JPS5635446A - Package for semiconductors - Google Patents

Package for semiconductors

Info

Publication number
JPS5635446A
JPS5635446A JP11123379A JP11123379A JPS5635446A JP S5635446 A JPS5635446 A JP S5635446A JP 11123379 A JP11123379 A JP 11123379A JP 11123379 A JP11123379 A JP 11123379A JP S5635446 A JPS5635446 A JP S5635446A
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductors
package
molding
moldings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11123379A
Other languages
English (en)
Other versions
JPS6140136B2 (ja
Inventor
Shinichi Oota
Mitsuyoshi Nakatsuka
Keiji Hazama
Fumio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP11123379A priority Critical patent/JPS5635446A/ja
Publication of JPS5635446A publication Critical patent/JPS5635446A/ja
Publication of JPS6140136B2 publication Critical patent/JPS6140136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11123379A 1979-08-30 1979-08-30 Package for semiconductors Granted JPS5635446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11123379A JPS5635446A (en) 1979-08-30 1979-08-30 Package for semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11123379A JPS5635446A (en) 1979-08-30 1979-08-30 Package for semiconductors

Publications (2)

Publication Number Publication Date
JPS5635446A true JPS5635446A (en) 1981-04-08
JPS6140136B2 JPS6140136B2 (ja) 1986-09-08

Family

ID=14555928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11123379A Granted JPS5635446A (en) 1979-08-30 1979-08-30 Package for semiconductors

Country Status (1)

Country Link
JP (1) JPS5635446A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998805U (ja) * 1982-12-24 1984-07-04 斉藤　政夫 髪型型紙

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4969271A (ja) * 1972-11-09 1974-07-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4969271A (ja) * 1972-11-09 1974-07-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998805U (ja) * 1982-12-24 1984-07-04 斉藤　政夫 髪型型紙

Also Published As

Publication number Publication date
JPS6140136B2 (ja) 1986-09-08

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