted JPS5666085A (en) | 1979-11-02 | 1979-11-02 | Semiconductor laser element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5666085A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56165735U (en) * | 1980-05-12 | 1981-12-08 | ||
JPS56161685A (en) * | 1980-05-16 | 1981-12-12 | Fujitsu Ltd | Manufacture of semiconductor laser |
JPH0489867U (en) * | 1990-12-14 | 1992-08-05 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52105790A (en) * | 1976-03-01 | 1977-09-05 | Nec Corp | Injection type semiconductor laser element |
-
1979
- 1979-11-02 JP JP14252079A patent/JPS5666085A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52105790A (en) * | 1976-03-01 | 1977-09-05 | Nec Corp | Injection type semiconductor laser element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56165735U (en) * | 1980-05-12 | 1981-12-08 | ||
JPS56161685A (en) * | 1980-05-16 | 1981-12-12 | Fujitsu Ltd | Manufacture of semiconductor laser |
JPH0156552B2 (en) * | 1980-05-16 | 1989-11-30 | Fujitsu Ltd | |
JPH0489867U (en) * | 1990-12-14 | 1992-08-05 |
Also Published As
Publication number | Publication date |
---|---|
JPS6249998B2 (en) | 1987-10-22 |
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