JPS56150843A - Manufacture of lead frame and semiconductor using lead frame - Google Patents

Manufacture of lead frame and semiconductor using lead frame

Info

Publication number
JPS56150843A
JPS56150843A JP5414480A JP5414480A JPS56150843A JP S56150843 A JPS56150843 A JP S56150843A JP 5414480 A JP5414480 A JP 5414480A JP 5414480 A JP5414480 A JP 5414480A JP S56150843 A JPS56150843 A JP S56150843A
Authority
JP
Japan
Prior art keywords
frame
lead
lead frame
section
tabs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5414480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS634355B2 (enExample
Inventor
Koji Nose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5414480A priority Critical patent/JPS56150843A/ja
Publication of JPS56150843A publication Critical patent/JPS56150843A/ja
Publication of JPS634355B2 publication Critical patent/JPS634355B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5414480A 1980-04-25 1980-04-25 Manufacture of lead frame and semiconductor using lead frame Granted JPS56150843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5414480A JPS56150843A (en) 1980-04-25 1980-04-25 Manufacture of lead frame and semiconductor using lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5414480A JPS56150843A (en) 1980-04-25 1980-04-25 Manufacture of lead frame and semiconductor using lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61276506A Division JPS62162346A (ja) 1986-11-21 1986-11-21 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS56150843A true JPS56150843A (en) 1981-11-21
JPS634355B2 JPS634355B2 (enExample) 1988-01-28

Family

ID=12962358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5414480A Granted JPS56150843A (en) 1980-04-25 1980-04-25 Manufacture of lead frame and semiconductor using lead frame

Country Status (1)

Country Link
JP (1) JPS56150843A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187945A (en) * 1981-05-13 1982-11-18 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS63296228A (ja) * 1982-10-04 1988-12-02 テキサス　インスツルメンツ　インコーポレイテツド 半導体装置を封止するための装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4528100Y1 (enExample) * 1967-09-27 1970-10-29
JPS53106572A (en) * 1977-02-28 1978-09-16 Nec Corp Lead frame for semiconductor device
JPS53163062U (enExample) * 1977-05-27 1978-12-20
JPS55166945A (en) * 1979-06-13 1980-12-26 Nec Corp Lead frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4528100Y1 (enExample) * 1967-09-27 1970-10-29
JPS53106572A (en) * 1977-02-28 1978-09-16 Nec Corp Lead frame for semiconductor device
JPS53163062U (enExample) * 1977-05-27 1978-12-20
JPS55166945A (en) * 1979-06-13 1980-12-26 Nec Corp Lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187945A (en) * 1981-05-13 1982-11-18 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS63296228A (ja) * 1982-10-04 1988-12-02 テキサス　インスツルメンツ　インコーポレイテツド 半導体装置を封止するための装置
JPS63296227A (ja) * 1982-10-04 1988-12-02 テキサス　インスツルメンツ　インコーポレイテツド 半導体装置の製造方法とそれに用いる装置

Also Published As

Publication number Publication date
JPS634355B2 (enExample) 1988-01-28

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