JPS55117260A - Electric insulating heat dissipating board - Google Patents
Electric insulating heat dissipating boardInfo
- Publication number
- JPS55117260A JPS55117260A JP16747879A JP16747879A JPS55117260A JP S55117260 A JPS55117260 A JP S55117260A JP 16747879 A JP16747879 A JP 16747879A JP 16747879 A JP16747879 A JP 16747879A JP S55117260 A JPS55117260 A JP S55117260A
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipating
- insulating heat
- electric insulating
- dissipating board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19782855494 DE2855494A1 (en) | 1978-12-22 | 1978-12-22 | Thermally conducting insulating discs for electronic components - comprise ceramic inserts in plastics insulating plate, extending from surface to surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55117260A true JPS55117260A (en) | 1980-09-09 |
Family
ID=6057999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16747879A Pending JPS55117260A (en) | 1978-12-22 | 1979-12-22 | Electric insulating heat dissipating board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS55117260A (en) |
| DE (1) | DE2855494A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014093342A (en) * | 2012-11-01 | 2014-05-19 | Mitsubishi Electric Corp | Insulation base and semiconductor device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
| FR2525815B1 (en) * | 1982-04-27 | 1985-08-30 | Inf Milit Spatiale Aeronaut | COMPOSITE SUBSTRATE WITH HIGH THERMAL CONDUCTION AND APPLICATION TO SEMICONDUCTOR DEVICE HOUSINGS |
| FR2720215B1 (en) * | 1994-05-20 | 1996-08-02 | Mgb Electronic Sa | Sandwich structure for sound amplifier device. |
| DE19640959A1 (en) * | 1996-10-04 | 1998-04-09 | Bosch Gmbh Robert | Multilayer circuit or sensor substrate of glass-ceramic |
| JP2000503489A (en) * | 1996-11-08 | 2000-03-21 | ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド | Using variable perforation densities formed in copper layers to control the coefficient of thermal expansion |
| JP2000273196A (en) * | 1999-03-24 | 2000-10-03 | Polymatech Co Ltd | Heat-conductive resin substrate and semiconductor package |
-
1978
- 1978-12-22 DE DE19782855494 patent/DE2855494A1/en active Pending
-
1979
- 1979-12-22 JP JP16747879A patent/JPS55117260A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014093342A (en) * | 2012-11-01 | 2014-05-19 | Mitsubishi Electric Corp | Insulation base and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2855494A1 (en) | 1980-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2963365D1 (en) | Heat wave-reflective or electrically conductive laminated structure | |
| JPS5635494A (en) | High heat transfer electric insulating substrate | |
| JPS557428A (en) | Multilayer heat insulator | |
| JPS54138903A (en) | Heat insulating apparatus | |
| JPS55123986A (en) | Heat conductor | |
| GB8314263D0 (en) | Heat insulating device | |
| JPS54109653A (en) | Highhdensity nonnasbestos tvelumolite heat insulator | |
| GB2011837B (en) | Heat insulating member | |
| JPS54100410A (en) | Ceramic heat conductor | |
| ZA794740B (en) | Heat insulating packaging | |
| JPS55117260A (en) | Electric insulating heat dissipating board | |
| GB2034340B (en) | Electrical insulating compositions | |
| JPS5591656A (en) | Heat insulating sheet | |
| JPS56167444A (en) | Thermal conductive electric insulating sheet | |
| JPS56100947A (en) | Heat insulating board | |
| JPS5524074A (en) | Heat insulating instrument | |
| JPS5697040A (en) | Heat insulating board | |
| JPS5565651A (en) | Heat insulator | |
| JPS54110624A (en) | Heat insulating lath board | |
| JPS56154048A (en) | Heat insulating board | |
| JPS56164845A (en) | Heat insulating structure | |
| JPS5560212A (en) | Heat resistant insulating wire | |
| JPS5640541A (en) | Laminated heat insulating board | |
| JPS5565650A (en) | Heat insulator | |
| JPS5574311A (en) | Heat insulating box |