JPS6430226A - Dry etching device - Google Patents

Abstract

PURPOSE:To contrive the equalization of an etching rare by a method wherein a heater located it a place to correspond to a part, in which the etching rate to a sample is slow, among a plurality of heaters is actuated independently and the part is heated. CONSTITUTION:A grounded tabular upper electrode 14 and a tabular lower electrode 15 arranged in opposition to this electrode are provided in an etching chamber 11. The electrode 15 has a protruding part 20 for holding such a sample A as a wafer to be etched at its upper part and moreover, with a circulating path 21 for a cooling water 21a provided in its interior for holding uniformly the temperature of the whole electrode, heaters 22 ranging from several pieces to several hundred pieces are buried uniformly on the circulating path 21 like the squares on a gobang. Variable power sources, 23 are respectively connected to each heater 22 and the heaters are respectively designed in a structure heatable independently. Some heater 22 located at a place to correspond to a part, in which an etching rate to the sample is slow, is actuated by the power source 23 connected to the heater 22 and the part is heated until the etching rate becomes an etching rate equal with that in other regions of the wafer. Thereby, the excellent uniformity of the etching rate can be obtained in the wafer simply and precisely.