JPS5614499A - Si pellet bonding method - Google Patents

Si pellet bonding method

Info

Publication number
JPS5614499A
JPS5614499A JP8508379A JP8508379A JPS5614499A JP S5614499 A JPS5614499 A JP S5614499A JP 8508379 A JP8508379 A JP 8508379A JP 8508379 A JP8508379 A JP 8508379A JP S5614499 A JPS5614499 A JP S5614499A
Authority
JP
Japan
Prior art keywords
layer
pellet
pellets
eutectic alloy
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8508379A
Other languages
Japanese (ja)
Inventor
Teruyoshi Mihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP8508379A priority Critical patent/JPS5614499A/en
Publication of JPS5614499A publication Critical patent/JPS5614499A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Silicon Compounds (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE: To enable Si pellets to be airtightly bonded to each other with an Au/Si eutectic alloy layer without being blocked by Si oxide by forming a middle layer for preventing the alternate diffusion of Au and Si between one of the pellets and an Au layer.
CONSTITUTION: When Si pellet 1 and Si pellet 6 are bonded to each other with Au/Si eutectic alloy 10, on the surface of one pellet 6 ≥2,000Å thick middle layer 32 of Al, In or the like and ≥2,000Å thick Ni middle layer 33 are formed by sputtering in this order. An SiO2-Ni layer may be used. After forming Au layer 26 on the other pellet 1 by a similar method, pellets 1, 6 are superposed, heated, and press bonded. Ni layer 33 prevents the alternate diffusion of Si and Au in the heating, so Si diffuses in Au layer 26 to form Au/Si eutectic alloy 10, resulting in perfect bonding.
COPYRIGHT: (C)1981,JPO&Japio
JP8508379A 1979-07-06 1979-07-06 Si pellet bonding method Pending JPS5614499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8508379A JPS5614499A (en) 1979-07-06 1979-07-06 Si pellet bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8508379A JPS5614499A (en) 1979-07-06 1979-07-06 Si pellet bonding method

Publications (1)

Publication Number Publication Date
JPS5614499A true JPS5614499A (en) 1981-02-12

Family

ID=13848704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8508379A Pending JPS5614499A (en) 1979-07-06 1979-07-06 Si pellet bonding method

Country Status (1)

Country Link
JP (1) JPS5614499A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0552466A2 (en) * 1992-01-24 1993-07-28 Honda Giken Kogyo Kabushiki Kaisha Method for joining semiconductor substrates
JP2017218360A (en) * 2016-06-10 2017-12-14 日本新工芯技株式会社 Production method of regenerated silicon member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0552466A2 (en) * 1992-01-24 1993-07-28 Honda Giken Kogyo Kabushiki Kaisha Method for joining semiconductor substrates
JP2017218360A (en) * 2016-06-10 2017-12-14 日本新工芯技株式会社 Production method of regenerated silicon member

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