JPS5635494A - High heat transfer electric insulating substrate - Google Patents

High heat transfer electric insulating substrate

Info

Publication number
JPS5635494A
JPS5635494A JP10966679A JP10966679A JPS5635494A JP S5635494 A JPS5635494 A JP S5635494A JP 10966679 A JP10966679 A JP 10966679A JP 10966679 A JP10966679 A JP 10966679A JP S5635494 A JPS5635494 A JP S5635494A
Authority
JP
Japan
Prior art keywords
heat transfer
insulating substrate
high heat
electric insulating
transfer electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10966679A
Other languages
English (en)
Japanese (ja)
Inventor
Naoaki Ooishi
Toshiaki Sakaida
Hikari Hasegawa
Iwao Hiramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP10966679A priority Critical patent/JPS5635494A/ja
Priority to GB8027613A priority patent/GB2060435B/en
Priority to NL8004908A priority patent/NL8004908A/nl
Priority to FR8019058A priority patent/FR2464540A1/fr
Priority to US06/182,785 priority patent/US4307147A/en
Priority to DE19803032744 priority patent/DE3032744A1/de
Publication of JPS5635494A publication Critical patent/JPS5635494A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H10W40/251—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y10T442/3455—Including particulate material other than fiber

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10966679A 1979-08-30 1979-08-30 High heat transfer electric insulating substrate Pending JPS5635494A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP10966679A JPS5635494A (en) 1979-08-30 1979-08-30 High heat transfer electric insulating substrate
GB8027613A GB2060435B (en) 1979-08-30 1980-08-26 Highly thermal conductive and electrical insulating substrate
NL8004908A NL8004908A (nl) 1979-08-30 1980-08-29 Elektrisch isolerend substraat, tevens geschikt voor het afvoeren van warmte.
FR8019058A FR2464540A1 (fr) 1979-08-30 1980-08-29 Substrat hautement conducteur thermique et isolant electrique
US06/182,785 US4307147A (en) 1979-08-30 1980-08-29 Highly thermal conductive and electrical insulating substrate
DE19803032744 DE3032744A1 (de) 1979-08-30 1980-08-30 Elektrisch isolierende unterlage mit hoher waermeleitfaehigkeit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10966679A JPS5635494A (en) 1979-08-30 1979-08-30 High heat transfer electric insulating substrate

Publications (1)

Publication Number Publication Date
JPS5635494A true JPS5635494A (en) 1981-04-08

Family

ID=14516078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10966679A Pending JPS5635494A (en) 1979-08-30 1979-08-30 High heat transfer electric insulating substrate

Country Status (6)

Country Link
US (1) US4307147A (index.php)
JP (1) JPS5635494A (index.php)
DE (1) DE3032744A1 (index.php)
FR (1) FR2464540A1 (index.php)
GB (1) GB2060435B (index.php)
NL (1) NL8004908A (index.php)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119692A (ja) * 1982-01-08 1983-07-16 東芝ケミカル株式会社 印刷配線板
JPS58216059A (ja) * 1982-06-10 1983-12-15 工業技術院長 体液浄化装置
JPS6171063A (ja) * 1984-06-16 1986-04-11 ビー・ブラウン―エスエスシー・アクチエンゲゼルシャフト 血液中の高分子量種の選択的分離方法
WO1995002313A1 (fr) 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Feuille d'evacuation thermique
JPH0750460A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 金属ベース基板およびそれを用いた電子機器
JPH11106516A (ja) * 1997-09-30 1999-04-20 Ngk Insulators Ltd プラスチック・セラミック複合材
JP2010000774A (ja) * 2008-05-19 2010-01-07 Panasonic Electric Works Co Ltd 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2010254807A (ja) * 2009-04-24 2010-11-11 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JPWO2015056523A1 (ja) * 2013-10-17 2017-03-09 住友ベークライト株式会社 エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置
JP2018106176A (ja) * 2016-03-10 2018-07-05 パナソニックＩｐマネジメント株式会社 波長変換体及び発光装置
JPWO2021200585A1 (index.php) * 2020-04-01 2021-10-07
JP2025108655A (ja) * 2020-04-01 2025-07-23 株式会社レゾナック 半導体用接着剤、並びに、半導体装置及びその製造方法

