JPS5650520A - Processing method of semiconductor substrate - Google Patents

Processing method of semiconductor substrate

Info

Publication number
JPS5650520A
JPS5650520A JP12668679A JP12668679A JPS5650520A JP S5650520 A JPS5650520 A JP S5650520A JP 12668679 A JP12668679 A JP 12668679A JP 12668679 A JP12668679 A JP 12668679A JP S5650520 A JPS5650520 A JP S5650520A
Authority
JP
Japan
Prior art keywords
substrate
decomposition pressure
ion
gaas
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12668679A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0143454B2 (enrdf_load_stackoverflow
Inventor
Jiro Kasahara
Kenji Morisane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP12668679A priority Critical patent/JPS5650520A/ja
Publication of JPS5650520A publication Critical patent/JPS5650520A/ja
Publication of JPH0143454B2 publication Critical patent/JPH0143454B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
JP12668679A 1979-10-01 1979-10-01 Processing method of semiconductor substrate Granted JPS5650520A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12668679A JPS5650520A (en) 1979-10-01 1979-10-01 Processing method of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12668679A JPS5650520A (en) 1979-10-01 1979-10-01 Processing method of semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5650520A true JPS5650520A (en) 1981-05-07
JPH0143454B2 JPH0143454B2 (enrdf_load_stackoverflow) 1989-09-20

Family

ID=14941337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12668679A Granted JPS5650520A (en) 1979-10-01 1979-10-01 Processing method of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5650520A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130030A (ja) * 1984-07-12 1986-02-12 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 多元素半導体のアニ−ル方法
EP0226311A3 (en) * 1985-11-01 1988-09-21 Gte Laboratories Incorporated Process for annealing iii-v compound semiconductor material
JPS63248127A (ja) * 1987-04-02 1988-10-14 Nec Corp InP基板の熱処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492511A (enrdf_load_stackoverflow) * 1972-04-20 1974-01-10
JPS54162451A (en) * 1978-06-13 1979-12-24 Matsushita Electric Ind Co Ltd Heat treatment method of compound semiconductor and its heat treatment unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492511A (enrdf_load_stackoverflow) * 1972-04-20 1974-01-10
JPS54162451A (en) * 1978-06-13 1979-12-24 Matsushita Electric Ind Co Ltd Heat treatment method of compound semiconductor and its heat treatment unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130030A (ja) * 1984-07-12 1986-02-12 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 多元素半導体のアニ−ル方法
EP0226311A3 (en) * 1985-11-01 1988-09-21 Gte Laboratories Incorporated Process for annealing iii-v compound semiconductor material
JPS63248127A (ja) * 1987-04-02 1988-10-14 Nec Corp InP基板の熱処理方法

Also Published As

Publication number Publication date
JPH0143454B2 (enrdf_load_stackoverflow) 1989-09-20

Similar Documents

Publication Publication Date Title
JPS56160034A (en) Impurity diffusion
JPS5650520A (en) Processing method of semiconductor substrate
JPS5556637A (en) Preparation of semiconductor device
JPS5285476A (en) Semiconductor wafer accommodating jig
JPS5420671A (en) Production of semiconductor devices
JPS5683948A (en) Processing of semiconductor
JPS56112723A (en) Manufacture of compound semiconductor crystal
JPS5643735A (en) Manufacture of semiconductor device
JPS5513930A (en) Manufacturing method for semiconductor device
JPS5375862A (en) Surface stabilization method of semiconductor
JPS54162960A (en) Manufacture of semiconductor device
JPS5393788A (en) Production of semiconductor device
JPS54162451A (en) Heat treatment method of compound semiconductor and its heat treatment unit
JPS5387164A (en) Heat traetment method of compound crystal
JPS5633841A (en) Manufacture of semiconductor device
JPS5593269A (en) Manufacture of semiconductor device
JPS5516488A (en) Semiconductor device and its manufacturing method
JPS52139373A (en) Treating method for compound semiconductor
JPS5728353A (en) Manufacture of semiconductor device
JPS53145583A (en) Semiconductor device and production of the same
JPS6486576A (en) Integrated circuit
JPS5273673A (en) Production of semiconductor device
JPS55151333A (en) Fabricating method of semiconductor device
JPS57160132A (en) Manufacture of semiconductor device
JPS5530806A (en) Heat treatment method of semiconductor wafer