JPS56135996A - Method of chemically and/or electrically selectively depositing metal film and method of producing printed wire - Google Patents

Method of chemically and/or electrically selectively depositing metal film and method of producing printed wire

Info

Publication number
JPS56135996A
JPS56135996A JP2945881A JP2945881A JPS56135996A JP S56135996 A JPS56135996 A JP S56135996A JP 2945881 A JP2945881 A JP 2945881A JP 2945881 A JP2945881 A JP 2945881A JP S56135996 A JPS56135996 A JP S56135996A
Authority
JP
Japan
Prior art keywords
chemically
metal film
depositing metal
selectively depositing
printed wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2945881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257120B2 (en, 2012
Inventor
Haiman Kuruto
Buorufu Yoahimu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPS56135996A publication Critical patent/JPS56135996A/ja
Publication of JPS6257120B2 publication Critical patent/JPS6257120B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2945881A 1980-03-03 1981-03-03 Method of chemically and/or electrically selectively depositing metal film and method of producing printed wire Granted JPS56135996A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803008434 DE3008434A1 (de) 1980-03-03 1980-03-03 Verfahren zur selektiven chemischen und/oder galvanischen abscheidung von metallueberzuegen, insbesondere zur herstellung von gedruckten schaltungen

Publications (2)

Publication Number Publication Date
JPS56135996A true JPS56135996A (en) 1981-10-23
JPS6257120B2 JPS6257120B2 (en, 2012) 1987-11-30

Family

ID=6096345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2945881A Granted JPS56135996A (en) 1980-03-03 1981-03-03 Method of chemically and/or electrically selectively depositing metal film and method of producing printed wire

Country Status (6)

Country Link
JP (1) JPS56135996A (en, 2012)
DE (1) DE3008434A1 (en, 2012)
FR (1) FR2477360B1 (en, 2012)
GB (1) GB2070647B (en, 2012)
IE (1) IE50821B1 (en, 2012)
IT (1) IT1135186B (en, 2012)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186390A (ja) * 1983-04-07 1984-10-23 株式会社サト−セン プリント配線板の製造方法
JPS60165787A (ja) * 1984-01-26 1985-08-28 リーローナル　インコーポレーテッド プリント回路板の製造方法
JPS60176293A (ja) * 1984-02-22 1985-09-10 新神戸電機株式会社 印刷配線板の製造法
JPH0711480A (ja) * 1990-03-16 1995-01-13 Heraeus Noblelight Gmbh 電気メッキ方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840199C2 (de) * 1988-11-29 1994-12-01 Heraeus Noblelight Gmbh Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung
JPH0555069U (ja) * 1991-12-25 1993-07-23 松下電器産業株式会社 回転体の回転速度検出装置
US5354583A (en) * 1992-11-09 1994-10-11 Martin Marietta Energy Systems, Inc. Apparatus and method for selective area deposition of thin films on electrically biased substrates
TW369672B (en) 1997-07-28 1999-09-11 Hitachi Ltd Wiring board and its manufacturing process, and electrolysis-free electroplating method
JP5850353B2 (ja) * 2011-08-18 2016-02-03 アップル インコーポレイテッド 陽極酸化及びめっき表面処理
US9683305B2 (en) 2011-12-20 2017-06-20 Apple Inc. Metal surface and process for treating a metal surface
US10300658B2 (en) * 2012-05-03 2019-05-28 Apple Inc. Crack resistant plastic enclosure structures
DE102019220458A1 (de) * 2019-12-20 2021-06-24 Vitesco Technologies Germany Gmbh Verfahren zur Herstellung einer Leiterplatte und Leiterplatte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB829263A (en) * 1957-02-08 1960-03-02 Sperry Rand Corp Method of making printed circuits
DE1277642B (de) * 1964-01-14 1968-09-12 Bayer Ag Verfahren zum Schutz von metallischen Oberflaechen gegen Metallabscheidung in chemischen Metallisierungsbaedern
US3485665A (en) * 1967-08-22 1969-12-23 Western Electric Co Selective chemical deposition of thin-film interconnections and contacts
DE2920940A1 (de) * 1979-05-21 1980-12-04 Schering Ag Verfahren zur herstellung von gedruckten schaltungen

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186390A (ja) * 1983-04-07 1984-10-23 株式会社サト−セン プリント配線板の製造方法
JPS60165787A (ja) * 1984-01-26 1985-08-28 リーローナル　インコーポレーテッド プリント回路板の製造方法
JPS60176293A (ja) * 1984-02-22 1985-09-10 新神戸電機株式会社 印刷配線板の製造法
JPH0711480A (ja) * 1990-03-16 1995-01-13 Heraeus Noblelight Gmbh 電気メッキ方法

Also Published As

Publication number Publication date
IE50821B1 (en) 1986-07-23
FR2477360B1 (fr) 1985-06-28
DE3008434C2 (en, 2012) 1988-02-25
GB2070647B (en) 1984-02-22
DE3008434A1 (de) 1981-09-17
JPS6257120B2 (en, 2012) 1987-11-30
IT1135186B (it) 1986-08-20
IT8119345A0 (it) 1981-01-27
IE810447L (en) 1981-09-03
FR2477360A1 (fr) 1981-09-04
GB2070647A (en) 1981-09-09

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