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463084A (en) * 1982-02-09 1984-07-31 Alps Electric Co., Ltd. Method of fabricating a circuit board and circuit board provided thereby
FI64878C (fi) * 1982-05-10 1984-01-10 Lohja Ab Oy Kombinationsfilm foer isynnerhet tunnfilmelektroluminensstrukturer
US4767674A (en) * 1984-01-27 1988-08-30 Dainichi-Nippon Cables, Ltd. Metal cored board and method for manufacturing same
US4670339A (en) * 1984-06-04 1987-06-02 Advanced Technology Laboratories, Inc. Electrically conductive thin epoxy bond
DE3520945A1 (de) * 1985-06-12 1986-12-18 Anton Piller GmbH & Co KG, 3360 Osterode Traegerelement zur aufnahme elektrischer und/oder elektronischer bauteile und/oder schaltungen
DE3522084A1 (de) * 1985-06-20 1987-01-02 Siemens Ag Elektrisch isolierende, gut waermeleitende kunststoffmasse mit als fuellstoff enthaltenen aluminiumpulverpartikeln sowie ein verfahren zu ihrer herstellung
US4726991A (en) * 1986-07-10 1988-02-23 Eos Technologies Inc. Electrical overstress protection material and process
US5340781A (en) * 1986-07-14 1994-08-23 Showa Denko Kabushiki Kaisha Spherical corundum particles, process for preparation thereof and rubber or plastic composition having high thermal conductivity and having spherical corundum paticles incorporated therein
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US4870121A (en) * 1987-10-26 1989-09-26 Canadian Patents & Development Ltd. Electrical tree suppression in high-voltage polymeric insulation
US5019675A (en) * 1989-09-05 1991-05-28 Xerox Corporation Thick film substrate with highly thermally conductive metal base
DE4012100A1 (de) * 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
EP0511162A1 (de) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
GB2255676B (en) * 1991-05-08 1995-09-27 Fuji Electric Co Ltd Metallic printed board
WO1993024314A1 (en) * 1992-06-01 1993-12-09 Motorola, Inc. Thermally conductive printed circuit board
FR2694839A1 (fr) * 1992-08-14 1994-02-18 Protex Manuf Prod Chimiq Utilisation de corindon brun comme charge thermoconductrice dans des compositions polymères, en particulier des compositions d'enrobage électriquement isolantes.
DE4401608C1 (de) * 1994-01-20 1995-07-27 Siemens Ag Thermisch leitende, elektrisch isolierende Klebeverbindung, Verfahren zu deren Herstellung und deren Verwendung
DE4416403C2 (de) * 1994-05-09 2000-07-13 Schweizer Electronic Ag Kühlvorrichtung für eine Leiterplatte und Verfahren zum Herstellen einer solchen Kühlvorrichtung
DE19528459C2 (de) * 1995-08-03 2001-08-23 Garufo Gmbh Kühlung für ein mit LED's bestücktes Leuchtaggregat
US5691402A (en) * 1996-09-13 1997-11-25 Composite Technology Group, Llc Composite tooling material having vinyl ester resins and fillers
CA2303859A1 (en) * 1997-09-30 1999-04-08 Ngk Insulators, Ltd. Plastic-ceramic composite material
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
US6048919A (en) 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
US6309587B1 (en) 1999-08-13 2001-10-30 Jeffrey L. Gniatczyk Composite molding tools and parts and processes of forming molding tools
US20010049028A1 (en) * 2000-01-11 2001-12-06 Mccullough Kevin A Metal injection molding material with high aspect ratio filler
US6620497B2 (en) 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
US6680015B2 (en) 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
TW504497B (en) * 2000-05-23 2002-10-01 Sumitomo Chemical Co Alpha-alumina powder and heat-conductive sheet containing the same
WO2001096458A1 (de) * 2000-06-16 2001-12-20 Siemens Aktiengesellschaft Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu
US6710109B2 (en) * 2000-07-13 2004-03-23 Cool Options, Inc. A New Hampshire Corp. Thermally conductive and high strength injection moldable composition
DE10065857B4 (de) * 2000-12-22 2005-04-14 Siemens Ag Wärmeübertragungsanordnung für ein Kuststoffgehäuse elektronischer Baugruppen
DE10340705B4 (de) * 2003-09-04 2008-08-07 Fela Hilzinger Gmbh Leiterplattentechnik Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte
DE102005030479B3 (de) * 2005-06-28 2006-11-02 Armin Mang Mit Kunstmarmorschicht versehene Metallplatten und Verfahren zu deren Herstellung
FR2934705B1 (fr) * 2008-07-29 2015-10-02 Univ Toulouse 3 Paul Sabatier Materiau solide composite electriquement conducteur et procede d'obtention d'un tel materiau
KR20150022990A (ko) * 2012-06-08 2015-03-04 히타치가세이가부시끼가이샤 반도체 장치의 제조 방법
DE102014107909B4 (de) 2014-06-05 2024-12-12 Infineon Technologies Ag Leiterplatten und Verfahren zu deren Herstellung
KR102538902B1 (ko) * 2016-02-24 2023-06-01 삼성전기주식회사 전자부품 및 그의 제조방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE632250A (index.php) * 1962-05-21
NL294831A (index.php) * 1962-08-01 1900-01-01
US3427189A (en) * 1965-03-10 1969-02-11 Atomic Energy Commission Radiation resistant insulation
US3511690A (en) * 1967-06-05 1970-05-12 Nat Presto Ind Production of polytetrafluoroethylene-containing coatings on metallic bases
US3808042A (en) * 1970-06-05 1974-04-30 Owens Illinois Inc Multilayer dielectric
GB1321010A (en) * 1971-05-27 1973-06-20 Int Electronic Res Corp Method of manufacturing metal core printed circuit board

