JPS6473747A - Formation of plastic package of semiconductor or the like - Google Patents
Formation of plastic package of semiconductor or the likeInfo
- Publication number
- JPS6473747A JPS6473747A JP23144587A JP23144587A JPS6473747A JP S6473747 A JPS6473747 A JP S6473747A JP 23144587 A JP23144587 A JP 23144587A JP 23144587 A JP23144587 A JP 23144587A JP S6473747 A JPS6473747 A JP S6473747A
- Authority
- JP
- Japan
- Prior art keywords
- piece
- lead frame
- semiconductor
- thermal plastic
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent a package of this design from cracking, blistering, and deteriorating in a moisture resistant property by a method wherein a lead frame sandwiched in between a pair of thermal plastic molded parts which have cavities inside is heated and melted into one piece, and then the lead frame is externally wrapped with thermal plastic resin and made to be formed into one piece. CONSTITUTION:A lead frame 3, on which a semiconductor 4 is mounted, sandwiched in between a pair of injection-molded parts 1 and 1' which have a recessed part such as a cavity 6 is heated to be melted and pressed into one piece. Next, its whole outside face is shrouded with a thermal plastic resin and formed into one piece through a transfer molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23144587A JPS6473747A (en) | 1987-09-16 | 1987-09-16 | Formation of plastic package of semiconductor or the like |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23144587A JPS6473747A (en) | 1987-09-16 | 1987-09-16 | Formation of plastic package of semiconductor or the like |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6473747A true JPS6473747A (en) | 1989-03-20 |
Family
ID=16923645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23144587A Pending JPS6473747A (en) | 1987-09-16 | 1987-09-16 | Formation of plastic package of semiconductor or the like |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6473747A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252283A (en) * | 1993-02-24 | 1994-09-09 | Kyocera Corp | Semiconductor device |
-
1987
- 1987-09-16 JP JP23144587A patent/JPS6473747A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06252283A (en) * | 1993-02-24 | 1994-09-09 | Kyocera Corp | Semiconductor device |
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