JPS56167352A - Pressure-welding type semiconductor device - Google Patents

Pressure-welding type semiconductor device

Info

Publication number
JPS56167352A
JPS56167352A JP7057180A JP7057180A JPS56167352A JP S56167352 A JPS56167352 A JP S56167352A JP 7057180 A JP7057180 A JP 7057180A JP 7057180 A JP7057180 A JP 7057180A JP S56167352 A JPS56167352 A JP S56167352A
Authority
JP
Japan
Prior art keywords
main electrode
main
layer
metal plate
compensating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7057180A
Other languages
English (en)
Other versions
JPS6014507B2 (ja
Inventor
Kazuo Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7057180A priority Critical patent/JPS6014507B2/ja
Publication of JPS56167352A publication Critical patent/JPS56167352A/ja
Publication of JPS6014507B2 publication Critical patent/JPS6014507B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP7057180A 1980-05-26 1980-05-26 加圧接触形半導体装置 Expired JPS6014507B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7057180A JPS6014507B2 (ja) 1980-05-26 1980-05-26 加圧接触形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7057180A JPS6014507B2 (ja) 1980-05-26 1980-05-26 加圧接触形半導体装置

Publications (2)

Publication Number Publication Date
JPS56167352A true JPS56167352A (en) 1981-12-23
JPS6014507B2 JPS6014507B2 (ja) 1985-04-13

Family

ID=13435365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7057180A Expired JPS6014507B2 (ja) 1980-05-26 1980-05-26 加圧接触形半導体装置

Country Status (1)

Country Link
JP (1) JPS6014507B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161625A (ja) * 1984-01-09 1985-08-23 ウエスチングハウス・エレクトリック・コーポレーション 圧接型電力用半導体素子
EP1389802A1 (de) * 2002-08-16 2004-02-18 ABB Schweiz AG Schutzschicht für Leistungshalbleitermodul-Kontaktplättchen

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161625A (ja) * 1984-01-09 1985-08-23 ウエスチングハウス・エレクトリック・コーポレーション 圧接型電力用半導体素子
JPH0247103B2 (ja) * 1984-01-09 1990-10-18 Westinghouse Electric Corp
EP1389802A1 (de) * 2002-08-16 2004-02-18 ABB Schweiz AG Schutzschicht für Leistungshalbleitermodul-Kontaktplättchen
WO2004017406A1 (de) * 2002-08-16 2004-02-26 Abb Schweiz Ag Funktionale beschichtung der scfm preform
CN100394591C (zh) * 2002-08-16 2008-06-11 Abb瑞士有限公司 短路失效模式预制件的功能涂层
KR101017254B1 (ko) * 2002-08-16 2011-02-28 에이비비 슈바이쯔 아게 전력용 반도체 모듈

Also Published As

Publication number Publication date
JPS6014507B2 (ja) 1985-04-13

Similar Documents

Publication Publication Date Title
JP4138215B2 (ja) チップ抵抗器の製造方法
TW344888B (en) Electroplated solder terminal
KR840005600A (ko) 칩 커패시터
GB1447075A (en) Printed circuit boards
KR850005739A (ko) 전기화학 전지
JPS57103370A (en) Amorphous semiconductor solar cell
FR2409660A1 (fr) Substrat de circuit imprime a revetement resistant
JPS56167352A (en) Pressure-welding type semiconductor device
JPS562346Y2 (ja)
US2959718A (en) Rectifier assembly
JPS6486527A (en) Ccb tape carrier
US3476531A (en) Palladium copper contact for soldering
JPS5715447A (en) Production of substrate for carrying components
JPS5784140A (en) Semiconductor device
JP2002057010A (ja) 抵抗器の製造方法および抵抗器
JPS5790963A (en) Manufacture of semiconductor device
JPS5734343A (en) Semiconductor device
JP3043884B2 (ja) 半導体装置の実装方法
JPS5726450A (en) Back surface electrode structure for semiconductor integrated circuit device
JPS56124238A (en) Semiconductor device
JPS5778144A (en) Semiconductor device
JPS56169326A (en) Manufacture of semiconductor device
JPS5618434A (en) Semiconductor device
JPS56101752A (en) Semiconductor device
JPS57109350A (en) Semiconductor device