JPS5661139A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5661139A JPS5661139A JP13805579A JP13805579A JPS5661139A JP S5661139 A JPS5661139 A JP S5661139A JP 13805579 A JP13805579 A JP 13805579A JP 13805579 A JP13805579 A JP 13805579A JP S5661139 A JPS5661139 A JP S5661139A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- well
- sio2
- type
- matching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
- H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/859—Complementary IGFETs, e.g. CMOS comprising both N-type and P-type wells, e.g. twin-tub
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13805579A JPS5661139A (en) | 1979-10-25 | 1979-10-25 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13805579A JPS5661139A (en) | 1979-10-25 | 1979-10-25 | Manufacture of semiconductor device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP644889A Division JPH01230247A (ja) | 1989-01-13 | 1989-01-13 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5661139A true JPS5661139A (en) | 1981-05-26 |
JPS6315744B2 JPS6315744B2 (enrdf_load_stackoverflow) | 1988-04-06 |
Family
ID=15212921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13805579A Granted JPS5661139A (en) | 1979-10-25 | 1979-10-25 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5661139A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56118366A (en) * | 1980-02-22 | 1981-09-17 | Hitachi Ltd | Preparation of semiconductor device |
US5019526A (en) * | 1988-09-26 | 1991-05-28 | Nippondenso Co., Ltd. | Method of manufacturing a semiconductor device having a plurality of elements |
US5132241A (en) * | 1991-04-15 | 1992-07-21 | Industrial Technology Research Institute | Method of manufacturing minimum counterdoping in twin well process |
US5219768A (en) * | 1989-05-10 | 1993-06-15 | Oki Electric Industry Co., Ltd. | Method for fabricating a semiconductor device |
US5350491A (en) * | 1992-09-18 | 1994-09-27 | Advanced Micro Devices, Inc. | Oxide removal method for improvement of subsequently grown oxides for a twin-tub CMOS process |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979189A (enrdf_load_stackoverflow) * | 1972-11-01 | 1974-07-31 | ||
JPS51113476A (en) * | 1975-03-31 | 1976-10-06 | Fujitsu Ltd | Semiconductor device manufacturing system |
JPS5292489A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Manufacture of c-mis semiconductor |
JPS52119085A (en) * | 1976-03-10 | 1977-10-06 | Nec Corp | Semiconductor memory element |
JPS5323557A (en) * | 1976-08-18 | 1978-03-04 | Hitachi Ltd | Electronic lens |
JPS5485976U (enrdf_load_stackoverflow) * | 1977-11-30 | 1979-06-18 |
-
1979
- 1979-10-25 JP JP13805579A patent/JPS5661139A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979189A (enrdf_load_stackoverflow) * | 1972-11-01 | 1974-07-31 | ||
JPS51113476A (en) * | 1975-03-31 | 1976-10-06 | Fujitsu Ltd | Semiconductor device manufacturing system |
JPS5292489A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Manufacture of c-mis semiconductor |
JPS52119085A (en) * | 1976-03-10 | 1977-10-06 | Nec Corp | Semiconductor memory element |
JPS5323557A (en) * | 1976-08-18 | 1978-03-04 | Hitachi Ltd | Electronic lens |
JPS5485976U (enrdf_load_stackoverflow) * | 1977-11-30 | 1979-06-18 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56118366A (en) * | 1980-02-22 | 1981-09-17 | Hitachi Ltd | Preparation of semiconductor device |
US5019526A (en) * | 1988-09-26 | 1991-05-28 | Nippondenso Co., Ltd. | Method of manufacturing a semiconductor device having a plurality of elements |
US5219768A (en) * | 1989-05-10 | 1993-06-15 | Oki Electric Industry Co., Ltd. | Method for fabricating a semiconductor device |
US5132241A (en) * | 1991-04-15 | 1992-07-21 | Industrial Technology Research Institute | Method of manufacturing minimum counterdoping in twin well process |
US5350491A (en) * | 1992-09-18 | 1994-09-27 | Advanced Micro Devices, Inc. | Oxide removal method for improvement of subsequently grown oxides for a twin-tub CMOS process |
Also Published As
Publication number | Publication date |
---|---|
JPS6315744B2 (enrdf_load_stackoverflow) | 1988-04-06 |
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