JPS6473747A - Formation of plastic package of semiconductor or the like - Google Patents

Formation of plastic package of semiconductor or the like

Info

Publication number
JPS6473747A
JPS6473747A JP23144587A JP23144587A JPS6473747A JP S6473747 A JPS6473747 A JP S6473747A JP 23144587 A JP23144587 A JP 23144587A JP 23144587 A JP23144587 A JP 23144587A JP S6473747 A JPS6473747 A JP S6473747A
Authority
JP
Japan
Prior art keywords
piece
lead frame
semiconductor
thermal plastic
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23144587A
Other languages
Japanese (ja)
Inventor
Toshiyuki Arai
Yutaka Yamaguchi
Shinichi Ota
Yasushi Goto
Akishi Nakaso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP23144587A priority Critical patent/JPS6473747A/en
Publication of JPS6473747A publication Critical patent/JPS6473747A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a package of this design from cracking, blistering, and deteriorating in a moisture resistant property by a method wherein a lead frame sandwiched in between a pair of thermal plastic molded parts which have cavities inside is heated and melted into one piece, and then the lead frame is externally wrapped with thermal plastic resin and made to be formed into one piece. CONSTITUTION:A lead frame 3, on which a semiconductor 4 is mounted, sandwiched in between a pair of injection-molded parts 1 and 1' which have a recessed part such as a cavity 6 is heated to be melted and pressed into one piece. Next, its whole outside face is shrouded with a thermal plastic resin and formed into one piece through a transfer molding.
JP23144587A 1987-09-16 1987-09-16 Formation of plastic package of semiconductor or the like Pending JPS6473747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23144587A JPS6473747A (en) 1987-09-16 1987-09-16 Formation of plastic package of semiconductor or the like

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23144587A JPS6473747A (en) 1987-09-16 1987-09-16 Formation of plastic package of semiconductor or the like

Publications (1)

Publication Number Publication Date
JPS6473747A true JPS6473747A (en) 1989-03-20

Family

ID=16923645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23144587A Pending JPS6473747A (en) 1987-09-16 1987-09-16 Formation of plastic package of semiconductor or the like

Country Status (1)

Country Link
JP (1) JPS6473747A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252283A (en) * 1993-02-24 1994-09-09 Kyocera Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252283A (en) * 1993-02-24 1994-09-09 Kyocera Corp Semiconductor device

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