JPS5638839A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5638839A
JPS5638839A JP11445379A JP11445379A JPS5638839A JP S5638839 A JPS5638839 A JP S5638839A JP 11445379 A JP11445379 A JP 11445379A JP 11445379 A JP11445379 A JP 11445379A JP S5638839 A JPS5638839 A JP S5638839A
Authority
JP
Japan
Prior art keywords
oxide film
stepped section
breaking
semiconductor device
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11445379A
Other languages
Japanese (ja)
Inventor
Takeshi Yamada
Motohiro Kitajima
Yoshihiko Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP11445379A priority Critical patent/JPS5638839A/en
Publication of JPS5638839A publication Critical patent/JPS5638839A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the breaking at a stepped section on a conductor layer and to accomplish manufacture of the semiconductor device having an improved degree of integration by a method wherein the stepped section is provided on a field oxide film. CONSTITUTION:A source and drain region 12 is formed by diffusing phosphorus on a P type silicon substrate 11. Then a thick oxide film 13 is formed by performing a heat oxidation or using a CVD method. Next, phosphorus is injected from the surface of the oxide film 13 using an ion injection method and an impurity doped layer 13A is formed. Subsequently, the area excluding the gate region is covered by a resist 14 using a photolithographic technique. Then a dryetching is performed on the oxide film on the gate region of the oxide film 13. At this time, as etching rates vary according to the ion injected impurity, the difference in level at the stepped section is making a gentle slope. As a result, occurrence of a breaking at the stepped section when a conduction layer 16 is formed after formation of a gate oxide film, can be reduced.
JP11445379A 1979-09-06 1979-09-06 Manufacture of semiconductor device Pending JPS5638839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11445379A JPS5638839A (en) 1979-09-06 1979-09-06 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11445379A JPS5638839A (en) 1979-09-06 1979-09-06 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5638839A true JPS5638839A (en) 1981-04-14

Family

ID=14638103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11445379A Pending JPS5638839A (en) 1979-09-06 1979-09-06 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5638839A (en)

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