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119692A (ja) * 1982-01-08 1983-07-16 東芝ケミカル株式会社 印刷配線板
JPS58216059A (ja) * 1982-06-10 1983-12-15 工業技術院長 体液浄化装置
JPS6171063A (ja) * 1984-06-16 1986-04-11 ビー・ブラウン―エスエスシー・アクチエンゲゼルシャフト 血液中の高分子量種の選択的分離方法
WO1995002313A1 (fr) 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Feuille d'evacuation thermique
JPH0750460A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 金属ベース基板およびそれを用いた電子機器
US5820972A (en) * 1993-08-06 1998-10-13 Mitsubishi Denki Kabushiki Kaisha Metal base board and electronic equipment using the same
US5834101A (en) * 1993-08-06 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Metal base board and electronic equipment using the same
JPH11106516A (ja) * 1997-09-30 1999-04-20 Ngk Insulators Ltd プラスチック・セラミック複合材
JP2010000774A (ja) * 2008-05-19 2010-01-07 Panasonic Electric Works Co Ltd 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JP2010254807A (ja) * 2009-04-24 2010-11-11 Panasonic Electric Works Co Ltd 熱硬化性樹脂組成物、プリプレグ、コンポジット積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
JPWO2015056523A1 (ja) * 2013-10-17 2017-03-09 住友ベークライト株式会社 エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置
JP2018106176A (ja) * 2016-03-10 2018-07-05 パナソニックＩｐマネジメント株式会社 波長変換体及び発光装置
JPWO2021200585A1 (index.php) * 2020-04-01 2021-10-07
WO2021200585A1 (ja) * 2020-04-01 2021-10-07 昭和電工マテリアルズ株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法
JP2025108655A (ja) * 2020-04-01 2025-07-23 株式会社レゾナック 半導体用接着剤、並びに、半導体装置及びその製造方法

Also Published As

Publication number Publication date
GB2060435B (en) 1983-10-26
US4307147A (en) 1981-12-22
NL8004908A (nl) 1981-03-03
GB2060435A (en) 1981-05-07
FR2464540B1 (index.php) 1985-01-04
FR2464540A1 (fr) 1981-03-06
DE3032744A1 (de) 1981-03-19

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