JPS5662342A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5662342A JPS5662342A JP13765979A JP13765979A JPS5662342A JP S5662342 A JPS5662342 A JP S5662342A JP 13765979 A JP13765979 A JP 13765979A JP 13765979 A JP13765979 A JP 13765979A JP S5662342 A JPS5662342 A JP S5662342A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- lead frame
- lower caps
- plated layer
- manner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/457—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/952—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13765979A JPS5662342A (en) | 1979-10-26 | 1979-10-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13765979A JPS5662342A (en) | 1979-10-26 | 1979-10-26 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5662342A true JPS5662342A (en) | 1981-05-28 |
| JPS6222456B2 JPS6222456B2 (enExample) | 1987-05-18 |
Family
ID=15203804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13765979A Granted JPS5662342A (en) | 1979-10-26 | 1979-10-26 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5662342A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62141742A (ja) * | 1985-12-17 | 1987-06-25 | Fujitsu Ltd | 半導体装置のパツケ−ジ |
| US5408126A (en) * | 1993-12-17 | 1995-04-18 | At&T Corp. | Manufacture of semiconductor devices and novel lead frame assembly |
| US7145254B2 (en) * | 2001-07-26 | 2006-12-05 | Denso Corporation | Transfer-molded power device and method for manufacturing transfer-molded power device |
-
1979
- 1979-10-26 JP JP13765979A patent/JPS5662342A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62141742A (ja) * | 1985-12-17 | 1987-06-25 | Fujitsu Ltd | 半導体装置のパツケ−ジ |
| US5408126A (en) * | 1993-12-17 | 1995-04-18 | At&T Corp. | Manufacture of semiconductor devices and novel lead frame assembly |
| US7145254B2 (en) * | 2001-07-26 | 2006-12-05 | Denso Corporation | Transfer-molded power device and method for manufacturing transfer-molded power device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6222456B2 (enExample) | 1987-05-18 |
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