JPS5626437A - Wafer supporting base - Google Patents

Wafer supporting base

Info

Publication number
JPS5626437A
JPS5626437A JP10223779A JP10223779A JPS5626437A JP S5626437 A JPS5626437 A JP S5626437A JP 10223779 A JP10223779 A JP 10223779A JP 10223779 A JP10223779 A JP 10223779A JP S5626437 A JPS5626437 A JP S5626437A
Authority
JP
Japan
Prior art keywords
wafer
blocks
supporting base
temperature
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10223779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130732B2 (cs
Inventor
Seiichi Iwamatsu
Kenichi Asanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP10223779A priority Critical patent/JPS5626437A/ja
Publication of JPS5626437A publication Critical patent/JPS5626437A/ja
Publication of JPS6130732B2 publication Critical patent/JPS6130732B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP10223779A 1979-08-13 1979-08-13 Wafer supporting base Granted JPS5626437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10223779A JPS5626437A (en) 1979-08-13 1979-08-13 Wafer supporting base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10223779A JPS5626437A (en) 1979-08-13 1979-08-13 Wafer supporting base

Publications (2)

Publication Number Publication Date
JPS5626437A true JPS5626437A (en) 1981-03-14
JPS6130732B2 JPS6130732B2 (cs) 1986-07-15

Family

ID=14322022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10223779A Granted JPS5626437A (en) 1979-08-13 1979-08-13 Wafer supporting base

Country Status (1)

Country Link
JP (1) JPS5626437A (cs)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169244A (en) * 1981-04-13 1982-10-18 Canon Inc Temperature controller for mask and wafer
JPS58178536A (ja) * 1982-03-31 1983-10-19 パ−キン−エルマ−・ツエンゾ−ル・アンシュタルト 加工片保持装置
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法
JPS60117667U (ja) * 1984-01-17 1985-08-08 松下電器産業株式会社 クラツチモ−タ
JPH05251544A (ja) * 1992-03-05 1993-09-28 Fujitsu Ltd 搬送装置
US6072157A (en) * 1998-12-11 2000-06-06 Euv Llc Thermophoretic vacuum wand
CN102310262A (zh) * 2011-08-23 2012-01-11 南通富士通微电子股份有限公司 加热块装置
JP2014502784A (ja) * 2010-12-20 2014-02-03 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェハの装着用受け取り手段

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169244A (en) * 1981-04-13 1982-10-18 Canon Inc Temperature controller for mask and wafer
JPS58178536A (ja) * 1982-03-31 1983-10-19 パ−キン−エルマ−・ツエンゾ−ル・アンシュタルト 加工片保持装置
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法
JPS60117667U (ja) * 1984-01-17 1985-08-08 松下電器産業株式会社 クラツチモ−タ
JPH05251544A (ja) * 1992-03-05 1993-09-28 Fujitsu Ltd 搬送装置
US6232578B1 (en) 1998-12-11 2001-05-15 Buv Llc Thermophoretic vacuum wand
US6072157A (en) * 1998-12-11 2000-06-06 Euv Llc Thermophoretic vacuum wand
JP2014502784A (ja) * 2010-12-20 2014-02-03 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェハの装着用受け取り手段
US9312161B2 (en) 2010-12-20 2016-04-12 Ev Group E. Thallner Gmbh Accommodating device for retaining wafers
KR101866622B1 (ko) * 2010-12-20 2018-06-11 에베 그룹 에. 탈너 게엠베하 웨이퍼의 장착을 위한 수용 수단
US10325798B2 (en) 2010-12-20 2019-06-18 Ev Group E. Thallner Gmbh Accommodating device for retaining wafers
US10886156B2 (en) 2010-12-20 2021-01-05 Ev Group E. Thallner Gmbh Accomodating device for retaining wafers
US11355374B2 (en) 2010-12-20 2022-06-07 Ev Group E. Thallner Gmbh Accommodating device for retaining wafers
US11756818B2 (en) 2010-12-20 2023-09-12 Ev Group E. Thallner Gmbh Accommodating device for retaining wafers
CN102310262A (zh) * 2011-08-23 2012-01-11 南通富士通微电子股份有限公司 加热块装置

Also Published As

Publication number Publication date
JPS6130732B2 (cs) 1986-07-15

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